DK3563651T3 - Køling af et datacenter - Google Patents
Køling af et datacenter Download PDFInfo
- Publication number
- DK3563651T3 DK3563651T3 DK18706167.6T DK18706167T DK3563651T3 DK 3563651 T3 DK3563651 T3 DK 3563651T3 DK 18706167 T DK18706167 T DK 18706167T DK 3563651 T3 DK3563651 T3 DK 3563651T3
- Authority
- DK
- Denmark
- Prior art keywords
- cooling
- data center
- center
- data
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/479,740 US10123461B2 (en) | 2017-04-05 | 2017-04-05 | Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly |
PCT/US2018/017577 WO2018186933A1 (en) | 2017-04-05 | 2018-02-09 | Cooling a data center |
Publications (1)
Publication Number | Publication Date |
---|---|
DK3563651T3 true DK3563651T3 (da) | 2021-06-21 |
Family
ID=61244836
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK18706167.6T DK3563651T3 (da) | 2017-04-05 | 2018-02-09 | Køling af et datacenter |
DK20210609.2T DK3806596T3 (da) | 2017-04-05 | 2018-02-09 | Køling af et datacenter |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK20210609.2T DK3806596T3 (da) | 2017-04-05 | 2018-02-09 | Køling af et datacenter |
Country Status (6)
Country | Link |
---|---|
US (3) | US10123461B2 (da) |
EP (2) | EP3563651B1 (da) |
DK (2) | DK3563651T3 (da) |
FI (1) | FI3806596T3 (da) |
TW (1) | TWI674057B (da) |
WO (1) | WO2018186933A1 (da) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6710938B2 (ja) * | 2015-11-05 | 2020-06-17 | 富士通株式会社 | データセンタシステム、データセンタシステムの制御方法及びプログラム |
US10123461B2 (en) * | 2017-04-05 | 2018-11-06 | Google Llc | Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly |
CN109757061B (zh) | 2017-11-03 | 2021-06-11 | 阿里巴巴集团控股有限公司 | 冷却机柜及冷却系统 |
CN109757060B (zh) | 2017-11-03 | 2020-11-24 | 阿里巴巴集团控股有限公司 | 冷却设备 |
EP3654743B1 (en) * | 2018-11-15 | 2024-03-13 | Ovh | Rack arrangement for a data center |
US20200288606A1 (en) * | 2019-03-08 | 2020-09-10 | Nvidia Corporation | Data center having rack clusters with high density, air-cooled server racks |
US11261872B2 (en) | 2019-04-11 | 2022-03-01 | Commscope Technologies Llc | Modular fan unit systems and assemblies |
EP3726339A1 (en) | 2019-04-18 | 2020-10-21 | Lockpoint IP GmbH | Data handling device |
RU2757178C2 (ru) | 2019-11-21 | 2021-10-11 | Общество С Ограниченной Ответственностью «Яндекс» | Устройство для охлаждения серверной стойки |
JP7306250B2 (ja) * | 2019-12-11 | 2023-07-11 | 富士通株式会社 | 基地局及び装置冷却方法 |
US11013151B1 (en) * | 2019-12-31 | 2021-05-18 | Quanta Computer Inc. | Electronic component housing cooling system |
US11388833B2 (en) * | 2020-02-06 | 2022-07-12 | Baidu Usa Llc | Modular-based solution for server rack architecture |
US11445639B2 (en) * | 2020-09-24 | 2022-09-13 | Baidu Usa Llc | Information technology (IT) cooling system with fluid distribution configuration |
WO2022192376A1 (en) * | 2021-03-11 | 2022-09-15 | Core Scientific, Inc. | System for cooling computing devices in an array |
US11602086B2 (en) * | 2021-04-20 | 2023-03-07 | Dell Products L.P. | Cooling computing modules of a rack-mountable tray |
