DK552386A - Termoplastisk loddemiddel og fremgangsmaade samt apparat til dettes anvendelse - Google Patents
Termoplastisk loddemiddel og fremgangsmaade samt apparat til dettes anvendelseInfo
- Publication number
- DK552386A DK552386A DK552386A DK552386A DK552386A DK 552386 A DK552386 A DK 552386A DK 552386 A DK552386 A DK 552386A DK 552386 A DK552386 A DK 552386A DK 552386 A DK552386 A DK 552386A
- Authority
- DK
- Denmark
- Prior art keywords
- soldering
- components
- bonding material
- temperature
- soldered
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853510000 DE3510000A1 (de) | 1985-03-20 | 1985-03-20 | Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung |
PCT/EP1986/000146 WO1986005428A1 (fr) | 1985-03-20 | 1986-03-14 | Agent thermoplastique, procede et dispositif de brasage |
Publications (2)
Publication Number | Publication Date |
---|---|
DK552386A true DK552386A (da) | 1986-11-19 |
DK552386D0 DK552386D0 (da) | 1986-11-19 |
Family
ID=6265760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK552386A DK552386D0 (da) | 1985-03-20 | 1986-11-19 | Termoplastisk loddemiddel og fremgangsmaade samt apparat til dettes anvendelse |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0219517B1 (fr) |
JP (1) | JPS62502673A (fr) |
AT (1) | ATE45692T1 (fr) |
AU (1) | AU5664686A (fr) |
BR (1) | BR8606737A (fr) |
DE (2) | DE3510000A1 (fr) |
DK (1) | DK552386D0 (fr) |
WO (1) | WO1986005428A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4831724A (en) * | 1987-08-04 | 1989-05-23 | Western Digital Corporation | Apparatus and method for aligning surface mountable electronic components on printed circuit board pads |
JPH0747233B2 (ja) * | 1987-09-14 | 1995-05-24 | 古河電気工業株式会社 | 半田析出用組成物および半田析出方法 |
DE3908097A1 (de) * | 1989-03-13 | 1990-09-20 | Irion & Vosseler | Praegefolie zum aufbringen von leiterbahnen auf feste oder plastische unterlagen |
JPH02259721A (ja) * | 1989-03-31 | 1990-10-22 | Tokyo Electron Ltd | 液晶基板の製造装置 |
DE4033430A1 (de) * | 1990-10-20 | 1992-04-23 | Licentia Gmbh | Verfahren zum herstellen eines lotmittelauftrags |
US5346558A (en) * | 1993-06-28 | 1994-09-13 | W. R. Grace & Co.-Conn. | Solderable anisotropically conductive composition and method of using same |
JP3498427B2 (ja) * | 1995-06-19 | 2004-02-16 | ソニー株式会社 | 成形はんだ用フラックス |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2833030A (en) * | 1952-09-19 | 1958-05-06 | Wall Colmonoy Corp | Method of joining metal parts with flexible composite joining material |
GB1131375A (en) * | 1967-05-12 | 1968-10-23 | Standard Telephones Cables Ltd | Copper brazing paste |
GB1375997A (fr) * | 1970-12-31 | 1974-12-04 | ||
CH569543A5 (fr) * | 1972-07-26 | 1975-11-28 | Castolin Sa | |
US3915729A (en) * | 1974-04-09 | 1975-10-28 | Du Pont | High temperature solder pastes |
ES490073A0 (es) * | 1979-04-06 | 1981-05-16 | Johnson Matthey Co Ltd | Procedimiento para la obtencion de una composicion para sol-dar. |
DE2914621A1 (de) * | 1979-04-11 | 1980-10-23 | Standard Elektrik Lorenz Ag | Verfahren zum loeten von bauelementen in hybridschaltkreise und einrichtung zur durchfuehrung des verfahrens |
FR2476428A1 (fr) * | 1980-02-15 | 1981-08-21 | Tech Electro Cie Indle | Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede |
DE3010610A1 (de) * | 1980-03-20 | 1981-10-01 | Schoeller & Co Elektronik Gmbh, 3552 Wetter | Verfahren zur selektiven verzinnung der loetaugen von gedruckten schaltungen |
-
1985
- 1985-03-20 DE DE19853510000 patent/DE3510000A1/de active Granted
-
1986
- 1986-03-14 AU AU56646/86A patent/AU5664686A/en not_active Abandoned
- 1986-03-14 EP EP86902371A patent/EP0219517B1/fr not_active Expired
- 1986-03-14 AT AT86902371T patent/ATE45692T1/de not_active IP Right Cessation
- 1986-03-14 DE DE8686902371T patent/DE3665141D1/de not_active Expired
- 1986-03-14 BR BR8606737A patent/BR8606737A/pt unknown
- 1986-03-14 WO PCT/EP1986/000146 patent/WO1986005428A1/fr active IP Right Grant
- 1986-03-14 JP JP61502001A patent/JPS62502673A/ja active Pending
- 1986-11-19 DK DK552386A patent/DK552386D0/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
ATE45692T1 (de) | 1989-09-15 |
EP0219517A1 (fr) | 1987-04-29 |
DE3510000C2 (fr) | 1990-02-15 |
JPS62502673A (ja) | 1987-10-15 |
BR8606737A (pt) | 1987-08-11 |
DK552386D0 (da) | 1986-11-19 |
WO1986005428A1 (fr) | 1986-09-25 |
EP0219517B1 (fr) | 1989-08-23 |
DE3510000A1 (de) | 1986-10-02 |
DE3665141D1 (en) | 1989-09-28 |
AU5664686A (en) | 1986-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHB | Application shelved due to non-payment |