NO864089D0 - PROCEDURE AND DEVICE FOR MANUFACTURING OF METAL COATED BASIC MATERIAL FOR LEADERS. - Google Patents
PROCEDURE AND DEVICE FOR MANUFACTURING OF METAL COATED BASIC MATERIAL FOR LEADERS.Info
- Publication number
- NO864089D0 NO864089D0 NO864089A NO864089A NO864089D0 NO 864089 D0 NO864089 D0 NO 864089D0 NO 864089 A NO864089 A NO 864089A NO 864089 A NO864089 A NO 864089A NO 864089 D0 NO864089 D0 NO 864089D0
- Authority
- NO
- Norway
- Prior art keywords
- leaders
- procedure
- manufacturing
- basic material
- metal coated
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
- B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1027—Pressing using at least one press band
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Reinforced Plastic Materials (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH443085 | 1985-10-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
NO864089D0 true NO864089D0 (en) | 1986-10-14 |
NO864089L NO864089L (en) | 1987-04-21 |
Family
ID=4275985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO864089A NO864089L (en) | 1985-10-15 | 1986-10-14 | PROCEDURE AND DEVICE FOR MANUFACTURING OF METAL COATED BASIC MATERIAL FOR LEADERS. |
Country Status (15)
Country | Link |
---|---|
EP (1) | EP0225451A3 (en) |
JP (1) | JPS62142619A (en) |
KR (1) | KR870004648A (en) |
CN (1) | CN86107577A (en) |
AU (1) | AU6387486A (en) |
BR (1) | BR8605030A (en) |
DD (1) | DD250090A5 (en) |
DK (1) | DK490186A (en) |
FI (1) | FI864145A (en) |
HU (1) | HUT44054A (en) |
IL (1) | IL80277A0 (en) |
NO (1) | NO864089L (en) |
PT (1) | PT83551A (en) |
YU (1) | YU175486A (en) |
ZA (1) | ZA867746B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01218092A (en) * | 1988-02-26 | 1989-08-31 | Toshiba Corp | Manufacture of printed wiring board |
US5167997A (en) * | 1989-05-05 | 1992-12-01 | Gould Inc. | Protected conductive foil assemblage and procedure for preparing same using static electrical forces |
DE4009182A1 (en) * | 1990-03-22 | 1991-09-26 | Bayer Ag | LAMINATED AREA |
GB9514955D0 (en) * | 1995-07-21 | 1995-09-20 | Interconnection Systems Limite | Improvements in or relating to printed circuit board manufacture |
JP2001138437A (en) * | 1999-11-17 | 2001-05-22 | Sumitomo Bakelite Co Ltd | Method for manufacturing laminate |
ES2219174B1 (en) * | 2003-03-27 | 2006-02-01 | Chemplate Materials, S.L. | "PROCEDURE FOR THE MANUFACTURE OF PLATES FOR PRINTED CIRCUITS AND MACHINE FOR THE SAME". |
DE102008039869B4 (en) * | 2008-08-27 | 2016-11-03 | Benteler Sgl Gmbh & Co. Kg | Method for producing lightweight components |
DE102010008530B4 (en) | 2010-02-18 | 2021-12-09 | Siempelkamp Maschinen- Und Anlagenbau Gmbh | Plant for the production of conveyor belts with a steel cord insert |
CN103963395A (en) * | 2013-01-29 | 2014-08-06 | 上海杰事杰新材料(集团)股份有限公司 | Color continuous fiber/polypropylene composite sheet material and preparation method thereof |
JP2016079173A (en) * | 2014-10-15 | 2016-05-16 | 日本合成化学工業株式会社 | New pyridine-based compound, curing agent for anion curable compound therewith, curable composition and hardened material |
EP3272791A4 (en) * | 2015-03-19 | 2018-11-14 | Toray Industries, Inc. | Process for producing resin-impregnated fiber bundle and process for producing roll of resin-impregnated fiber bundle |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3681171A (en) * | 1968-08-23 | 1972-08-01 | Hitachi Ltd | Apparatus for producing a multilayer printed circuit plate assembly |
US3687894A (en) * | 1970-07-23 | 1972-08-29 | William G Collings | A composition of a liquid epoxy resin, a polyhydroxyl material and a hardener |
US3969177A (en) * | 1974-06-24 | 1976-07-13 | International Business Machines Corporation | Laminating method |
JPS57196598A (en) * | 1981-05-29 | 1982-12-02 | Hitachi Ltd | Method of producing multilayer printed board |
CA1276358C (en) * | 1984-01-31 | 1990-11-13 | Dieter H. Klein | Epoxy resin for preparing electric laminates |
DE3413434A1 (en) * | 1984-04-10 | 1985-10-17 | Dielektra GmbH, 5000 Köln | METHOD FOR CONTINUOUSLY PRODUCING COPPER-COATED BASE MATERIAL FOR CIRCUIT BOARDS |
-
1986
- 1986-10-10 IL IL80277A patent/IL80277A0/en unknown
- 1986-10-13 DD DD86295230A patent/DD250090A5/en unknown
- 1986-10-13 ZA ZA867746A patent/ZA867746B/en unknown
- 1986-10-14 FI FI864145A patent/FI864145A/en not_active Application Discontinuation
- 1986-10-14 EP EP86114230A patent/EP0225451A3/en not_active Withdrawn
- 1986-10-14 AU AU63874/86A patent/AU6387486A/en not_active Abandoned
- 1986-10-14 NO NO864089A patent/NO864089L/en unknown
- 1986-10-14 DK DK490186A patent/DK490186A/en not_active Application Discontinuation
- 1986-10-14 BR BR8605030A patent/BR8605030A/en unknown
- 1986-10-14 YU YU01754/86A patent/YU175486A/en unknown
- 1986-10-15 JP JP61243282A patent/JPS62142619A/en active Pending
- 1986-10-15 KR KR1019860008694A patent/KR870004648A/en not_active Application Discontinuation
- 1986-10-15 CN CN198686107577A patent/CN86107577A/en active Pending
- 1986-10-15 PT PT83551A patent/PT83551A/en not_active Application Discontinuation
- 1986-10-15 HU HU864295A patent/HUT44054A/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP0225451A3 (en) | 1989-07-19 |
IL80277A0 (en) | 1987-01-30 |
YU175486A (en) | 1988-06-30 |
DK490186A (en) | 1987-04-16 |
DK490186D0 (en) | 1986-10-14 |
PT83551A (en) | 1987-05-29 |
DD250090A5 (en) | 1987-09-30 |
FI864145A0 (en) | 1986-10-14 |
JPS62142619A (en) | 1987-06-26 |
AU6387486A (en) | 1987-04-16 |
CN86107577A (en) | 1987-04-29 |
NO864089L (en) | 1987-04-21 |
KR870004648A (en) | 1987-05-11 |
ZA867746B (en) | 1988-06-29 |
EP0225451A2 (en) | 1987-06-16 |
HUT44054A (en) | 1988-01-28 |
BR8605030A (en) | 1987-07-14 |
FI864145A (en) | 1987-04-16 |
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