WO2023039364A1 (en) | 2021-09-08 | 2023-03-16 | Swiss Vault | Cartridge module alignment and mounting system, apparatus and method |
GB2610876A (en) * | 2021-09-21 | 2023-03-22 | Scantech Offshore Ltd | Air compressor |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4992669A (en) | 1989-02-16 | 1991-02-12 | Parmley Daniel W | Modular energy system |
US5345779A (en) | 1993-04-23 | 1994-09-13 | Liebert Corporation | Modular floor sub-structure for the operational support of computer systems |
JPH11148710A (ja) | 1997-11-17 | 1999-06-02 | Mitsubishi Electric Building Techno Service Co Ltd | 二重床埋設型空調システム |
US5953930A (en) | 1998-03-31 | 1999-09-21 | International Business Machines Corporation | Evaporator for use in an extended air cooling system for electronic components |
US6178762B1 (en) * | 1998-12-29 | 2001-01-30 | Ethicool Air Conditioners, Inc. | Desiccant/evaporative cooling system |
AU2001249286A1 (en) * | 2000-03-21 | 2001-10-03 | Liebert Corporation | Method and apparatus for cooling electronic enclosures |
US6616524B2 (en) | 2000-11-09 | 2003-09-09 | Gary A. Storck, Jr. | Raised floor air handling unit |
JP4762464B2 (ja) | 2001-05-15 | 2011-08-31 | 高砂熱学工業株式会社 | 空調システムおよび通信機器等を搭載したラックの顕熱負荷処理方法 |
US6506111B2 (en) | 2001-05-16 | 2003-01-14 | Sanmina-Sci Corporation | Cooling airflow distribution device |
US7500911B2 (en) | 2002-11-25 | 2009-03-10 | American Power Conversion Corporation | Exhaust air removal system |
US7752858B2 (en) | 2002-11-25 | 2010-07-13 | American Power Conversion Corporation | Exhaust air removal system |
US7046514B2 (en) | 2003-03-19 | 2006-05-16 | American Power Conversion Corporation | Data center cooling |
US7862410B2 (en) | 2006-01-20 | 2011-01-04 | American Power Conversion Corporation | Air removal unit |
US20100091449A1 (en) | 2006-06-01 | 2010-04-15 | Jimmy Clidaras | Modular Computing Environments |
EP2036412B1 (en) | 2006-06-01 | 2012-11-14 | Exaflop LLC | Controlled warm air capture |
CN101222827A (zh) | 2007-01-08 | 2008-07-16 | 鸿富锦精密工业(深圳)有限公司 | 机柜 |
US8009451B2 (en) | 2007-01-08 | 2011-08-30 | Modern Sense Limited | Universal power adapter/converter |
US8456840B1 (en) * | 2007-07-06 | 2013-06-04 | Exaflop Llc | Modular data center cooling |
US8763414B2 (en) | 2008-03-31 | 2014-07-01 | Google Inc. | Warm floor data center |
RU2524181C2 (ru) * | 2008-05-20 | 2014-07-27 | Вейвертон Холдингз Лимитед | Холодильный агрегат, встраиваемый в стойку |
DE102009011006C5 (de) | 2009-03-02 | 2015-11-26 | Rittal Gmbh & Co. Kg | Anordnung zur Klimatisierung einer Datenverarbeitungsanlage |
US9670689B2 (en) | 2010-04-06 | 2017-06-06 | Schneider Electric It Corporation | Container based data center solutions |
JP2011237887A (ja) * | 2010-05-06 | 2011-11-24 | Hitachi Plant Technologies Ltd | 電子機器の冷却方法及び冷却システム |
TW201224372A (en) * | 2010-12-15 | 2012-06-16 | Hon Hai Prec Ind Co Ltd | Container data center cooling system |
CN103443550B (zh) * | 2011-01-11 | 2018-11-20 | 施耐德电气It公司 | 冷却单元和方法 |
US20120293951A1 (en) * | 2011-05-16 | 2012-11-22 | Delta Electronics, Inc. | Rack mounted computer system and cooling structure thereof |
US20130300266A1 (en) * | 2012-05-11 | 2013-11-14 | Panduit Corp. | Modular Containment System |
