DK325474A - - Google Patents
Info
- Publication number
- DK325474A DK325474A DK325474A DK325474A DK325474A DK 325474 A DK325474 A DK 325474A DK 325474 A DK325474 A DK 325474A DK 325474 A DK325474 A DK 325474A DK 325474 A DK325474 A DK 325474A
- Authority
- DK
- Denmark
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19732331586 DE2331586C3 (de) | 1973-06-20 | Aluminium-Tantal-Schichten für Dünnschichtschaltungen sowie diskrete Widerstände und Kondensatoren | |
DE2331586 | 1973-06-20 |
Publications (3)
Publication Number | Publication Date |
---|---|
DK325474A true DK325474A (xx) | 1975-02-17 |
DK143084B DK143084B (da) | 1981-03-23 |
DK143084C DK143084C (da) | 1981-10-26 |
Family
ID=5884643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK325474A DK143084C (da) | 1973-06-20 | 1974-06-18 | Elektrisk tyndfilmkomponent og fremgangsmaade til fremstillingaf samme |
Country Status (17)
Country | Link |
---|---|
US (1) | US3949275A (xx) |
JP (1) | JPS5346266B2 (xx) |
AT (1) | AT342733B (xx) |
BE (1) | BE816632R (xx) |
CA (1) | CA1007382A (xx) |
CH (1) | CH574200A5 (xx) |
DK (1) | DK143084C (xx) |
FR (1) | FR2234638B2 (xx) |
GB (1) | GB1424980A (xx) |
IE (1) | IE39514B1 (xx) |
IL (1) | IL45045A (xx) |
IT (1) | IT1019657B (xx) |
LU (1) | LU70349A1 (xx) |
NL (1) | NL7408158A (xx) |
NO (1) | NO139021C (xx) |
SE (1) | SE405052B (xx) |
YU (2) | YU40428B (xx) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51108469A (ja) * | 1975-03-19 | 1976-09-25 | Hitachi Metals Ltd | Gokanchoryukonbeya |
US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
DE2823881C3 (de) * | 1978-05-31 | 1982-03-18 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen |
DE2906813C2 (de) * | 1979-02-22 | 1982-06-03 | Robert Bosch Gmbh, 7000 Stuttgart | Elektronische Dünnschichtschaltung |
US4200502A (en) * | 1979-03-12 | 1980-04-29 | Siemens Aktiengesellschaft | Method for producing an electrical thin layer circuit |
US4654680A (en) * | 1980-09-24 | 1987-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Sidewall gate IGFET |
DE3480243D1 (en) * | 1983-03-31 | 1989-11-23 | Matsushita Electric Ind Co Ltd | Method of manufacturing thin-film integrated devices |
JPS6045008A (ja) * | 1983-08-22 | 1985-03-11 | 松下電器産業株式会社 | 薄膜コンデンサの製造方法 |
JPS60147462U (ja) * | 1984-03-13 | 1985-09-30 | 長谷川化学工業株式会社 | 竹刀 |
JP3411983B2 (ja) * | 1989-02-28 | 2003-06-03 | キヤノン株式会社 | Ir、Ta及びAlを含有する非単結晶質物質 |
US5027253A (en) * | 1990-04-09 | 1991-06-25 | Ibm Corporation | Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards |
US5419787A (en) * | 1994-06-24 | 1995-05-30 | The United States Of America As Represented By The Secretary Of The Air Force | Stress reduced insulator |
KR100206621B1 (ko) * | 1994-08-26 | 1999-07-01 | 사토 게니치로 | 칩형 후막 콘덴서 및 그의 제조 방법 |
US5598131A (en) * | 1995-11-16 | 1997-01-28 | Emc Technology, Inc. | AC coupled termination |
US5977582A (en) * | 1997-05-23 | 1999-11-02 | Lucent Technologies Inc. | Capacitor comprising improved TaOx -based dielectric |
KR100359860B1 (ko) * | 1998-12-31 | 2003-02-20 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터 형성방법 |
DE19902865A1 (de) * | 1999-01-25 | 2000-07-27 | Philips Corp Intellectual Pty | Zero-IF-Konverter mit RC-Filter |
US6278356B1 (en) * | 2000-05-17 | 2001-08-21 | Compeq Manufacturing Company Limited | Flat, built-in resistors and capacitors for a printed circuit board |
DE10039710B4 (de) * | 2000-08-14 | 2017-06-22 | United Monolithic Semiconductors Gmbh | Verfahren zur Herstellung passiver Bauelemente auf einem Halbleitersubstrat |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2179960A (en) * | 1931-11-28 | 1939-11-14 | Schwarzkopf Paul | Agglomerated material in particular for electrical purposes and shaped bodies made therefrom |
