DK2117755T3 - Fremgangsmåde til sammenføjning af justerede, diskrete, optiske elementer - Google Patents
Fremgangsmåde til sammenføjning af justerede, diskrete, optiske elementer Download PDFInfo
- Publication number
- DK2117755T3 DK2117755T3 DK08700854.6T DK08700854T DK2117755T3 DK 2117755 T3 DK2117755 T3 DK 2117755T3 DK 08700854 T DK08700854 T DK 08700854T DK 2117755 T3 DK2117755 T3 DK 2117755T3
- Authority
- DK
- Denmark
- Prior art keywords
- solder
- joined
- optical elements
- application
- gas
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 35
- 230000003287 optical effect Effects 0.000 title claims description 31
- 238000005304 joining Methods 0.000 title claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 57
- 239000007789 gas Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 2
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 239000006023 eutectic alloy Substances 0.000 claims description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 230000007704 transition Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001912 gas jet deposition Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008105 immune reaction Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Claims (13)
1. Fremgangsmåde til sammenføjning af justerede, diskrete, optiske elementer, hvorved overfladeområder på det optiske element, der skal sammenføjes, udstyres med i det mindste et tyndt metallag og efterfølgende vædes med et flydende loddemiddel, som berøringsløst doseres; hvorved det flusmiddelfrie, smeltede loddemiddel via en dyse ved anvendelse af en under tryk stående gasstrøm som flydende loddemiddel fra dysen påføres på overfladeområderne, der skal sammenføjes, hvorved loddemidlet fordeles jævnt over overfladeområder, som skal sammenføjes, ved hjælp af energien i gastrykket for den anvendte gasstrømning og flydende i doseret form påføres med et loddemiddelvolumen på 0,005 mm3 til 1,5 mm3 per mm2 areal.
2. Fremgangsmåde ifølge krav 1, kendetegnet ved, at loddemidlet påføres i en fugespalte.
3. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at der dannes tyndmetallag med titan, chrom, guld, wolfram og/eller platin.
4. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at et øvre tyndmetallag, på hvilket loddemidlet påføres, dannes af guld.
5. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at der som loddemiddel anvendes en eutektisk legering.
6. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at en guld-tin-legering, en sølv-tin-legering eller en bismuth-tin-legering anvendes som loddemiddel.
7. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at der anvendes en inert gas til dannelse af gasstrømmen.
8. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at loddemidlet smeltes ved anvendelse af laser-bestråling før dets påføring.
9. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at der med loddemidlet og et tyndt metallisk lag eller et tykt metallisk lag dannes inter-metalliske faser eller blandingskrystaller inden i et overgangsområde.
10. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at påføringen af loddemidlet gennemføres i impulser.
11. Fremgangsmåde ifølge krav 10, kendetegnet ved, at der ved den impulsstyrede påføring sker en ændring af positionen for påføringen på overfladeområdet, der skal sammenføjes.
12. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at en applikator for loddemateriale bevæges og positioneres tredimensionalt.
