NO864089D0 - PROCEDURE AND DEVICE FOR MANUFACTURING OF METAL COATED BASIC MATERIAL FOR LEADERS. - Google Patents

PROCEDURE AND DEVICE FOR MANUFACTURING OF METAL COATED BASIC MATERIAL FOR LEADERS.

Info

Publication number
NO864089D0
NO864089D0 NO864089A NO864089A NO864089D0 NO 864089 D0 NO864089 D0 NO 864089D0 NO 864089 A NO864089 A NO 864089A NO 864089 A NO864089 A NO 864089A NO 864089 D0 NO864089 D0 NO 864089D0
Authority
NO
Norway
Prior art keywords
leaders
procedure
manufacturing
basic material
metal coated
Prior art date
Application number
NO864089A
Other languages
Norwegian (no)
Other versions
NO864089L (en
Inventor
Lothar Schwarz
Friedel Ueberberg
Rudolf Kuehne
Dieter Fischer
Original Assignee
President Eng Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by President Eng Corp filed Critical President Eng Corp
Publication of NO864089D0 publication Critical patent/NO864089D0/en
Publication of NO864089L publication Critical patent/NO864089L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
    • B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027—Pressing using at least one press band
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Reinforced Plastic Materials (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
NO864089A 1985-10-15 1986-10-14 PROCEDURE AND DEVICE FOR MANUFACTURING OF METAL COATED BASIC MATERIAL FOR LEADERS. NO864089L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH443085 1985-10-15

Publications (2)

Publication Number Publication Date
NO864089D0 true NO864089D0 (en) 1986-10-14
NO864089L NO864089L (en) 1987-04-21

Family

ID=4275985

Family Applications (1)

Application Number Title Priority Date Filing Date
NO864089A NO864089L (en) 1985-10-15 1986-10-14 PROCEDURE AND DEVICE FOR MANUFACTURING OF METAL COATED BASIC MATERIAL FOR LEADERS.

Country Status (15)

Country Link
EP (1) EP0225451A3 (en)
JP (1) JPS62142619A (en)
KR (1) KR870004648A (en)
CN (1) CN86107577A (en)
AU (1) AU6387486A (en)
BR (1) BR8605030A (en)
DD (1) DD250090A5 (en)
DK (1) DK490186A (en)
FI (1) FI864145A (en)
HU (1) HUT44054A (en)
IL (1) IL80277A0 (en)
NO (1) NO864089L (en)
PT (1) PT83551A (en)
YU (1) YU175486A (en)
ZA (1) ZA867746B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01218092A (en) * 1988-02-26 1989-08-31 Toshiba Corp Manufacture of printed wiring board
US5167997A (en) * 1989-05-05 1992-12-01 Gould Inc. Protected conductive foil assemblage and procedure for preparing same using static electrical forces
DE4009182A1 (en) * 1990-03-22 1991-09-26 Bayer Ag LAMINATED AREA
GB9514955D0 (en) * 1995-07-21 1995-09-20 Interconnection Systems Limite Improvements in or relating to printed circuit board manufacture
JP2001138437A (en) * 1999-11-17 2001-05-22 Sumitomo Bakelite Co Ltd Method for manufacturing laminate
ES2219174B1 (en) * 2003-03-27 2006-02-01 Chemplate Materials, S.L. "PROCEDURE FOR THE MANUFACTURE OF PLATES FOR PRINTED CIRCUITS AND MACHINE FOR THE SAME".
DE102008039869B4 (en) * 2008-08-27 2016-11-03 Benteler Sgl Gmbh & Co. Kg Method for producing lightweight components
DE102010008530B4 (en) 2010-02-18 2021-12-09 Siempelkamp Maschinen- Und Anlagenbau Gmbh Plant for the production of conveyor belts with a steel cord insert
CN103963395A (en) * 2013-01-29 2014-08-06 上海杰事杰新材料(集团)股份有限公司 Color continuous fiber/polypropylene composite sheet material and preparation method thereof
JP2016079173A (en) * 2014-10-15 2016-05-16 日本合成化学工業株式会社 New pyridine-based compound, curing agent for anion curable compound therewith, curable composition and hardened material
EP3272791A4 (en) * 2015-03-19 2018-11-14 Toray Industries, Inc. Process for producing resin-impregnated fiber bundle and process for producing roll of resin-impregnated fiber bundle

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681171A (en) * 1968-08-23 1972-08-01 Hitachi Ltd Apparatus for producing a multilayer printed circuit plate assembly
US3687894A (en) * 1970-07-23 1972-08-29 William G Collings A composition of a liquid epoxy resin, a polyhydroxyl material and a hardener
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
JPS57196598A (en) * 1981-05-29 1982-12-02 Hitachi Ltd Method of producing multilayer printed board
CA1276358C (en) * 1984-01-31 1990-11-13 Dieter H. Klein Epoxy resin for preparing electric laminates
DE3413434A1 (en) * 1984-04-10 1985-10-17 Dielektra GmbH, 5000 Köln METHOD FOR CONTINUOUSLY PRODUCING COPPER-COATED BASE MATERIAL FOR CIRCUIT BOARDS

Also Published As

Publication number Publication date
EP0225451A3 (en) 1989-07-19
IL80277A0 (en) 1987-01-30
YU175486A (en) 1988-06-30
DK490186A (en) 1987-04-16
DK490186D0 (en) 1986-10-14
PT83551A (en) 1987-05-29
DD250090A5 (en) 1987-09-30
FI864145A0 (en) 1986-10-14
JPS62142619A (en) 1987-06-26
AU6387486A (en) 1987-04-16
CN86107577A (en) 1987-04-29
NO864089L (en) 1987-04-21
KR870004648A (en) 1987-05-11
ZA867746B (en) 1988-06-29
EP0225451A2 (en) 1987-06-16
HUT44054A (en) 1988-01-28
BR8605030A (en) 1987-07-14
FI864145A (en) 1987-04-16

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