WO2005125296A1 - Dispositif de refroidissement pour circuit électrique - Google Patents

Dispositif de refroidissement pour circuit électrique Download PDF

Info

Publication number
WO2005125296A1
WO2005125296A1 PCT/CA2005/000841 CA2005000841W WO2005125296A1 WO 2005125296 A1 WO2005125296 A1 WO 2005125296A1 CA 2005000841 W CA2005000841 W CA 2005000841W WO 2005125296 A1 WO2005125296 A1 WO 2005125296A1
Authority
WO
WIPO (PCT)
Prior art keywords
bores
cooling assembly
pair
angled
shaped channel
Prior art date
Application number
PCT/CA2005/000841
Other languages
English (en)
Inventor
Louis-Philippe Bibeau
Jean-François LAVIGNE
Original Assignee
Tm4 Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tm4 Inc. filed Critical Tm4 Inc.
Publication of WO2005125296A1 publication Critical patent/WO2005125296A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to cooling devices. More specifically, the present invention is concerned with a cooling device to which an electric circuit is to be mounted.
  • Cooling devices are well known in the art of electric circuits.
  • Fluids are often used to collect the heat and to transfer it from the vicinity of the electronic components to the vicinity of the dissipating element.
  • An object of the present invention is therefore to provide a cooling device for an electric circuit.
  • a cooling assembly for an electric circuit; said cooling assembly comprising a generally planar body including an electric circuit receiving surface, a front edge and a rear edge; said body being provided with a cooling circuit having: an inlet; an outlet; at least two pair of bores provided on said edge; each pair of bores being so configured and sized as to define a V-shaped channel; said bores being so distanced on said edge that each said V-shaped channel intersects with at least one adjacent V-shaped channel; intersections of said V- shaped channels being closed via plugs; one of said at least two pair of bores being associated with said inlet and another of said at least two pair of bores being associated with said outlet.
  • a cooling assembly for an electric circuit; said cooling assembly comprising a generally planar body including an electric circuit receiving surface and a front edge provided with at least two pair of bores each defining V-shaped channels; said cooling assembly further comprises plugs so inserted into said bores as to close intersections of said V-shaped channels, an inlet and an outlet.
  • Figure 1 is a perspective view of a cooling device according to a first embodiment of the present invention
  • Figure 2 is a top sectional view of the cooling device of Figure
  • Figure 3 is an enlargement of a portion of Figure 2, illustrating two bores interconnected by a plug
  • Figure 4 is a top sectional view of a cooling device according to a second embodiment of the present invention.
  • Figure 5 is a top sectional view of a cooling device according to a third embodiment of the present invention.
  • Figure 6 is a top sectional view of a cooling device according to a third embodiment of the present invention.
  • Figure 7 is an enlargement of a portion of Figure 6, illustrating two bores interconnected by a plug.
  • the present invention proposes to use a cooling body having a circuit receiving surface and provided with a plurality of bores that interconnect to form a cooling circuit having an inlet and an outlet provided on edges of the cooling body.
  • the interconnection between the various bores is done via the crossing of bores or via plugs that close selected bores and that are provided on the edges of the body.
  • Figure 1 of the appended drawings is a perspective view illustrating a cooling device 10 according to a first non-restrictive embodiment of the present invention.
  • the cooling device 10 includes a generally planar cooling body 12 having a circuit receiving surface 14.
  • An electric circuit (not shown) may be mounted to the surface 14 via fasteners (not shown).
  • the cooling body 12 is made of a single piece of heat conductive material, such as for example aluminum, that may be machined or otherwise formed into the desired shape.
  • the cooling body 12 is formed with a plurality of V-shaped channels each defined by a straight bore 16 and an angled bore 18; one transversal bore 20; an inlet 22 and an outlet 24.
  • the straight bores 16 being aligned with an axis of the body 12.
  • the straight and angled bores 16 and 18 are made from the front edge 26 of the cooling body 12, for example by a drilling process, to yield the V-shaped channels.
  • the straight bores 16 are equally distanced and go from the front edge 26 almost to the rear edge 28.
  • the main function of the angled bores 18 is to interconnect the bottom of one straight bore 16 to the opening of an adjacent straight bore 16.
  • the angle of the angle bores 18 is therefore dictated by the length of the straight bore 16 and by the distance separating two adjacent straight bores 16.