13. Fremgangsmåde ifølge krav 12, kendetegnet ved, at applikatoren styres elektronisk.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007002436A DE102007002436B4 (de) | 2007-01-09 | 2007-01-09 | Verfahren zum Fügen justierter diskreter optischer Elemente |
| PCT/DE2008/000038 WO2008083676A1 (de) | 2007-01-09 | 2008-01-08 | Verfahren zum fügen justierter diskreter optischer elemente |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK2117755T3 true DK2117755T3 (da) | 2018-06-06 |
Family
ID=39288164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK08700854.6T DK2117755T3 (da) | 2007-01-09 | 2008-01-08 | Fremgangsmåde til sammenføjning af justerede, diskrete, optiske elementer |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8431477B2 (da) |
| EP (1) | EP2117755B1 (da) |
| JP (1) | JP2010515939A (da) |
| DE (1) | DE102007002436B4 (da) |
| DK (1) | DK2117755T3 (da) |
| ES (1) | ES2671371T3 (da) |
| WO (1) | WO2008083676A1 (da) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009022079A1 (de) | 2009-05-20 | 2010-11-25 | Friedrich-Schiller-Universität Jena | Gefasste optische Komponente, Verfahren zu deren Herstellung sowie deren Verwendung |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3648915A (en) * | 1967-02-24 | 1972-03-14 | Bosch Gmbh Robert | Arrangement for soldering a terminal to a semiconductor |
| DE2622000A1 (de) * | 1976-05-18 | 1977-12-01 | Bosch Gmbh Robert | Verfahren und vorrichtung zum anloeten eines drahtes |
| JPH0736956B2 (ja) * | 1988-05-30 | 1995-04-26 | 沖電気工業株式会社 | 電子部品のハンダ付装置 |
| JP2929545B2 (ja) * | 1989-10-25 | 1999-08-03 | 株式会社日立製作所 | 半導体集積回路装置の製造方法および製造装置 |
| WO1991019016A1 (en) * | 1990-05-19 | 1991-12-12 | Institut Teoreticheskoi I Prikladnoi Mekhaniki Sibirskogo Otdelenia Akademii Nauk Sssr | Method and device for coating |
| JPH0623530A (ja) * | 1992-04-28 | 1994-02-01 | Omron Corp | レーザ照射型ハンダ接合装置 |
| US5478005A (en) | 1994-06-27 | 1995-12-26 | At&T Corp. | Apparatus and method for fluxless soldering |
| US6962834B2 (en) | 2002-03-22 | 2005-11-08 | Stark David H | Wafer-level hermetic micro-device packages |
| DE10240355B4 (de) | 2002-08-27 | 2008-01-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verbundbauteil und Verfahren zur Herstellung eines Verbundbauteiles |
| JP2005024697A (ja) * | 2003-06-30 | 2005-01-27 | Hitachi Maxell Ltd | 光学モジュール、光学モジュールの応力緩和方法および光学モジュール製造方法 |
| JP3845076B2 (ja) * | 2003-07-15 | 2006-11-15 | 日立マクセル株式会社 | 光学モジュール、光学モジュールの熱応力解放方法および光学モジュール用光学基板 |
| DE102004024755B4 (de) | 2004-05-12 | 2006-02-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Halterung für optische Elemente |
| JP4338204B2 (ja) | 2005-03-30 | 2009-10-07 | Ｔｄｋ株式会社 | 半田付け方法及び半田付け装置並びに接合方法及び接合装置 |
| JP4042914B2 (ja) * | 2005-04-22 | 2008-02-06 | Ｔｄｋ株式会社 | 半田付け装置及び半田分配装置 |
-
2007
- 2007-01-09 DE DE102007002436A patent/DE102007002436B4/de active Active
-
2008
- 2008-01-08 EP EP08700854.6A patent/EP2117755B1/de active Active
- 2008-01-08 JP JP2009545062A patent/JP2010515939A/ja active Pending
- 2008-01-08 WO PCT/DE2008/000038 patent/WO2008083676A1/de active Application Filing
- 2008-01-08 DK DK08700854.6T patent/DK2117755T3/da active
- 2008-01-08 US US12/522,366 patent/US8431477B2/en active Active
- 2008-01-08 ES ES08700854.6T patent/ES2671371T3/es active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US8431477B2 (en) | 2013-04-30 |
| ES2671371T3 (es) | 2018-06-06 |
| US20100038348A1 (en) | 2010-02-18 |
| JP2010515939A (ja) | 2010-05-13 |
| EP2117755B1 (de) | 2018-03-14 |
| DE102007002436A1 (de) | 2008-07-24 |
| EP2117755A1 (de) | 2009-11-18 |
| WO2008083676A1 (de) | 2008-07-17 |
| DE102007002436B4 (de) | 2008-09-25 |
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