DK2381750T5 - Forstærket klæbeforbindelse med åbent hul - Google Patents
Forstærket klæbeforbindelse med åbent hul Download PDFInfo
- Publication number
- DK2381750T5 DK2381750T5 DK11152541.6T DK11152541T DK2381750T5 DK 2381750 T5 DK2381750 T5 DK 2381750T5 DK 11152541 T DK11152541 T DK 11152541T DK 2381750 T5 DK2381750 T5 DK 2381750T5
- Authority
- DK
- Denmark
- Prior art keywords
- pcb
- holes
- conductive
- conductive material
- pcbs
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Claims (6)
1. Fremgangsmåde til at forbinde en første fleksibel printplade (PCB) (12) med en anden fleksibel PCB (16), hvilken fremgangsmåde omfatter: at tilvejebringe (202, 302) den første fleksible PCB (12) med huller (14) på kontaktsteder der skal kobles elektrisk med den anden fleksible PCB (16), hvor den første fleksible PCB (12) omfatter ledende materiale (11) ved hullerne (14), og hvor det ledende materiale (11) er tilvejebragt på begge sider af den første fleksible PCB ved hullerne (14) i en ringform; at tilvejebringe (204, 304) den anden fleksible PCB (16) med elektriske underlag (17) svarende til hullerne (14) ved kontaktstederne; at påføre (206, 306) et ikke-ledende materiale (13) mellem den første PCB (12) og den anden PCB (16) med afstand for hver de elektriske underlag (17); at tilpasse (208, 308) den første PCB (12) med den anden PCB (16) således at hullerne (14) i den første PCB (12) er på linje med de tilsvarende elektriske underlag (17) på den anden PCB (16); at klæbe (212, 310) en del af flade områder på første og anden PCB'er (12, 16) sammen; at fordele (214, 312) et ledende klæbestof (18) i hullerne (14) for at fylde mellemrummet dannet af hullerne (14), svarende til afstandene af det ikke-ledende materiale (13), og de tilsvarende elektriske underlag (17), hvor det ledende klæbestof (18) fordeles på det ledende materiale (11) på begge sider af den første fleksible PCB (12); hvor fordeling af ledende klæbestof (18) i hullerne udføres med en nåleteknik eller dispense jetting teknik; og at hærde (216, 314) det ledende klæbestof (18).
2. Fremgangsmåde ifølge krav 1, hvor det ikke-ledende materiale (13) er en ikke-ledende klæbefilm og afstandene af det ikke-ledende materiale er skærehuller i klæbefilmen på kontaktstederne.
3. Fremgangsmåde ifølge krav 1, hvor det ikke-ledende materiale (13) er en ikke-ledende masse og afstandene af det ikke-ledende materiale udelukker den ikke-ledende masse på kontaktstederne.
4. Fremgangsmåde ifølge krav 1, hvor en størrelse på underlaget (17) er større end en størrelse på hullerne (14).
5. Fremgangsmåde ifølge krav 1, hvor bindingen udføres med varme og tryk under anvendelse af det ikke-ledende materiale til mekanisk forbindelse af første og anden PCB'er.
6. Fremgangsmåde ifølge krav 1, hvor hærdningen udføres med varme.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/764,854 US8354595B2 (en) | 2010-04-21 | 2010-04-21 | Adhesive reinforced open hole interconnect |
Publications (2)
Publication Number | Publication Date |
---|---|
DK2381750T3 DK2381750T3 (da) | 2017-09-25 |
DK2381750T5 true DK2381750T5 (da) | 2017-10-16 |
Family
ID=44131713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK11152541.6T DK2381750T5 (da) | 2010-04-21 | 2011-01-28 | Forstærket klæbeforbindelse med åbent hul |
Country Status (5)
Country | Link |
---|---|
US (1) | US8354595B2 (da) |
EP (1) | EP2381750B1 (da) |
DK (1) | DK2381750T5 (da) |
ES (1) | ES2640778T3 (da) |
IL (1) | IL210536A (da) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6027372B2 (ja) * | 2012-08-29 | 2016-11-16 | 住友電工プリントサーキット株式会社 | 両面プリント配線板及びその製造方法 |
JP2015207330A (ja) * | 2014-04-21 | 2015-11-19 | 日東電工株式会社 | 回路付サスペンション基板 |
