DE602004007031D1 - Strömungsverteilungseinheit und kühleinheit mit bypass-strömung - Google Patents

Strömungsverteilungseinheit und kühleinheit mit bypass-strömung

Info

Publication number
DE602004007031D1
DE602004007031D1 DE602004007031T DE602004007031T DE602004007031D1 DE 602004007031 D1 DE602004007031 D1 DE 602004007031D1 DE 602004007031 T DE602004007031 T DE 602004007031T DE 602004007031 T DE602004007031 T DE 602004007031T DE 602004007031 D1 DE602004007031 D1 DE 602004007031D1
Authority
DE
Germany
Prior art keywords
flow
channel
flow channel
cell
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004007031T
Other languages
English (en)
Other versions
DE602004007031T2 (de
Inventor
Klaus Kristen Olesen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Danfoss Silicon Power GmbH
Original Assignee
Danfoss Silicon Power GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power GmbH filed Critical Danfoss Silicon Power GmbH
Publication of DE602004007031D1 publication Critical patent/DE602004007031D1/de
Application granted granted Critical
Publication of DE602004007031T2 publication Critical patent/DE602004007031T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
DE602004007031T 2003-10-27 2004-10-26 Strömungsverteilungseinheit und kühleinheit mit bypass-strömung Expired - Lifetime DE602004007031T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DK200301576A DK176137B1 (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow
DK200301576 2003-10-27
PCT/DK2004/000736 WO2005041627A2 (en) 2003-10-27 2004-10-26 Flow distributing unit and cooling unit having bypass flow

Publications (2)

Publication Number Publication Date
DE602004007031D1 true DE602004007031D1 (de) 2007-07-26
DE602004007031T2 DE602004007031T2 (de) 2008-02-14

Family

ID=34485963

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004007031T Expired - Lifetime DE602004007031T2 (de) 2003-10-27 2004-10-26 Strömungsverteilungseinheit und kühleinheit mit bypass-strömung

Country Status (6)

Country Link
US (1) US7360582B2 (de)
EP (1) EP1683404B1 (de)
AT (1) ATE364988T1 (de)
DE (1) DE602004007031T2 (de)
DK (1) DK176137B1 (de)
WO (1) WO2005041627A2 (de)

