DK2561741T3 - En termisk styret anordning - Google Patents

En termisk styret anordning

Info

Publication number
DK2561741T3
DK2561741T3 DK11718323.6T DK11718323T DK2561741T3 DK 2561741 T3 DK2561741 T3 DK 2561741T3 DK 11718323 T DK11718323 T DK 11718323T DK 2561741 T3 DK2561741 T3 DK 2561741T3
Authority
DK
Denmark
Prior art keywords
controlled device
thermally controlled
thermally
controlled
Prior art date
Application number
DK11718323.6T
Other languages
English (en)
Inventor
Claus Ek
Christoffer Storemoen
Original Assignee
Napatech As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Napatech As filed Critical Napatech As
Application granted granted Critical
Publication of DK2561741T3 publication Critical patent/DK2561741T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
DK11718323.6T 2010-04-23 2011-04-19 En termisk styret anordning DK2561741T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32733910P 2010-04-23 2010-04-23
PCT/EP2011/056260 WO2011131686A1 (en) 2010-04-23 2011-04-19 A thermally controlled assembly

Publications (1)

Publication Number Publication Date
DK2561741T3 true DK2561741T3 (da) 2014-06-23

Family

ID=44201961

Family Applications (2)

Application Number Title Priority Date Filing Date
DK11715916.0T DK2561728T3 (da) 2010-04-23 2011-04-19 Termisk styret anordning
DK11718323.6T DK2561741T3 (da) 2010-04-23 2011-04-19 En termisk styret anordning

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DK11715916.0T DK2561728T3 (da) 2010-04-23 2011-04-19 Termisk styret anordning

Country Status (8)

Country Link
US (2) US9155224B2 (da)
EP (2) EP2561728B1 (da)
JP (3) JP2013528933A (da)
KR (2) KR20130054279A (da)
CN (2) CN102986318B (da)
BR (2) BR112012027068A2 (da)
DK (2) DK2561728T3 (da)
WO (2) WO2011131684A1 (da)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10149411B2 (en) * 2016-09-09 2018-12-04 Seagate Technology Llc Rack enclosure cooling systems and related methods
CN110602864A (zh) * 2018-06-13 2019-12-20 Oppo广东移动通信有限公司 电路板组件和具有其的电子设备
CN110602863A (zh) * 2018-06-13 2019-12-20 Oppo广东移动通信有限公司 电路板组件和具有其的电子设备

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3409037A1 (de) 1984-03-13 1985-09-19 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet
JPS6413751A (en) 1987-07-08 1989-01-18 Seiko Epson Corp Semiconductor circuit unit for power supply
US4858069A (en) * 1988-08-08 1989-08-15 Gte Spacenet Corporation Electronic housing for a satellite earth station
JPH0258900A (ja) 1988-08-25 1990-02-28 Fanuc Ltd 電子機器ユニットの冷却装置
JPH0370196A (ja) * 1989-08-09 1991-03-26 Hitachi Lighting Ltd 電子装置
JPH0465888A (ja) * 1990-07-06 1992-03-02 Tokyo Electron Yamanashi Kk 電子回路装置
JP2938704B2 (ja) 1993-03-19 1999-08-25 富士通株式会社 集積回路パッケージ
JPH06332148A (ja) 1993-05-24 1994-12-02 Hanpuu:Kk 印刷画像処理システム
TW265430B (en) 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
US5646826A (en) * 1995-01-26 1997-07-08 Northern Telecom Limited Printed circuit board and heat sink arrangement
JP3351234B2 (ja) 1996-04-25 2002-11-25 横河電機株式会社 入力モジュールの放熱構造
JPH09172113A (ja) 1995-12-18 1997-06-30 Nec Corp 半導体装置用ヒートシンク
JPH1075030A (ja) * 1996-08-31 1998-03-17 Omron Corp 配線基板構造
US6109340A (en) 1997-04-30 2000-08-29 Nidec Corporation Heat sink fan
JPH11112177A (ja) * 1997-10-02 1999-04-23 Nippon Columbia Co Ltd 電子機器の冷却装置
JPH11186767A (ja) * 1997-12-24 1999-07-09 Ricoh Co Ltd 電子機器の冷却装置
JP2000174474A (ja) * 1998-12-02 2000-06-23 Nippon Columbia Co Ltd 電子機器の冷却装置
JP2000227823A (ja) * 1998-12-04 2000-08-15 Sony Corp 冷却装置および方法、並びに電子機器
US6125924A (en) 1999-05-03 2000-10-03 Lin; Hao-Cheng Heat-dissipating device
US6130820A (en) 1999-05-04 2000-10-10 Intel Corporation Memory card cooling device
JP2001067860A (ja) * 1999-08-25 2001-03-16 Sanyo Electric Co Ltd ディスク装置
GB2358463A (en) * 2000-01-21 2001-07-25 3Com Corp A cooling apparatus
US7042734B2 (en) * 2003-01-23 2006-05-09 Hewlett-Packard Development Company, L.P. Multi-slot CompactPCI blade assembly
JP2004245198A (ja) * 2003-02-17 2004-09-02 Denso Corp 車載用電子制御装置
DE10326458B4 (de) 2003-06-12 2006-05-04 Phoenix Contact Gmbh & Co. Kg Kühlanordnung für elektronische Bauelemente
US6934152B1 (en) * 2003-06-27 2005-08-23 Emc Corporation Systems and methods for connecting an electronic apparatus to a backplane
JP4516396B2 (ja) * 2004-10-04 2010-08-04 パイオニア株式会社 電子装置
JP2006332148A (ja) * 2005-05-24 2006-12-07 Matsushita Electric Ind Co Ltd 冷却装置
DE102005035387B4 (de) 2005-07-28 2007-07-05 Infineon Technologies Ag Kühlkörper für ein in einen Einsteckplatz in einer Rechenanlage einsteckbares Modul sowie Modul, System und Rechenanlage mit demselben und Verfahren zur Kühlung eines Moduls
US7619900B2 (en) * 2007-01-25 2009-11-17 Mitac International Corp. Dual-board case for multi-mainboard system
WO2008109805A2 (en) * 2007-03-07 2008-09-12 Asetek Usa Inc. Hybrid liquid-air cooled graphics display adapter
US7447024B1 (en) * 2007-07-17 2008-11-04 Kuan-Yin Chou Heat sink for a memory
US20090194260A1 (en) * 2008-02-04 2009-08-06 Chih-Peng Liao Cooling apparatus for graphic cards
JP2009193350A (ja) * 2008-02-14 2009-08-27 Fujitsu Ltd 電子装置
US7969733B1 (en) * 2008-12-17 2011-06-28 Nvidia Corporation Heat transfer system, method, and computer program product for use with multiple circuit board environments
US7990712B2 (en) * 2008-12-31 2011-08-02 Cooler Master Co., Ltd. Heat sink used in interface card