US20150334878A1 (en) * | 2012-12-18 | 2015-11-19 | Schneider Electric It Corporation | Cooling unit and method |
CN103997865A (zh) | 2014-05-09 | 2014-08-20 | 华为技术有限公司 | 一种数据中心的集装箱及数据中心 |
JP6478046B2 (ja) * | 2015-09-29 | 2019-03-06 | パナソニックIpマネジメント株式会社 | サーバー冷却システム |
US10123461B2 (en) * | 2017-04-05 | 2018-11-06 | Google Llc | Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly |
-
2017
- 2017-04-05 US US15/479,740 patent/US10123461B2/en active Active
-
2018
- 2018-02-09 EP EP18706167.6A patent/EP3563651B1/en active Active
- 2018-02-09 FI FIEP20210609.2T patent/FI3806596T3/fi active
- 2018-02-09 DK DK18706167.6T patent/DK3563651T3/da active
- 2018-02-09 WO PCT/US2018/017577 patent/WO2018186933A1/en unknown
- 2018-02-09 DK DK20210609.2T patent/DK3806596T3/da active
- 2018-02-09 EP EP20210609.2A patent/EP3806596B1/en active Active
- 2018-03-01 TW TW107106706A patent/TWI674057B/zh active
- 2018-10-03 US US16/150,842 patent/US10888029B2/en active Active
-
2020
- 2020-12-10 US US17/117,674 patent/US11297736B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3806596A1 (en) | 2021-04-14 |
TWI674057B (zh) | 2019-10-01 |
TW201838501A (zh) | 2018-10-16 |
US11297736B2 (en) | 2022-04-05 |
EP3806596B1 (en) | 2023-04-19 |
DK3806596T3 (da) | 2023-07-24 |
FI3806596T3 (fi) | 2023-07-19 |
US10123461B2 (en) | 2018-11-06 |
WO2018186933A1 (en) | 2018-10-11 |
US20190037729A1 (en) | 2019-01-31 |
US20180295751A1 (en) | 2018-10-11 |
EP3563651B1 (en) | 2021-04-07 |
EP3563651A1 (en) | 2019-11-06 |
US20210100136A1 (en) | 2021-04-01 |
US10888029B2 (en) | 2021-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK3563651T3 (da) | Køling af et datacenter | |
DK3177126T3 (da) | Køling af et datacenter | |
DK3203820T3 (da) | Køling af et datacenter | |
DK3232752T3 (da) | Køling af elektroniske enheder i et datacenter | |
JP1631531S (ja) | 電子計算機 | |
DK3488369T3 (da) | Bestemmelse af en optimal wellness-plan | |
DK3382551T3 (da) | Sporing af fordelt hardware | |
DK3314992T3 (da) | Kølesystem til et datacenter | |
DK3777495T3 (da) | Køling af elektroniske udstyr i et datacenter | |
DK3262513T3 (da) | Lagring af data | |
ES2966610T3 (es) | Captura de datos a través de dispositivos | |
DK3305046T3 (da) | Kølesystem til datacenter | |
MA53582A (fr) | Caméra à capteurs multiples | |
DK3494493T3 (da) | Ompartitionering af data i et distribueret computersystem | |
DK3474563T3 (da) | Fremgangsmåde til overførsel af data | |
FR3037174B1 (fr) | Securisation de donnees numeriques | |
DK3436754T3 (da) | Kølekredsløb | |
DK3951306T3 (da) | Højtydende elektronisk kølesystem | |
FI11566U1 (fi) | Kelluva valokuvauslaite | |
DK3417683T3 (da) | Bæremontering til bæring af et elektronisk hylster | |
DK3507690T3 (da) | Optimering af en java card-applikations hukommelsespladsbehov | |
DK3208629T3 (da) | Positionering med AIS-dataoverførsel | |
FR3019340B1 (fr) | Composant electronique a reponse determeniste | |
DK3538996T3 (da) | Udskiftning af realtidsdata mellem programmoduler | |
DK3703405T3 (da) | Elektronisk adgangskontrol ved anvendelse af en formidler |