DK3563651T3 - Køling af et datacenter - Google Patents

Køling af et datacenter Download PDF

Info

Publication number
DK3563651T3
DK3563651T3 DK18706167.6T DK18706167T DK3563651T3 DK 3563651 T3 DK3563651 T3 DK 3563651T3 DK 18706167 T DK18706167 T DK 18706167T DK 3563651 T3 DK3563651 T3 DK 3563651T3
Authority
DK
Denmark
Prior art keywords
cooling
data center
center
data
Prior art date
Application number
DK18706167.6T
Other languages
English (en)
Inventor
Jayson Michael Jochim
Angela Chen
Soheil Farshchian
Winnie Leung
Michael Chi Kin Lau
Original Assignee
Google Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Google Llc filed Critical Google Llc
Application granted granted Critical
Publication of DK3563651T3 publication Critical patent/DK3563651T3/da

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20745Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20736Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20827Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
DK18706167.6T 2017-04-05 2018-02-09 Køling af et datacenter DK3563651T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/479,740 US10123461B2 (en) 2017-04-05 2017-04-05 Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly
PCT/US2018/017577 WO2018186933A1 (en) 2017-04-05 2018-02-09 Cooling a data center

Publications (1)

Publication Number Publication Date
DK3563651T3 true DK3563651T3 (da) 2021-06-21

Family

ID=61244836

Family Applications (2)

Application Number Title Priority Date Filing Date
DK18706167.6T DK3563651T3 (da) 2017-04-05 2018-02-09 Køling af et datacenter
DK20210609.2T DK3806596T3 (da) 2017-04-05 2018-02-09 Køling af et datacenter

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK20210609.2T DK3806596T3 (da) 2017-04-05 2018-02-09 Køling af et datacenter

Country Status (6)

Country Link
US (3) US10123461B2 (da)
EP (2) EP3563651B1 (da)
DK (2) DK3563651T3 (da)
FI (1) FI3806596T3 (da)
TW (1) TWI674057B (da)
WO (1) WO2018186933A1 (da)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6710938B2 (ja) * 2015-11-05 2020-06-17 富士通株式会社 データセンタシステム、データセンタシステムの制御方法及びプログラム
US10123461B2 (en) * 2017-04-05 2018-11-06 Google Llc Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly
CN109757061B (zh) 2017-11-03 2021-06-11 阿里巴巴集团控股有限公司 冷却机柜及冷却系统
CN109757060B (zh) 2017-11-03 2020-11-24 阿里巴巴集团控股有限公司 冷却设备
EP3654743B1 (en) * 2018-11-15 2024-03-13 Ovh Rack arrangement for a data center
US20200288606A1 (en) * 2019-03-08 2020-09-10 Nvidia Corporation Data center having rack clusters with high density, air-cooled server racks
US11261872B2 (en) 2019-04-11 2022-03-01 Commscope Technologies Llc Modular fan unit systems and assemblies
EP3726339A1 (en) 2019-04-18 2020-10-21 Lockpoint IP GmbH Data handling device
RU2757178C2 (ru) 2019-11-21 2021-10-11 Общество С Ограниченной Ответственностью «Яндекс» Устройство для охлаждения серверной стойки
JP7306250B2 (ja) * 2019-12-11 2023-07-11 富士通株式会社 基地局及び装置冷却方法
US11013151B1 (en) * 2019-12-31 2021-05-18 Quanta Computer Inc. Electronic component housing cooling system
US11388833B2 (en) * 2020-02-06 2022-07-12 Baidu Usa Llc Modular-based solution for server rack architecture
US11445639B2 (en) * 2020-09-24 2022-09-13 Baidu Usa Llc Information technology (IT) cooling system with fluid distribution configuration
WO2022192376A1 (en) * 2021-03-11 2022-09-15 Core Scientific, Inc. System for cooling computing devices in an array
US11602086B2 (en) * 2021-04-20 2023-03-07 Dell Products L.P. Cooling computing modules of a rack-mountable tray
WO2023039364A1 (en) 2021-09-08 2023-03-16 Swiss Vault Cartridge module alignment and mounting system, apparatus and method
GB2610876A (en) * 2021-09-21 2023-03-22 Scantech Offshore Ltd Air compressor