US3217209A (en) * | 1960-05-12 | 1965-11-09 | Xerox Corp | Printed circuits with resistive and capacitive elements |
US3386011A (en) * | 1962-10-23 | 1968-05-28 | Philco Ford Corp | Thin-film rc circuits on single substrate |
US3172196A (en) * | 1963-01-22 | 1965-03-09 | Brush Beryllium Co | Sintered intermetallic compoundcomposition bodies |
US3198628A (en) * | 1963-06-13 | 1965-08-03 | Dow Chemical Co | Uranium-tantalum-aluminum alloy |
US3406043A (en) * | 1964-11-09 | 1968-10-15 | Western Electric Co | Integrated circuit containing multilayer tantalum compounds |
US3387952A (en) * | 1964-11-09 | 1968-06-11 | Western Electric Co | Multilayer thin-film coated substrate with metallic parting layer to permit selectiveequential etching |
US3423821A (en) * | 1965-03-18 | 1969-01-28 | Hitachi Ltd | Method of producing thin film integrated circuits |
FR1537897A (fr) * | 1967-07-19 | 1968-08-30 | Europ Composants Electron | Procédé de fabrication de circuits électriques en couches minces |
US3616282A (en) * | 1968-11-14 | 1971-10-26 | Hewlett Packard Co | Method of producing thin-film circuit elements |
US3607679A (en) * | 1969-05-05 | 1971-09-21 | Bell Telephone Labor Inc | Method for the fabrication of discrete rc structure |
US3718565A (en) * | 1970-11-27 | 1973-02-27 | Bell Telephone Labor Inc | Technique for the fabrication of discrete rc structure |
US3781610A (en) * | 1972-05-22 | 1973-12-25 | G Bodway | Thin film circuits and method for manufacture |
-
1974
- 1974-06-07 GB GB2540174A patent/GB1424980A/en not_active Expired
- 1974-06-10 NO NO742086A patent/NO139021C/no unknown
- 1974-06-10 AT AT476974A patent/AT342733B/de not_active IP Right Cessation
- 1974-06-17 CH CH823974A patent/CH574200A5/xx not_active IP Right Cessation
- 1974-06-17 SE SE7407961A patent/SE405052B/xx not_active IP Right Cessation
- 1974-06-17 IL IL45045A patent/IL45045A/en unknown
- 1974-06-18 CA CA202,758A patent/CA1007382A/en not_active Expired
- 1974-06-18 NL NL7408158A patent/NL7408158A/xx not_active Application Discontinuation
- 1974-06-18 LU LU70349A patent/LU70349A1/xx unknown
- 1974-06-18 FR FR7421128A patent/FR2234638B2/fr not_active Expired
- 1974-06-18 DK DK325474A patent/DK143084C/da active
- 1974-06-19 US US05/480,826 patent/US3949275A/en not_active Expired - Lifetime
- 1974-06-19 IE IE1283/74A patent/IE39514B1/xx unknown
- 1974-06-19 IT IT24145/74A patent/IT1019657B/it active
- 1974-06-20 JP JP7073674A patent/JPS5346266B2/ja not_active Expired
- 1974-06-20 BE BE145686A patent/BE816632R/xx not_active IP Right Cessation
- 1974-06-20 YU YU1732/74A patent/YU40428B/xx unknown
-
1980
- 1980-11-10 YU YU02869/80A patent/YU286980A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US3949275A (en) | 1976-04-06 |
YU173274A (en) | 1982-02-28 |
CA1007382A (en) | 1977-03-22 |
YU286980A (en) | 1982-10-31 |
IE39514L (en) | 1974-12-20 |
JPS5032474A (xx) | 1975-03-29 |
SE7407961L (xx) | 1974-12-23 |
AT342733B (de) | 1978-04-25 |
BE816632R (fr) | 1974-10-16 |
GB1424980A (en) | 1976-02-11 |
JPS5346266B2 (xx) | 1978-12-12 |
FR2234638B2 (xx) | 1978-08-04 |
IL45045A0 (en) | 1974-09-10 |
DK143084C (da) | 1981-10-26 |
IL45045A (en) | 1977-04-29 |
AU7019474A (en) | 1975-12-18 |
DE2331586B2 (de) | 1976-11-25 |
NO742086L (xx) | 1975-01-13 |
IE39514B1 (en) | 1978-10-25 |
DK143084B (da) | 1981-03-23 |
NL7408158A (xx) | 1974-12-24 |
NO139021B (no) | 1978-09-11 |
SE405052B (sv) | 1978-11-13 |
CH574200A5 (xx) | 1976-03-31 |
LU70349A1 (xx) | 1974-10-17 |
IT1019657B (it) | 1977-11-30 |
NO139021C (no) | 1978-12-20 |
FR2234638A2 (xx) | 1975-01-17 |
ATA476974A (de) | 1977-08-15 |
YU40428B (en) | 1986-02-28 |
DE2331586A1 (de) | 1975-01-09 |