DK3806596T3 - Køling af et datacenter - Google Patents

Køling af et datacenter Download PDF

Info

Publication number
DK3806596T3
DK3806596T3 DK20210609.2T DK20210609T DK3806596T3 DK 3806596 T3 DK3806596 T3 DK 3806596T3 DK 20210609 T DK20210609 T DK 20210609T DK 3806596 T3 DK3806596 T3 DK 3806596T3
Authority
DK
Denmark
Prior art keywords
cooling
data center
center
data
Prior art date
Application number
DK20210609.2T
Other languages
English (en)
Inventor
Jayson Michael Jochim
Angela Chen
Soheil Farshchian
Winnie Leung
Michael Chi Kin Lau
Original Assignee
Google Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Google Llc filed Critical Google Llc
Application granted granted Critical
Publication of DK3806596T3 publication Critical patent/DK3806596T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
DK20210609.2T 2017-04-05 2018-02-09 Køling af et datacenter DK3806596T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/479,740 US10123461B2 (en) 2017-04-05 2017-04-05 Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly
EP18706167.6A EP3563651B1 (en) 2017-04-05 2018-02-09 Cooling a data center

Publications (1)

Publication Number Publication Date
DK3806596T3 true DK3806596T3 (da) 2023-07-24

Family

ID=61244836

Family Applications (2)

Application Number Title Priority Date Filing Date
DK18706167.6T DK3563651T3 (da) 2017-04-05 2018-02-09 Køling af et datacenter
DK20210609.2T DK3806596T3 (da) 2017-04-05 2018-02-09 Køling af et datacenter

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DK18706167.6T DK3563651T3 (da) 2017-04-05 2018-02-09 Køling af et datacenter

Country Status (6)

Country Link
US (3) US10123461B2 (da)
EP (2) EP3563651B1 (da)
DK (2) DK3563651T3 (da)
FI (1) FI3806596T3 (da)
TW (1) TWI674057B (da)
WO (1) WO2018186933A1 (da)

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* Cited by examiner, † Cited by third party
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US10123461B2 (en) * 2017-04-05 2018-11-06 Google Llc Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly
CN109757061B (zh) 2017-11-03 2021-06-11 阿里巴巴集团控股有限公司 冷却机柜及冷却系统
CN109757060B (zh) 2017-11-03 2020-11-24 阿里巴巴集团控股有限公司 冷却设备
EP3654743B1 (en) * 2018-11-15 2024-03-13 Ovh Rack arrangement for a data center
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US11261872B2 (en) 2019-04-11 2022-03-01 Commscope Technologies Llc Modular fan unit systems and assemblies
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US11013151B1 (en) * 2019-12-31 2021-05-18 Quanta Computer Inc. Electronic component housing cooling system
US11388833B2 (en) * 2020-02-06 2022-07-12 Baidu Usa Llc Modular-based solution for server rack architecture
US11445639B2 (en) * 2020-09-24 2022-09-13 Baidu Usa Llc Information technology (IT) cooling system with fluid distribution configuration
US20240196570A1 (en) * 2021-03-11 2024-06-13 Core Scientific Operating Company System for cooling computing devices in an array
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Also Published As

Publication number Publication date
EP3563651A1 (en) 2019-11-06
WO2018186933A1 (en) 2018-10-11
EP3806596A1 (en) 2021-04-14
US10888029B2 (en) 2021-01-05
EP3806596B1 (en) 2023-04-19
DK3563651T3 (da) 2021-06-21
US11297736B2 (en) 2022-04-05
US10123461B2 (en) 2018-11-06
US20210100136A1 (en) 2021-04-01
FI3806596T3 (fi) 2023-07-19
EP3563651B1 (en) 2021-04-07
US20190037729A1 (en) 2019-01-31
US20180295751A1 (en) 2018-10-11
TW201838501A (zh) 2018-10-16
TWI674057B (zh) 2019-10-01

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