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WO2005125296A1 (en) * 2004-06-15 2005-12-29 Tm4 Inc. Cooling device for electric circuit
US7835151B2 (en) * 2004-11-24 2010-11-16 Danfoss Silicon Power Gmbh Flow distribution module and a stack of flow distribution modules
EP1742264A3 (de) * 2005-07-05 2008-05-28 Danfoss Silicon Power GmbH Monolithisches flüssigkeitsgekühltes Leistungsmodul und dessen Herstellungsmethode
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
US7427566B2 (en) * 2005-12-09 2008-09-23 General Electric Company Method of making an electronic device cooling system
US8746330B2 (en) * 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US8474516B2 (en) * 2008-08-08 2013-07-02 Mikros Manufacturing, Inc. Heat exchanger having winding micro-channels
US20110226448A1 (en) * 2008-08-08 2011-09-22 Mikros Manufacturing, Inc. Heat exchanger having winding channels
US20100294461A1 (en) * 2009-05-22 2010-11-25 General Electric Company Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the same
DE102009051864B4 (de) * 2009-11-04 2023-07-13 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung für eine elektrische Einrichtung
KR101209686B1 (ko) * 2010-12-03 2012-12-10 기아자동차주식회사 하이브리드 및 전기 자동차용 전기장치의 냉각장치
WO2012112262A1 (en) 2011-02-18 2012-08-23 Husky Injection Molding Systems Ltd Mold-tool system includes one-piece manifold assembly having each inlet in fluid communication with outlets
US8982558B2 (en) 2011-06-24 2015-03-17 General Electric Company Cooling device for a power module, and a related method thereof
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
EP2592633B1 (de) * 2011-11-14 2017-06-14 Cressall Resistors Limited Flüssigkeitsgekühlte Widerstandsvorrichtung
EP2719985B1 (de) * 2012-10-09 2015-08-26 Danfoss Silicon Power GmbH Durchflussverteilungsmodul mit einer gemusterten Deckplatte
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
EP2884198B1 (de) * 2013-12-13 2016-11-23 Eberspächer catem GmbH & Co. KG Elektrische Heizvorrichtung
EP2884199B1 (de) * 2013-12-13 2016-11-23 Eberspächer catem GmbH & Co. KG Elektrische Heizvorrichtung
CN104750207A (zh) * 2013-12-30 2015-07-01 鸿富锦精密工业(武汉)有限公司 散热模组
DE102014104194B4 (de) * 2014-03-26 2021-02-25 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
CN105185750B (zh) * 2015-09-06 2019-01-25 株洲南车时代电气股份有限公司 一种功率模块密封装置
US9941036B2 (en) 2016-02-02 2018-04-10 Raytheon Company Modular, high density, low inductance, media cooled resistor
US10059103B2 (en) * 2016-05-27 2018-08-28 Sii Printek Inc. Liquid jet head and liquid jet apparatus
US10249554B2 (en) 2017-06-20 2019-04-02 General Electric Company Heat transfer assembly for a heat emitting device
US10822096B2 (en) 2018-03-30 2020-11-03 Ge Aviation Systems Llc Avionics cooling module
US10405466B1 (en) * 2018-06-14 2019-09-03 Ford Global Technologies, Llc Power-module assembly with endcap
US10533809B1 (en) 2018-07-06 2020-01-14 Keysight Technologies, Inc. Cooling apparatus and methods of use
DE102018217652A1 (de) * 2018-10-15 2020-04-16 Danfoss Silicon Power Gmbh Strömungsverteiler zum Kühlen einer elektrischen Baugruppe, ein Halbleitermodul mit einem derartigen Strömungsverteiler und ein Verfahren zu dessen Herstellung
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11350544B2 (en) * 2020-03-24 2022-05-31 International Business Machines Corporation Flexible cold plate with parallel fluid flow paths
WO2021229365A1 (en) 2020-05-11 2021-11-18 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US20220026137A1 (en) * 2020-07-22 2022-01-27 Nidec Corporation Cooler
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US11740028B2 (en) * 2021-06-18 2023-08-29 Dana Canada Corporation Two-pass heat exchanger with calibrated bypass

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Publication number Priority date Publication date Assignee Title
US3524497A (en) * 1968-04-04 1970-08-18 Ibm Heat transfer in a liquid cooling system
US3909118A (en) * 1974-03-04 1975-09-30 Textron Inc Fluid cooled mirror
JPS6288876U (de) * 1985-11-22 1987-06-06
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5841634A (en) * 1997-03-12 1998-11-24 Delco Electronics Corporation Liquid-cooled baffle series/parallel heat sink
US6307871B1 (en) * 1998-09-11 2001-10-23 Cutting Edge Optronics, Inc. Laser system using phase change material for thermal control
CA2343909C (en) * 1999-07-23 2013-04-02 Osram Opto Semiconductors Gmbh & Co. Ohg Arrangement of luminescent materials, wavelength-converting casting compound and light source
JP3448737B2 (ja) * 2000-05-25 2003-09-22 住友重機械工業株式会社 ウエハーチャック用冷却板及びウエハーチャック
US6935411B2 (en) * 2000-06-08 2005-08-30 Mikros Manufacturing, Inc. Normal-flow heat exchanger
DE20208106U1 (de) * 2002-05-24 2002-10-10 Danfoss Silicon Power GmbH, 24837 Schleswig Kühlgerät für Halbleiter mit mehreren Kühlzellen
US20060113063A1 (en) * 2004-10-15 2006-06-01 Lalit Chordia Thin-plate microchannel structure

Also Published As

Publication number Publication date
EP1683404B1 (de) 2007-06-13
DK176137B1 (da) 2006-09-25
DK200301576A (da) 2005-04-28
DE602004007031T2 (de) 2008-02-14
US20070119574A1 (en) 2007-05-31
EP1683404A2 (de) 2006-07-26
WO2005041627A3 (en) 2005-06-30
WO2005041627A2 (en) 2005-05-06
US7360582B2 (en) 2008-04-22
ATE364988T1 (de) 2007-07-15

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