  • a straight hole 30 is made at the junction of the opening of the straight and angled bores.
  • These straight holes 30 are so configured and sized as to receive a deformable plug 32 therein.
  • a deformable plug 32 is also inserted in the opening of the transversal bore 20 to properly close it.
  • Deformable plugs are well known in the art and will not be described in detail herein.
  • the BetaplugTM manufactured by the Lee Company, Westbrook, CT, USA has been found an adequate plug 32.
  • the dimensions of the straight holes 30 are advantageously in accord with the maker's directives.
  • cooling circuit extends from the inlet 22 to the outlet 24 as can be visualized by the arrows 34.
  • connectors are mounted to the inlet 22 and outlet 24 to allow connection to a cooling fluid source (not shown).
  • the main steps are the formation of the body 12 having the required dimensions; the drilling of the straight, angled and transversal bores 16, 18 and 20 (by using a drill-press, for example); the drilling of the straight holes 30 (by using a drill-press, for example); the insertion of the deformable plugs 32 in the straight holes 30; the deformation of the deformable plugs 32 to seal the holes 30; and the installation of the connectors (not shown) to the inlet and outlet 22 and 24.
  • the holes 30 may require the tapering of the holes 30.
  • the instructions of the plug manufacturer should be followed to insure a fluid tight closing of the holes 30.
  • the deformable plugs 32 are all positioned on the surface of the body 12. Indeed, should a leak occur, it would be easy to notice and to repair.
  • FIG. 4 of the appended drawings a cooling device 100 according to a second illustrative embodiment of the present invention will be described. It is to be noted that since the cooling device 100 is very similar to the cooling device 10 described hereinabove with reference to Figures 1 to 3, only the main differences between these cooling devices will be described hereinbelow. [0034] Generally stated, the main difference between the cooling device 100 and the cooling device 10 is that the all the plugged bores of the cooling device 100 are provided on the front edge 102 thereof. To obtain this configuration, one of the V-shaped channels is inverted with respect to the others.
  • this configuration yields a portion that is less cooled than the rest of the device 100 (see dotted portion 104).
  • This portion 104 may be positioned anywhere on the cooling device 100 during the design, depending on the position of the heat generating components (not shown) of the electric circuit (not shown).
  • FIG. 5 of the appended drawings a cooling device 200 according to a third illustrative embodiment of the present invention will be described. It is to be noted that since the cooling device 200 is very similar to the cooling device 10 described hereinabove with reference to Figures 1 to 3, only the main differences between these cooling devices will be described hereinbelow.
  • the cooling device 200 includes only angled bores 202 that are provided between the front edge 204 and the rear edge 206 of the body 208. Accordingly, plugs are used on both the front and rear edges 204 and 206 to form the cooling circuit.
  • the cooling device 300 is very similar to the cooling device of 200 of Figure 5. Accordingly, for concision purposes, only the differences between these cooling devices will be described herein.
  • the cooling device 300 has two features that are concerned with improving the flow of fluid from the inlet 302 to the outlet 304.
  • the first feature improving the flow is the removal of the pointed junction between adjacent angled bores 306. These pointed junctions are machined once the angled bores 306 and straight holes 308 are done. The machining takes place through the straight holes 308. As can be seen from Figure 6, this feature allows the cooling fluid to flow with less restriction (see arrows 310).
  • the second feature improving the fluid flow is the concave shape of the bottom 312 of the plug 314. Indeed, this concave bottom 312 helps reduce the turbulence of the cooling fluid (see arrow 316), thereby improving the flow of cooling fluid.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Dispositif de refroidissement sur lequel un circuit électrique peut être monté et comprenant un corps de refroidissement avec une face avant comportant des trous formant des canaux en 'V' à l'intérieur du corps. Les canaux en 'V' sont obturés par des bouchons pour définir un circuit de refroidissement continu à l'intérieur du corps de refroidissement.
PCT/CA2005/000841 2004-06-15 2005-06-01 Dispositif de refroidissement pour circuit électrique WO2005125296A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57925004P 2004-06-15 2004-06-15
US60/579,250 2004-06-15

