DK176137B1 - Flowfordelingsenhed og köleenhed med bypassflow - Google Patents

Flowfordelingsenhed og köleenhed med bypassflow Download PDF

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Publication number
DK176137B1
DK176137B1 DK200301576A DKPA200301576A DK176137B1 DK 176137 B1 DK176137 B1 DK 176137B1 DK 200301576 A DK200301576 A DK 200301576A DK PA200301576 A DKPA200301576 A DK PA200301576A DK 176137 B1 DK176137 B1 DK 176137B1
Authority
DK
Denmark
Prior art keywords
flow
cell
liquid
channel
inlet
Prior art date
Application number
DK200301576A
Other languages
Danish (da)
English (en)
Inventor
Klaus Kristen Olesen
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Priority to DK200301576A priority Critical patent/DK176137B1/da
Priority to AT04762954T priority patent/ATE364988T1/de
Priority to US10/577,027 priority patent/US7360582B2/en
Priority to PCT/DK2004/000736 priority patent/WO2005041627A2/fr
Priority to EP04762954A priority patent/EP1683404B1/fr
Priority to DE602004007031T priority patent/DE602004007031T2/de
Publication of DK200301576A publication Critical patent/DK200301576A/da
Application granted granted Critical
Publication of DK176137B1 publication Critical patent/DK176137B1/da

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
DK200301576A 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow DK176137B1 (da)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DK200301576A DK176137B1 (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow
AT04762954T ATE364988T1 (de) 2003-10-27 2004-10-26 Strömungsverteilungseinheit und kühleinheit mit bypass-strömung
US10/577,027 US7360582B2 (en) 2003-10-27 2004-10-26 Flow distributing unit and cooling unit having bypass flow
PCT/DK2004/000736 WO2005041627A2 (fr) 2003-10-27 2004-10-26 Unite de distribution de flux, et unite de refroidissement a flux en derivation
EP04762954A EP1683404B1 (fr) 2003-10-27 2004-10-26 Unite de distribution de flux, et unite de refroidissement a flux en derivation
DE602004007031T DE602004007031T2 (de) 2003-10-27 2004-10-26 Strömungsverteilungseinheit und kühleinheit mit bypass-strömung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK200301576 2003-10-27
DK200301576A DK176137B1 (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow

Publications (2)

Publication Number Publication Date
DK200301576A DK200301576A (da) 2005-04-28
DK176137B1 true DK176137B1 (da) 2006-09-25

Family

ID=34485963

Family Applications (1)

Application Number Title Priority Date Filing Date
DK200301576A DK176137B1 (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow

Country Status (6)

Country Link
US (1) US7360582B2 (fr)
EP (1) EP1683404B1 (fr)
AT (1) ATE364988T1 (fr)
DE (1) DE602004007031T2 (fr)
DK (1) DK176137B1 (fr)
WO (1) WO2005041627A2 (fr)

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EP1742264A3 (fr) * 2005-07-05 2008-05-28 Danfoss Silicon Power GmbH Module monolithique de puissance refroidi par fluide et méthode de fabrication
US7427566B2 (en) * 2005-12-09 2008-09-23 General Electric Company Method of making an electronic device cooling system
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
US8746330B2 (en) * 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US20110226448A1 (en) * 2008-08-08 2011-09-22 Mikros Manufacturing, Inc. Heat exchanger having winding channels
US8474516B2 (en) * 2008-08-08 2013-07-02 Mikros Manufacturing, Inc. Heat exchanger having winding micro-channels
US20100294461A1 (en) * 2009-05-22 2010-11-25 General Electric Company Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the same
DE102009051864B4 (de) * 2009-11-04 2023-07-13 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung für eine elektrische Einrichtung
KR101209686B1 (ko) * 2010-12-03 2012-12-10 기아자동차주식회사 하이브리드 및 전기 자동차용 전기장치의 냉각장치
WO2012112262A1 (fr) 2011-02-18 2012-08-23 Husky Injection Molding Systems Ltd Système d'outil de moule comprenant un ensemble collecteur monobloc dont les entrées sont en communication fluidique avec les sorties
US8982558B2 (en) 2011-06-24 2015-03-17 General Electric Company Cooling device for a power module, and a related method thereof
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2014141162A1 (fr) 2013-03-15 2014-09-18 Coolit Systems, Inc. Capteurs, techniques de communication multiplexée et systèmes associés
EP2592633B1 (fr) * 2011-11-14 2017-06-14 Cressall Resistors Limited Dispositif de résistance à refroidissement par liquide
EP2719985B1 (fr) * 2012-10-09 2015-08-26 Danfoss Silicon Power GmbH Module de distribution de flux avec plaque de couverture à motifs
EP2884198B1 (fr) * 2013-12-13 2016-11-23 Eberspächer catem GmbH & Co. KG Dispositif de chauffage électrique
EP2884199B1 (fr) * 2013-12-13 2016-11-23 Eberspächer catem GmbH & Co. KG Dispositif de chauffage électrique
CN104750207A (zh) * 2013-12-30 2015-07-01 鸿富锦精密工业(武汉)有限公司 散热模组
DE102014104194B4 (de) * 2014-03-26 2021-02-25 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
CN105185750B (zh) * 2015-09-06 2019-01-25 株洲南车时代电气股份有限公司 一种功率模块密封装置
US9941036B2 (en) 2016-02-02 2018-04-10 Raytheon Company Modular, high density, low inductance, media cooled resistor
US10059103B2 (en) * 2016-05-27 2018-08-28 Sii Printek Inc. Liquid jet head and liquid jet apparatus
US10249554B2 (en) 2017-06-20 2019-04-02 General Electric Company Heat transfer assembly for a heat emitting device
US10822096B2 (en) 2018-03-30 2020-11-03 Ge Aviation Systems Llc Avionics cooling module
US10405466B1 (en) * 2018-06-14 2019-09-03 Ford Global Technologies, Llc Power-module assembly with endcap
US10533809B1 (en) 2018-07-06 2020-01-14 Keysight Technologies, Inc. Cooling apparatus and methods of use
DE102018217652A1 (de) * 2018-10-15 2020-04-16 Danfoss Silicon Power Gmbh Strömungsverteiler zum Kühlen einer elektrischen Baugruppe, ein Halbleitermodul mit einem derartigen Strömungsverteiler und ein Verfahren zu dessen Herstellung
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11350544B2 (en) * 2020-03-24 2022-05-31 International Business Machines Corporation Flexible cold plate with parallel fluid flow paths
EP4150216A4 (fr) 2020-05-11 2023-11-01 Coolit Systems, Inc. Unités de pompage de liquide, et systèmes et procédés associés
US20220026137A1 (en) * 2020-07-22 2022-01-27 Nidec Corporation Cooler
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US11740028B2 (en) * 2021-06-18 2023-08-29 Dana Canada Corporation Two-pass heat exchanger with calibrated bypass

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US20060113063A1 (en) * 2004-10-15 2006-06-01 Lalit Chordia Thin-plate microchannel structure

Also Published As

Publication number Publication date
DE602004007031T2 (de) 2008-02-14
EP1683404A2 (fr) 2006-07-26
DK200301576A (da) 2005-04-28
US20070119574A1 (en) 2007-05-31
DE602004007031D1 (de) 2007-07-26
US7360582B2 (en) 2008-04-22
WO2005041627A3 (fr) 2005-06-30
ATE364988T1 (de) 2007-07-15
WO2005041627A2 (fr) 2005-05-06
EP1683404B1 (fr) 2007-06-13

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PUP Patent expired

Expiry date: 20231027