DK1734069T3 - Kompositmateriale - Google Patents
KompositmaterialeInfo
- Publication number
- DK1734069T3 DK1734069T3 DK06253096T DK06253096T DK1734069T3 DK 1734069 T3 DK1734069 T3 DK 1734069T3 DK 06253096 T DK06253096 T DK 06253096T DK 06253096 T DK06253096 T DK 06253096T DK 1734069 T3 DK1734069 T3 DK 1734069T3
- Authority
- DK
- Denmark
- Prior art keywords
- composite material
- component
- resin
- nono
- silica
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/005—Reinforced macromolecular compounds with nanosized materials, e.g. nanoparticles, nanofibres, nanotubes, nanowires, nanorods or nanolayered materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0512610A GB0512610D0 (en) | 2005-06-18 | 2005-06-18 | Composite material |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1734069T3 true DK1734069T3 (da) | 2010-03-29 |
Family
ID=34855889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK06253096T DK1734069T3 (da) | 2005-06-18 | 2006-06-14 | Kompositmateriale |
Country Status (7)
Country | Link |
---|---|
US (1) | US7527250B2 (da) |
EP (1) | EP1734069B1 (da) |
AT (1) | ATE445665T1 (da) |
DE (1) | DE602006009725D1 (da) |
DK (1) | DK1734069T3 (da) |
ES (1) | ES2336476T3 (da) |
GB (2) | GB0512610D0 (da) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7649060B2 (en) | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
DE102008023076A1 (de) * | 2008-05-09 | 2009-11-12 | Henkel Ag & Co. Kgaa | Polymerisierbare Zusammensetzung |
DE102010044456A1 (de) | 2010-09-06 | 2012-03-08 | Siemens Aktiengesellschaft | Infusionsharzformulierung für Faserverbundwerkstoffe |
DE102011003313A1 (de) * | 2011-01-28 | 2012-08-02 | Siemens Aktiengesellschaft | Faserverbundkunststoff sowie Herstellungsverfahren dazu |
WO2013122848A1 (en) * | 2012-02-15 | 2013-08-22 | Dow Global Technologies Llc | Pre-molding article from thermoset polymer dispersions |
WO2013171292A1 (en) * | 2012-05-18 | 2013-11-21 | Hexcel Composites Limited | Fast cure epoxy resins and prepregs obtained therefrom |
CN105008113A (zh) * | 2013-02-26 | 2015-10-28 | 赫克赛尔控股有限责任公司 | 模塑部件的制造 |
ES2869434T3 (es) * | 2014-12-18 | 2021-10-25 | Cytec Ind Inc | Sistemas de resinas modificadas adecuados para la infusión de resinas líquidas |
CN107556749B (zh) * | 2017-08-31 | 2020-01-21 | 哈尔滨工业大学 | 一种配位与阴离子协同催化固化氰酸酯树脂体系及其制备方法 |
US11485833B2 (en) | 2019-10-23 | 2022-11-01 | Hexcel Corporation | Thermoplastic toughened matrix resins containing nanoparticles |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3327007A1 (de) | 1983-07-27 | 1985-02-07 | Hoechst Ag, 6230 Frankfurt | Herstellung von polypeptiden mit einem saeureamid-carboxyterminus |
EP0133281A3 (en) * | 1983-08-01 | 1988-11-30 | American Cyanamid Company | Curable fibre reinforced epoxy resin composition |
JPS63254122A (ja) | 1987-04-10 | 1988-10-20 | Toshiba Corp | エポキシ樹脂組成物 |
CA1326096C (en) | 1988-08-19 | 1994-01-11 | Katugi Kitagawa | Epoxy resin powder coating composition with excellent adhesibility |
US5064881A (en) | 1989-01-18 | 1991-11-12 | Mitsui Petrochemical Industries, Ltd. | Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica |
US5648407A (en) | 1995-05-16 | 1997-07-15 | Minnesota Mining And Manufacturing Company | Curable resin sols and fiber-reinforced composites derived therefrom |
JP3661194B2 (ja) * | 1997-07-11 | 2005-06-15 | 東レ株式会社 | 織物プリプレグおよびハニカムサンドイッチパネル |
US6812276B2 (en) * | 1999-12-01 | 2004-11-02 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6627704B2 (en) * | 1999-12-01 | 2003-09-30 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US7235192B2 (en) * | 1999-12-01 | 2007-06-26 | General Electric Company | Capped poly(arylene ether) composition and method |
JP2001335680A (ja) | 2000-05-30 | 2001-12-04 | Du Pont Mitsui Polychem Co Ltd | エポキシ樹脂組成物 |
TW523532B (en) | 2001-08-09 | 2003-03-11 | Ind Tech Res Inst | Epoxy/clay nanocomposite for copper clad laminate applications |
AU2003234394A1 (en) | 2002-05-23 | 2003-12-12 | 3M Innovative Properties Company | Nanoparticle filled underfill |
US20050048700A1 (en) | 2003-09-02 | 2005-03-03 | Slawomir Rubinsztajn | No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
US20050048291A1 (en) | 2003-08-14 | 2005-03-03 | General Electric Company | Nano-filled composite materials with exceptionally high glass transition temperature |
GB2409837B (en) | 2004-01-10 | 2006-09-06 | Hexcel Composites Ltd | Fibre reinforced resin assembly |
KR100601091B1 (ko) | 2004-05-11 | 2006-07-14 | 주식회사 엘지화학 | 동박적층판용 에폭시 수지 조성물 |
US7666938B2 (en) | 2004-12-03 | 2010-02-23 | Henkel Corporation | Nanoparticle silica filled benzoxazine compositions |
-
2005
- 2005-06-18 GB GB0512610A patent/GB0512610D0/en not_active Ceased
-
2006
- 2006-06-12 US US11/450,995 patent/US7527250B2/en active Active
- 2006-06-14 DK DK06253096T patent/DK1734069T3/da active
- 2006-06-14 EP EP20060253096 patent/EP1734069B1/en not_active Revoked
- 2006-06-14 ES ES06253096T patent/ES2336476T3/es active Active
- 2006-06-14 GB GB0611756A patent/GB2427196B/en not_active Expired - Fee Related
- 2006-06-14 DE DE200660009725 patent/DE602006009725D1/de active Active
- 2006-06-14 AT AT06253096T patent/ATE445665T1/de active
Also Published As
Publication number | Publication date |
---|---|
EP1734069A1 (en) | 2006-12-20 |
GB0512610D0 (en) | 2005-07-27 |
US7527250B2 (en) | 2009-05-05 |
ES2336476T3 (es) | 2010-04-13 |
GB2427196B (en) | 2009-10-28 |
US20070087202A1 (en) | 2007-04-19 |
GB0611756D0 (en) | 2006-07-26 |
DE602006009725D1 (de) | 2009-11-26 |
GB2427196A (en) | 2006-12-20 |
EP1734069B1 (en) | 2009-10-14 |
ATE445665T1 (de) | 2009-10-15 |
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