IL85006A - Methods for removing stringers appearing in plated through-holes in copper-containing multi-layer printed wiring boards - Google Patents

Methods for removing stringers appearing in plated through-holes in copper-containing multi-layer printed wiring boards

Info

Publication number
IL85006A
IL85006A IL8885006A IL8500688A IL85006A IL 85006 A IL85006 A IL 85006A IL 8885006 A IL8885006 A IL 8885006A IL 8500688 A IL8500688 A IL 8500688A IL 85006 A IL85006 A IL 85006A
Authority
IL
Israel
Prior art keywords
appearing
plated
copper
holes
methods
Prior art date
Application number
IL8885006A
Other languages
English (en)
Other versions
IL85006A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL85006A0 publication Critical patent/IL85006A0/xx
Publication of IL85006A publication Critical patent/IL85006A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
IL8885006A 1987-01-30 1988-01-01 Methods for removing stringers appearing in plated through-holes in copper-containing multi-layer printed wiring boards IL85006A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US931987A 1987-01-30 1987-01-30

Publications (2)

Publication Number Publication Date
IL85006A0 IL85006A0 (en) 1988-06-30
IL85006A true IL85006A (en) 1992-08-18

Family

ID=21736925

Family Applications (1)

Application Number Title Priority Date Filing Date
IL8885006A IL85006A (en) 1987-01-30 1988-01-01 Methods for removing stringers appearing in plated through-holes in copper-containing multi-layer printed wiring boards

Country Status (5)

Country Link
US (1) US5049234A (el)
JP (1) JPH0614595B2 (el)
DK (1) DK173119B1 (el)
GR (1) GR872040B (el)
IL (1) IL85006A (el)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5207867A (en) * 1992-03-17 1993-05-04 Macdermid, Incorporated Composition and method for improving the surface insulation resistance of a printed circuit
US5620558A (en) * 1993-07-19 1997-04-15 Lucent Technologies Inc. Etching of copper-containing devices
AT410043B (de) * 1997-09-30 2003-01-27 Sez Ag Verfahren zum planarisieren von halbleitersubstraten
EP1589568A3 (en) * 1998-03-13 2009-02-25 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
KR100734274B1 (ko) * 2005-09-05 2007-07-02 삼성전자주식회사 기판 세정용 조성물을 이용한 게이트 형성 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007037A (en) * 1975-07-09 1977-02-08 General Electric Company Composition and method for chemically etching copper elements
US4222815A (en) * 1979-06-04 1980-09-16 The Babcock & Wilcox Company Isotropic etching of silicon strain gages
US4425210A (en) * 1980-11-04 1984-01-10 Fazlin Fazal A Plasma desmearing apparatus and method
US4345969A (en) * 1981-03-23 1982-08-24 Motorola, Inc. Metal etch solution and method
US4546374A (en) * 1981-03-23 1985-10-08 Motorola Inc. Semiconductor device including plateless package
US4631805A (en) * 1981-03-23 1986-12-30 Motorola Inc. Semiconductor device including plateless package fabrication method
US4541035A (en) * 1984-07-30 1985-09-10 General Electric Company Low loss, multilevel silicon circuit board
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
US4657632A (en) * 1985-08-29 1987-04-14 Techno Instruments Investments 1983 Ltd. Use of immersion tin coating as etch resist
US4695348A (en) * 1986-09-15 1987-09-22 Psi Star Copper etching process and product

Also Published As

Publication number Publication date
DK173119B1 (da) 2000-01-31
IL85006A0 (en) 1988-06-30
JPH0614595B2 (ja) 1994-02-23
JPS63194396A (ja) 1988-08-11
DK36088A (da) 1988-07-31
US5049234A (en) 1991-09-17
GR872040B (en) 1988-04-05
DK36088D0 (da) 1988-01-26

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Legal Events

Date Code Title Description
KB Patent renewed
HC Change of name of proprietor(s)
KB Patent renewed
KB Patent renewed
EXP Patent expired