DK490186A - PROCEDURE FOR MANUFACTURING PREPREGS AND METAL Cached BASIC MATERIAL FOR PRINTED CIRCUIT CARDS AND DEVICE FOR EXERCISING THE PROCEDURE - Google Patents

PROCEDURE FOR MANUFACTURING PREPREGS AND METAL Cached BASIC MATERIAL FOR PRINTED CIRCUIT CARDS AND DEVICE FOR EXERCISING THE PROCEDURE Download PDF

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Publication number
DK490186A
DK490186A DK490186A DK490186A DK490186A DK 490186 A DK490186 A DK 490186A DK 490186 A DK490186 A DK 490186A DK 490186 A DK490186 A DK 490186A DK 490186 A DK490186 A DK 490186A
Authority
DK
Denmark
Prior art keywords
procedure
exercising
metal
printed circuit
basic material
Prior art date
Application number
DK490186A
Other languages
Danish (da)
Other versions
DK490186D0 (en
Inventor
Lothar Schwarz
Friedel Ueberberg
Rudolf Kuehne
Dieter Fischer
Original Assignee
President Eng Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by President Eng Corp filed Critical President Eng Corp
Publication of DK490186D0 publication Critical patent/DK490186D0/en
Publication of DK490186A publication Critical patent/DK490186A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
    • B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027—Pressing using at least one press band
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
DK490186A 1985-10-15 1986-10-14 PROCEDURE FOR MANUFACTURING PREPREGS AND METAL Cached BASIC MATERIAL FOR PRINTED CIRCUIT CARDS AND DEVICE FOR EXERCISING THE PROCEDURE DK490186A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH443085 1985-10-15

Publications (2)

Publication Number Publication Date
DK490186D0 DK490186D0 (en) 1986-10-14
DK490186A true DK490186A (en) 1987-04-16

Family

ID=4275985

Family Applications (1)

Application Number Title Priority Date Filing Date
DK490186A DK490186A (en) 1985-10-15 1986-10-14 PROCEDURE FOR MANUFACTURING PREPREGS AND METAL Cached BASIC MATERIAL FOR PRINTED CIRCUIT CARDS AND DEVICE FOR EXERCISING THE PROCEDURE

Country Status (15)

Country Link
EP (1) EP0225451A3 (en)
JP (1) JPS62142619A (en)
KR (1) KR870004648A (en)
CN (1) CN86107577A (en)
AU (1) AU6387486A (en)
BR (1) BR8605030A (en)
DD (1) DD250090A5 (en)
DK (1) DK490186A (en)
FI (1) FI864145A (en)
HU (1) HUT44054A (en)
IL (1) IL80277A0 (en)
NO (1) NO864089L (en)
PT (1) PT83551A (en)
YU (1) YU175486A (en)
ZA (1) ZA867746B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01218092A (en) * 1988-02-26 1989-08-31 Toshiba Corp Manufacture of printed wiring board
US5167997A (en) * 1989-05-05 1992-12-01 Gould Inc. Protected conductive foil assemblage and procedure for preparing same using static electrical forces
DE4009182A1 (en) * 1990-03-22 1991-09-26 Bayer Ag LAMINATED AREA
GB9514955D0 (en) * 1995-07-21 1995-09-20 Interconnection Systems Limite Improvements in or relating to printed circuit board manufacture
JP2001138437A (en) * 1999-11-17 2001-05-22 Sumitomo Bakelite Co Ltd Method for manufacturing laminate
ES2219174B1 (en) * 2003-03-27 2006-02-01 Chemplate Materials, S.L. "PROCEDURE FOR THE MANUFACTURE OF PLATES FOR PRINTED CIRCUITS AND MACHINE FOR THE SAME".
DE102008039869B4 (en) * 2008-08-27 2016-11-03 Benteler Sgl Gmbh & Co. Kg Method for producing lightweight components
DE102010008530B4 (en) 2010-02-18 2021-12-09 Siempelkamp Maschinen- Und Anlagenbau Gmbh Plant for the production of conveyor belts with a steel cord insert
CN103963395A (en) * 2013-01-29 2014-08-06 上海杰事杰新材料(集团)股份有限公司 Color continuous fiber/polypropylene composite sheet material and preparation method thereof
JP2016079173A (en) * 2014-10-15 2016-05-16 日本合成化学工業株式会社 New pyridine-based compound, curing agent for anion curable compound therewith, curable composition and hardened material
KR20170126953A (en) * 2015-03-19 2017-11-20 도레이 카부시키가이샤 Method for producing resin impregnated fiber bundle and method for manufacturing winding of resin impregnated fiber bundle

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681171A (en) * 1968-08-23 1972-08-01 Hitachi Ltd Apparatus for producing a multilayer printed circuit plate assembly
US3687894A (en) * 1970-07-23 1972-08-29 William G Collings A composition of a liquid epoxy resin, a polyhydroxyl material and a hardener
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
JPS57196598A (en) * 1981-05-29 1982-12-02 Hitachi Ltd Method of producing multilayer printed board
CA1276358C (en) * 1984-01-31 1990-11-13 Dieter H. Klein Epoxy resin for preparing electric laminates
DE3413434A1 (en) * 1984-04-10 1985-10-17 Dielektra GmbH, 5000 Köln METHOD FOR CONTINUOUSLY PRODUCING COPPER-COATED BASE MATERIAL FOR CIRCUIT BOARDS

Also Published As

Publication number Publication date
YU175486A (en) 1988-06-30
NO864089D0 (en) 1986-10-14
DK490186D0 (en) 1986-10-14
BR8605030A (en) 1987-07-14
ZA867746B (en) 1988-06-29
IL80277A0 (en) 1987-01-30
KR870004648A (en) 1987-05-11
FI864145A (en) 1987-04-16
CN86107577A (en) 1987-04-29
DD250090A5 (en) 1987-09-30
EP0225451A3 (en) 1989-07-19
AU6387486A (en) 1987-04-16
PT83551A (en) 1987-05-29
EP0225451A2 (en) 1987-06-16
HUT44054A (en) 1988-01-28
FI864145A0 (en) 1986-10-14
NO864089L (en) 1987-04-21
JPS62142619A (en) 1987-06-26

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Legal Events

Date Code Title Description
ATS Application withdrawn
AHB Application shelved due to non-payment