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4992669A (en) 1989-02-16 1991-02-12 Parmley Daniel W Modular energy system
US5345779A (en) 1993-04-23 1994-09-13 Liebert Corporation Modular floor sub-structure for the operational support of computer systems
JPH11148710A (ja) 1997-11-17 1999-06-02 Mitsubishi Electric Building Techno Service Co Ltd 二重床埋設型空調システム
US5953930A (en) 1998-03-31 1999-09-21 International Business Machines Corporation Evaporator for use in an extended air cooling system for electronic components
US6178762B1 (en) * 1998-12-29 2001-01-30 Ethicool Air Conditioners, Inc. Desiccant/evaporative cooling system
AU2001249286A1 (en) * 2000-03-21 2001-10-03 Liebert Corporation Method and apparatus for cooling electronic enclosures
US6616524B2 (en) 2000-11-09 2003-09-09 Gary A. Storck, Jr. Raised floor air handling unit
JP4762464B2 (ja) 2001-05-15 2011-08-31 高砂熱学工業株式会社 空調システムおよび通信機器等を搭載したラックの顕熱負荷処理方法
US6506111B2 (en) 2001-05-16 2003-01-14 Sanmina-Sci Corporation Cooling airflow distribution device
US7500911B2 (en) 2002-11-25 2009-03-10 American Power Conversion Corporation Exhaust air removal system
US7752858B2 (en) 2002-11-25 2010-07-13 American Power Conversion Corporation Exhaust air removal system
US7046514B2 (en) 2003-03-19 2006-05-16 American Power Conversion Corporation Data center cooling
US7862410B2 (en) 2006-01-20 2011-01-04 American Power Conversion Corporation Air removal unit
US20100091449A1 (en) 2006-06-01 2010-04-15 Jimmy Clidaras Modular Computing Environments
EP2036412B1 (en) 2006-06-01 2012-11-14 Exaflop LLC Controlled warm air capture
CN101222827A (zh) 2007-01-08 2008-07-16 鸿富锦精密工业(深圳)有限公司 机柜
US8009451B2 (en) 2007-01-08 2011-08-30 Modern Sense Limited Universal power adapter/converter
US8456840B1 (en) * 2007-07-06 2013-06-04 Exaflop Llc Modular data center cooling
US8763414B2 (en) 2008-03-31 2014-07-01 Google Inc. Warm floor data center
RU2524181C2 (ru) * 2008-05-20 2014-07-27 Вейвертон Холдингз Лимитед Холодильный агрегат, встраиваемый в стойку
DE102009011006C5 (de) 2009-03-02 2015-11-26 Rittal Gmbh & Co. Kg Anordnung zur Klimatisierung einer Datenverarbeitungsanlage
US9670689B2 (en) 2010-04-06 2017-06-06 Schneider Electric It Corporation Container based data center solutions
JP2011237887A (ja) * 2010-05-06 2011-11-24 Hitachi Plant Technologies Ltd 電子機器の冷却方法及び冷却システム
TW201224372A (en) * 2010-12-15 2012-06-16 Hon Hai Prec Ind Co Ltd Container data center cooling system
CN103443550B (zh) * 2011-01-11 2018-11-20 施耐德电气It公司 冷却单元和方法
US20120293951A1 (en) * 2011-05-16 2012-11-22 Delta Electronics, Inc. Rack mounted computer system and cooling structure thereof
US20130300266A1 (en) * 2012-05-11 2013-11-14 Panduit Corp. Modular Containment System
US20150334878A1 (en) * 2012-12-18 2015-11-19 Schneider Electric It Corporation Cooling unit and method
CN103997865A (zh) 2014-05-09 2014-08-20 华为技术有限公司 一种数据中心的集装箱及数据中心
JP6478046B2 (ja) * 2015-09-29 2019-03-06 パナソニックIpマネジメント株式会社 サーバー冷却システム
US10123461B2 (en) * 2017-04-05 2018-11-06 Google Llc Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly

Also Published As

Publication number Publication date
EP3806596A1 (en) 2021-04-14
TWI674057B (zh) 2019-10-01
TW201838501A (zh) 2018-10-16
US11297736B2 (en) 2022-04-05
EP3806596B1 (en) 2023-04-19
DK3806596T3 (da) 2023-07-24
FI3806596T3 (fi) 2023-07-19
US10123461B2 (en) 2018-11-06
WO2018186933A1 (en) 2018-10-11
US20190037729A1 (en) 2019-01-31
US20180295751A1 (en) 2018-10-11
EP3563651B1 (en) 2021-04-07
EP3563651A1 (en) 2019-11-06
US20210100136A1 (en) 2021-04-01
US10888029B2 (en) 2021-01-05

Similar Documents

Publication Publication Date Title
DK3563651T3 (da) Køling af et datacenter
DK3177126T3 (da) Køling af et datacenter
DK3203820T3 (da) Køling af et datacenter
DK3232752T3 (da) Køling af elektroniske enheder i et datacenter
JP1631531S (ja) 電子計算機
DK3488369T3 (da) Bestemmelse af en optimal wellness-plan
DK3382551T3 (da) Sporing af fordelt hardware
DK3314992T3 (da) Kølesystem til et datacenter
DK3777495T3 (da) Køling af elektroniske udstyr i et datacenter
DK3262513T3 (da) Lagring af data
ES2966610T3 (es) Captura de datos a través de dispositivos
DK3305046T3 (da) Kølesystem til datacenter
MA53582A (fr) Caméra à capteurs multiples
DK3494493T3 (da) Ompartitionering af data i et distribueret computersystem
DK3474563T3 (da) Fremgangsmåde til overførsel af data
FR3037174B1 (fr) Securisation de donnees numeriques
DK3436754T3 (da) Kølekredsløb
DK3951306T3 (da) Højtydende elektronisk kølesystem
FI11566U1 (fi) Kelluva valokuvauslaite
DK3417683T3 (da) Bæremontering til bæring af et elektronisk hylster
DK3507690T3 (da) Optimering af en java card-applikations hukommelsespladsbehov
DK3208629T3 (da) Positionering med AIS-dataoverførsel
FR3019340B1 (fr) Composant electronique a reponse determeniste
DK3538996T3 (da) Udskiftning af realtidsdata mellem programmoduler
DK3703405T3 (da) Elektronisk adgangskontrol ved anvendelse af en formidler