DK2524974T3 - Injektor til et vakuuminddampningssystem - Google Patents

Injektor til et vakuuminddampningssystem

Info

Publication number
DK2524974T3
DK2524974T3 DK11305604.8T DK11305604T DK2524974T3 DK 2524974 T3 DK2524974 T3 DK 2524974T3 DK 11305604 T DK11305604 T DK 11305604T DK 2524974 T3 DK2524974 T3 DK 2524974T3
Authority
DK
Denmark
Prior art keywords
injector
vacuum evaporation
evaporation system
vacuum
evaporation
Prior art date
Application number
DK11305604.8T
Other languages
Danish (da)
English (en)
Inventor
Jean-Louis Guyaux
Franck Stemmelen
Oliveira Christophe De
Original Assignee
Riber
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riber filed Critical Riber
Application granted granted Critical
Publication of DK2524974T3 publication Critical patent/DK2524974T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/0475—PV cell arrays made by cells in a planar, e.g. repetitive, configuration on a single semiconductor substrate; PV cell microarrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
DK11305604.8T 2011-05-18 2011-05-18 Injektor til et vakuuminddampningssystem DK2524974T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11305604.8A EP2524974B1 (en) 2011-05-18 2011-05-18 Injector for a vacuum vapour deposition system

Publications (1)

Publication Number Publication Date
DK2524974T3 true DK2524974T3 (da) 2014-08-11

Family

ID=44318444

Family Applications (1)

Application Number Title Priority Date Filing Date
DK11305604.8T DK2524974T3 (da) 2011-05-18 2011-05-18 Injektor til et vakuuminddampningssystem

Country Status (9)

Country Link
US (1) US20120295014A1 (pl)
EP (1) EP2524974B1 (pl)
JP (1) JP2012241285A (pl)
KR (1) KR101976674B1 (pl)
CN (1) CN102787298A (pl)
DK (1) DK2524974T3 (pl)
ES (1) ES2486307T3 (pl)
PL (1) PL2524974T3 (pl)
SG (1) SG185895A1 (pl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6038618B2 (ja) * 2011-12-15 2016-12-07 株式会社ニューフレアテクノロジー 成膜装置および成膜方法
CN102965641A (zh) * 2012-12-05 2013-03-13 中国电子科技集团公司第十八研究所 薄膜太阳电池cigs层的硒化方法
CN107078215B (zh) * 2014-11-07 2020-09-22 应用材料公司 用于真空沉积的材料源配置与材料分布配置
CN107208252A (zh) * 2014-11-07 2017-09-26 应用材料公司 用于真空沉积的材料源布置和喷嘴
JP6513201B2 (ja) * 2014-12-17 2019-05-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積装置、真空堆積システム、及び材料堆積方法
KR102480457B1 (ko) * 2015-07-27 2022-12-22 삼성디스플레이 주식회사 증착 장치
TWI737718B (zh) 2016-04-25 2021-09-01 美商創新先進材料股份有限公司 含有瀉流源的沉積系統及相關方法
KR20180007387A (ko) * 2016-07-12 2018-01-23 삼성디스플레이 주식회사 박막 증착 장치
KR20180016693A (ko) * 2016-08-05 2018-02-19 삼성디스플레이 주식회사 선형 증착원 및 이를 포함하는 증착 장치
CN107955936A (zh) * 2017-12-28 2018-04-24 深圳市华星光电半导体显示技术有限公司 蒸发源和蒸镀设备
JP2020002388A (ja) * 2018-06-25 2020-01-09 株式会社アルバック 真空蒸着装置用の蒸着源
US11769652B2 (en) * 2018-07-31 2023-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Devices and methods for controlling wafer uniformity in plasma-based process

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6668939B2 (en) * 2001-06-04 2003-12-30 Larry L. Schmidt Piercing nozzle
US20040129212A1 (en) * 2002-05-20 2004-07-08 Gadgil Pradad N. Apparatus and method for delivery of reactive chemical precursors to the surface to be treated
JP2007500794A (ja) * 2003-05-16 2007-01-18 エスブイティー アソーシエイツ インコーポレイテッド 薄膜蒸着エバポレーター
CN102154628B (zh) * 2004-08-02 2014-05-07 维高仪器股份有限公司 用于化学气相沉积反应器的多气体分配喷射器
US7279421B2 (en) * 2004-11-23 2007-10-09 Tokyo Electron Limited Method and deposition system for increasing deposition rates of metal layers from metal-carbonyl precursors
KR20060060994A (ko) * 2004-12-01 2006-06-07 삼성에스디아이 주식회사 증착 소스 및 이를 구비한 증착 장치
JP4440837B2 (ja) * 2005-01-31 2010-03-24 三星モバイルディスプレイ株式會社 蒸発源及びこれを採用した蒸着装置
JP4545010B2 (ja) * 2005-02-18 2010-09-15 日立造船株式会社 蒸着装置
KR100980729B1 (ko) * 2006-07-03 2010-09-07 주식회사 야스 증착 공정용 다중 노즐 증발원
WO2008004792A1 (en) * 2006-07-03 2008-01-10 Yas Co., Ltd. Multiple nozzle evaporator for vacuum thermal evaporation
KR20080097505A (ko) * 2007-05-02 2008-11-06 주성엔지니어링(주) 박막 증착 장치
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
WO2010110871A2 (en) * 2009-03-25 2010-09-30 Veeco Instruments Inc. Deposition of high vapor pressure materials
JP4782219B2 (ja) * 2009-07-02 2011-09-28 三菱重工業株式会社 真空蒸着装置
KR100977374B1 (ko) * 2009-08-03 2010-08-20 텔리오솔라 테크놀로지스 인크 대면적 박막형 ｃｉｇｓ 태양전지 고속증착 및 양산장비, 그 공정방법
KR20110024223A (ko) * 2009-09-01 2011-03-09 주식회사 선익시스템 증발 장치 및 이를 포함하는 진공 증착 장치

Also Published As

Publication number Publication date
KR20120129812A (ko) 2012-11-28
PL2524974T3 (pl) 2014-09-30
EP2524974B1 (en) 2014-05-07
JP2012241285A (ja) 2012-12-10
CN102787298A (zh) 2012-11-21
KR101976674B1 (ko) 2019-05-09
EP2524974A1 (en) 2012-11-21
US20120295014A1 (en) 2012-11-22
SG185895A1 (en) 2012-12-28
ES2486307T3 (es) 2014-08-18

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