DK1772900T3 - Fabrikationsfremgangsmåde for en indretning med effekthalvlederkomponenter omfattende et tryksintringstrin - Google Patents

Fabrikationsfremgangsmåde for en indretning med effekthalvlederkomponenter omfattende et tryksintringstrin

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Publication number
DK1772900T3
DK1772900T3 DK06020799.0T DK06020799T DK1772900T3 DK 1772900 T3 DK1772900 T3 DK 1772900T3 DK 06020799 T DK06020799 T DK 06020799T DK 1772900 T3 DK1772900 T3 DK 1772900T3
Authority
DK
Denmark
Prior art keywords
manufacturing
power semiconductor
component
semiconductor components
sintering step
Prior art date
Application number
DK06020799.0T
Other languages
English (en)
Inventor
Dirk Heidenreich
Thomas Dr Stockmeier
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK1772900T3 publication Critical patent/DK1772900T3/da

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
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    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27Manufacturing methods
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    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DK06020799.0T 2005-10-05 2006-10-04 Fabrikationsfremgangsmåde for en indretning med effekthalvlederkomponenter omfattende et tryksintringstrin DK1772900T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005047566A DE102005047566C5 (de) 2005-10-05 2005-10-05 Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu

Publications (1)

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DK1772900T3 true DK1772900T3 (da) 2012-07-23

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DK06020799.0T DK1772900T3 (da) 2005-10-05 2006-10-04 Fabrikationsfremgangsmåde for en indretning med effekthalvlederkomponenter omfattende et tryksintringstrin

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EP (1) EP1772900B1 (da)
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AT (1) ATE555498T1 (da)
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