DK173119B1 - Fremgangsmåde til fjernelse af grater i pletterede gennemgående huller i flerlags-kobberprintplader - Google Patents

Fremgangsmåde til fjernelse af grater i pletterede gennemgående huller i flerlags-kobberprintplader Download PDF

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Publication number
DK173119B1
DK173119B1 DK198800360A DK36088A DK173119B1 DK 173119 B1 DK173119 B1 DK 173119B1 DK 198800360 A DK198800360 A DK 198800360A DK 36088 A DK36088 A DK 36088A DK 173119 B1 DK173119 B1 DK 173119B1
Authority
DK
Denmark
Prior art keywords
copper
plated
holes
weight
circuit boards
Prior art date
Application number
DK198800360A
Other languages
Danish (da)
English (en)
Other versions
DK36088A (da
DK36088D0 (da
Inventor
Chilengi P Madhusudhan
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of DK36088D0 publication Critical patent/DK36088D0/da
Publication of DK36088A publication Critical patent/DK36088A/da
Application granted granted Critical
Publication of DK173119B1 publication Critical patent/DK173119B1/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DK198800360A 1987-01-30 1988-01-26 Fremgangsmåde til fjernelse af grater i pletterede gennemgående huller i flerlags-kobberprintplader DK173119B1 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US931987A 1987-01-30 1987-01-30
US931987 1987-01-30

Publications (3)

Publication Number Publication Date
DK36088D0 DK36088D0 (da) 1988-01-26
DK36088A DK36088A (da) 1988-07-31
DK173119B1 true DK173119B1 (da) 2000-01-31

Family

ID=21736925

Family Applications (1)

Application Number Title Priority Date Filing Date
DK198800360A DK173119B1 (da) 1987-01-30 1988-01-26 Fremgangsmåde til fjernelse af grater i pletterede gennemgående huller i flerlags-kobberprintplader

Country Status (5)

Country Link
US (1) US5049234A (el)
JP (1) JPH0614595B2 (el)
DK (1) DK173119B1 (el)
GR (1) GR872040B (el)
IL (1) IL85006A (el)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5207867A (en) * 1992-03-17 1993-05-04 Macdermid, Incorporated Composition and method for improving the surface insulation resistance of a printed circuit
US5620558A (en) * 1993-07-19 1997-04-15 Lucent Technologies Inc. Etching of copper-containing devices
AT410043B (de) * 1997-09-30 2003-01-27 Sez Ag Verfahren zum planarisieren von halbleitersubstraten
EP1589568A3 (en) * 1998-03-13 2009-02-25 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
KR100734274B1 (ko) * 2005-09-05 2007-07-02 삼성전자주식회사 기판 세정용 조성물을 이용한 게이트 형성 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007037A (en) * 1975-07-09 1977-02-08 General Electric Company Composition and method for chemically etching copper elements
US4222815A (en) * 1979-06-04 1980-09-16 The Babcock & Wilcox Company Isotropic etching of silicon strain gages
US4425210A (en) * 1980-11-04 1984-01-10 Fazlin Fazal A Plasma desmearing apparatus and method
US4345969A (en) * 1981-03-23 1982-08-24 Motorola, Inc. Metal etch solution and method
US4546374A (en) * 1981-03-23 1985-10-08 Motorola Inc. Semiconductor device including plateless package
US4631805A (en) * 1981-03-23 1986-12-30 Motorola Inc. Semiconductor device including plateless package fabrication method
US4541035A (en) * 1984-07-30 1985-09-10 General Electric Company Low loss, multilevel silicon circuit board
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
US4657632A (en) * 1985-08-29 1987-04-14 Techno Instruments Investments 1983 Ltd. Use of immersion tin coating as etch resist
US4695348A (en) * 1986-09-15 1987-09-22 Psi Star Copper etching process and product

Also Published As

Publication number Publication date
IL85006A0 (en) 1988-06-30
JPH0614595B2 (ja) 1994-02-23
JPS63194396A (ja) 1988-08-11
DK36088A (da) 1988-07-31
US5049234A (en) 1991-09-17
GR872040B (en) 1988-04-05
DK36088D0 (da) 1988-01-26
IL85006A (en) 1992-08-18

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Legal Events

Date Code Title Description
B1 Patent granted (law 1993)
PUP Patent expired