Publications (1)

Publication Number Publication Date
WO2005125296A1 true WO2005125296A1 (fr) 2005-12-29

Family

ID=35510164

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA2005/000841 WO2005125296A1 (fr) 2004-06-15 2005-06-01 Dispositif de refroidissement pour circuit électrique

Country Status (2)

Country Link
US (1) US20050284611A1 (fr)
WO (1) WO2005125296A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007012402A1 (fr) * 2005-07-26 2007-02-01 Bosch Rexroth Ag Ensemble vanne et dispositif de refroidissement

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10203167B2 (en) * 2015-08-25 2019-02-12 Odyssey Technical Solutions, Llc Matching network cooling block
US11589477B2 (en) * 2019-09-24 2023-02-21 Hewlett Packard Enterprise Development Lp Void free injection-molded cold plates

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4363080A (en) * 1980-09-02 1982-12-07 Dentek Systems, Inc. Water-cooled light source
EP0508717B1 (fr) * 1991-04-08 1998-02-04 Harris Corporation Dissipateur de chaleur intégré pour modules semi-conducteurs
WO2000052401A1 (fr) * 1999-02-26 2000-09-08 Nippon Thermostat Co., Ltd. Dispositif de refroidissement pour composants electroniques
US6415811B1 (en) * 1993-11-10 2002-07-09 Zimmermann & Jansen Gmbh Cooled slider plate, particularly a water-cooled hot air slider plate
WO2003060414A1 (fr) * 2002-01-14 2003-07-24 Marconi Intellectual Property (Ringfence) Inc. Ensemble de refroidissement de microplaquette a petite echelle
US20040190254A1 (en) * 2003-03-31 2004-09-30 Intel Corporation Electronic assembly with fluid cooling and associated methods
WO2005041627A2 (fr) * 2003-10-27 2005-05-06 Danfoss Silicon Power Gmbh Unite de distribution de flux, et unite de refroidissement a flux en derivation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1516596A (en) * 1923-04-23 1924-11-25 Goodrich Co B F Hot plate for vulcanizing presses
US1549464A (en) * 1923-05-23 1925-08-11 Southwark Foundry & Machine Co Steam platen
US1621742A (en) * 1925-08-20 1927-03-22 Farrel Foundry And Machine Co Fluid-circulating plate
US1884612A (en) * 1930-03-14 1932-10-25 Southwark Foundry & Machine Co Steam platen
US1905653A (en) * 1931-05-08 1933-04-25 Walter Wood Plug for steam platens and other metallic articles
US2955184A (en) * 1957-02-27 1960-10-04 George E Grindrod Apparatus for precision control of the surface temperature of metallic heaters
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4268850A (en) * 1979-05-11 1981-05-19 Electric Power Research Institute Forced vaporization heat sink for semiconductor devices
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4363080A (en) * 1980-09-02 1982-12-07 Dentek Systems, Inc. Water-cooled light source
EP0508717B1 (fr) * 1991-04-08 1998-02-04 Harris Corporation Dissipateur de chaleur intégré pour modules semi-conducteurs
US6415811B1 (en) * 1993-11-10 2002-07-09 Zimmermann & Jansen Gmbh Cooled slider plate, particularly a water-cooled hot air slider plate
WO2000052401A1 (fr) * 1999-02-26 2000-09-08 Nippon Thermostat Co., Ltd. Dispositif de refroidissement pour composants electroniques
WO2003060414A1 (fr) * 2002-01-14 2003-07-24 Marconi Intellectual Property (Ringfence) Inc. Ensemble de refroidissement de microplaquette a petite echelle
US20040190254A1 (en) * 2003-03-31 2004-09-30 Intel Corporation Electronic assembly with fluid cooling and associated methods
WO2005041627A2 (fr) * 2003-10-27 2005-05-06 Danfoss Silicon Power Gmbh Unite de distribution de flux, et unite de refroidissement a flux en derivation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007012402A1 (fr) * 2005-07-26 2007-02-01 Bosch Rexroth Ag Ensemble vanne et dispositif de refroidissement

Also Published As

Publication number Publication date
US20050284611A1 (en) 2005-12-29

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