US9679593B2 (en) * | 2014-09-22 | 2017-06-13 | Seagate Technology Llc | Circuit connection pad design for improved electrical robustness using conductive epoxy |
CN105764299B (zh) * | 2014-12-19 | 2018-09-25 | 鹏鼎控股(深圳)股份有限公司 | 散热结构及其制作方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5274912A (en) | 1992-09-01 | 1994-01-04 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
US5920123A (en) * | 1997-01-24 | 1999-07-06 | Micron Technology, Inc. | Multichip module assembly having via contacts and method of making the same |
US6026564A (en) * | 1998-04-10 | 2000-02-22 | Ang Technologies Inc. | Method of making a high density multilayer wiring board |
US6187652B1 (en) * | 1998-09-14 | 2001-02-13 | Fujitsu Limited | Method of fabrication of multiple-layer high density substrate |
JP3813418B2 (ja) | 2000-07-21 | 2006-08-23 | アルプス電気株式会社 | フレキシブル多層配線基板 |
TW536926B (en) * | 2001-03-23 | 2003-06-11 | Fujikura Ltd | Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
DE10126655A1 (de) * | 2001-06-01 | 2002-12-05 | Endress & Hauser Gmbh & Co Kg | Leiterplatte mit mindestens einem elektronischen Bauteil |
US20060272850A1 (en) * | 2005-06-06 | 2006-12-07 | Matsushita Electric Industrial Co., Ltd. | Interlayer connection conductor and manufacturing method thereof |
US7525498B2 (en) | 2006-10-11 | 2009-04-28 | Raytheon Company | Antenna array |
JP4468464B2 (ja) * | 2008-03-28 | 2010-05-26 | 株式会社東芝 | フレキシブルプリント配線板および電子機器 |
-
2010
- 2010-04-21 US US12/764,854 patent/US8354595B2/en active Active
-
2011
- 2011-01-10 IL IL210536A patent/IL210536A/en active IP Right Grant
- 2011-01-28 DK DK11152541.6T patent/DK2381750T5/da active
- 2011-01-28 EP EP11152541.6A patent/EP2381750B1/en active Active
- 2011-01-28 ES ES11152541.6T patent/ES2640778T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
DK2381750T3 (da) | 2017-09-25 |
EP2381750B1 (en) | 2017-07-05 |
IL210536A0 (en) | 2011-06-30 |
US8354595B2 (en) | 2013-01-15 |
IL210536A (en) | 2013-10-31 |
US20110261539A1 (en) | 2011-10-27 |
EP2381750A1 (en) | 2011-10-26 |
ES2640778T3 (es) | 2017-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI785211B (zh) | 瞬接式射頻(rf)互連構造 | |
FI122128B (fi) | Menetelmä piirilevyrakenteen valmistamiseksi | |
FI117812B (fi) | Komponentin sisältävän kerroksen valmistaminen | |
EP2577724B1 (en) | Method of manufacturing printed circuit board | |
DK2381750T3 (da) | Forstærket klæbeforbindelse med åbent hul | |
JP2008294381A (ja) | 電子部品モジュール及び電子部品モジュールの製造方法 | |
US9480172B2 (en) | Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board | |
US11605569B2 (en) | Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit | |
US9999136B2 (en) | Method for fabrication of an electronic module and electronic module | |
US9793218B2 (en) | Method for manufacturing device embedded substrate, and device embedded substrate | |
TWI733829B (zh) | 多層線路板的製造方法 | |
US9049789B2 (en) | Mounting adapter, printed board, and manufacturing method thereof | |
CN108353500A (zh) | 基板装置及制造基板装置的方法 | |
KR101602318B1 (ko) | 에이씨에프를 이용한 임베디드 연성회로기판의 제조방법 | |
JP6433604B2 (ja) | 非可逆回路素子、非可逆回路装置およびこれらの製造方法 | |
KR101602725B1 (ko) | 에이씨에프를 이용한 임베디드 연성회로기판의 제조방법 | |
JP2022547951A (ja) | アディティブ製造技術(amt)反転パッドインタフェース | |
US8493071B1 (en) | Shorted test structure | |
US20180156841A1 (en) | Structure and Method of Making Circuitized Substrate Assembly | |
CN108282954B (zh) | 一种电路板、电子设备和电路板制作方法 | |
US9532465B2 (en) | Method of fabricating a printed circuit board interconnect assembly | |
CN107026666A (zh) | 无线通信组件 | |
US10750617B2 (en) | Bond-free interconnect between a microcircuit housing and a printed circuit assembly | |
US20080232074A1 (en) | Circuit Card Assembly Including Individually Testable Layers | |
US20020189861A1 (en) | Method and apparatus to establish circuit layers interconnections |