Also Published As

Publication number Publication date
KR20130054280A (ko) 2013-05-24
CN102986318B (zh) 2015-04-15
JP2013526028A (ja) 2013-06-20
BR112012027052A2 (pt) 2016-07-19
JP2013528933A (ja) 2013-07-11
US20130141868A1 (en) 2013-06-06
WO2011131684A1 (en) 2011-10-27
US20130114208A1 (en) 2013-05-09
CN102986318A (zh) 2013-03-20
DK2561728T3 (da) 2014-06-23
JP6122166B2 (ja) 2017-04-26
JP2016106426A (ja) 2016-06-16
EP2561728A1 (en) 2013-02-27
EP2561741A1 (en) 2013-02-27
WO2011131686A1 (en) 2011-10-27
CN102986309B (zh) 2015-10-21
CN102986309A (zh) 2013-03-20
EP2561741B1 (en) 2014-03-19
KR20130054279A (ko) 2013-05-24
US9155223B2 (en) 2015-10-06
BR112012027068A2 (pt) 2016-07-26
US9155224B2 (en) 2015-10-06
EP2561728B1 (en) 2014-03-19

Similar Documents

Publication Publication Date Title
DK2402240T3 (da) Aero-cykelstyranordning
DE112012001807T8 (de) Steuervorrichtung
BR112014002553A2 (pt) dispositivo
DE112011103755A5 (de) Abzugvorrichtung
BR112013014902A2 (pt) dispositivo de obturação
BR112013014983A2 (pt) dispositivo aquecedor
FI10635U1 (fi) Laitteisto
DK2715050T3 (da) Tilpropningsanordning
FI20105906A0 (fi) Laite
DE112011102952A5 (de) Befestigungseinrichtung
BR112012030878A2 (pt) dispositivo
UA21862S (uk) Тримач пристрою дистанційного керування
FI20105903A0 (fi) Laite
IT1399873B1 (it) Dispositivo a cerniera
DK2561741T3 (da) En termisk styret anordning
IT1402832B1 (it) Dispositivo reggispinta
DE112011100509A5 (de) Aufnahmeeinrichtung
EE201300020A (et) Laskumisseadeldis
FI20105902A0 (fi) Laite
FI20105907A0 (fi) Laite
IT1399760B1 (it) Dispositivo antisismico isteretico
IT1398469B1 (it) Dispositivo caricaballe
DE112011104413A5 (de) Sensorvorrichtung
BR112013017926A2 (pt) dispositivo de construção
CO7071098A2 (es) Dispositivo magnetoreológico