DK170685D0 - Roterbart katodeforstoevningsapparat - Google Patents

Roterbart katodeforstoevningsapparat

Info

Publication number
DK170685D0
DK170685D0 DK170685A DK170685A DK170685D0 DK 170685 D0 DK170685 D0 DK 170685D0 DK 170685 A DK170685 A DK 170685A DK 170685 A DK170685 A DK 170685A DK 170685 D0 DK170685 D0 DK 170685D0
Authority
DK
Denmark
Prior art keywords
nutring
rootable
appliance
cotton
rootable cotton
Prior art date
Application number
DK170685A
Other languages
English (en)
Other versions
DK170685A (da
Inventor
Harold E Mckelvey
Original Assignee
Shatterproof Glass Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shatterproof Glass Corp filed Critical Shatterproof Glass Corp
Publication of DK170685A publication Critical patent/DK170685A/da
Publication of DK170685D0 publication Critical patent/DK170685D0/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Centrifugal Separators (AREA)
  • Coating By Spraying Or Casting (AREA)
DK170685A 1983-08-17 1985-04-16 Roterbart katodeforstoevningsapparat DK170685D0 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/523,969 US4445997A (en) 1983-08-17 1983-08-17 Rotatable sputtering apparatus
PCT/US1984/001299 WO1985000925A1 (en) 1983-08-17 1984-08-15 Rotatable sputtering apparatus

Publications (2)

Publication Number Publication Date
DK170685A DK170685A (da) 1985-04-16
DK170685D0 true DK170685D0 (da) 1985-04-16

Family

ID=24087180

Family Applications (1)

Application Number Title Priority Date Filing Date
DK170685A DK170685D0 (da) 1983-08-17 1985-04-16 Roterbart katodeforstoevningsapparat

Country Status (11)

Country Link
US (1) US4445997A (da)
EP (1) EP0152472A1 (da)
JP (1) JPS61500025A (da)
AU (1) AU574723B2 (da)
BR (1) BR8407018A (da)
CA (1) CA1221335A (da)
DK (1) DK170685D0 (da)
FI (1) FI79917C (da)
HU (1) HU196011B (da)
NO (1) NO851458L (da)
WO (1) WO1985000925A1 (da)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
US5047131A (en) * 1989-11-08 1991-09-10 The Boc Group, Inc. Method for coating substrates with silicon based compounds
BE1003701A3 (fr) * 1990-06-08 1992-05-26 Saint Roch Glaceries Cathode rotative.
JP3516949B2 (ja) * 1990-08-10 2004-04-05 バイラテック・シン・フィルムズ・インコーポレイテッド 回転マグネトロンスパッタリングシステムにおけるアーク抑制のためのシールディング
US5200049A (en) * 1990-08-10 1993-04-06 Viratec Thin Films, Inc. Cantilever mount for rotating cylindrical magnetrons
US5100527A (en) * 1990-10-18 1992-03-31 Viratec Thin Films, Inc. Rotating magnetron incorporating a removable cathode
US5106474A (en) * 1990-11-21 1992-04-21 Viratec Thin Films, Inc. Anode structures for magnetron sputtering apparatus
AU664995B2 (en) * 1991-04-19 1995-12-14 Surface Solutions, Incorporated Method and apparatus for linear magnetron sputtering
US5262032A (en) * 1991-05-28 1993-11-16 Leybold Aktiengesellschaft Sputtering apparatus with rotating target and target cooling
US5567289A (en) * 1993-12-30 1996-10-22 Viratec Thin Films, Inc. Rotating floating magnetron dark-space shield and cone end
US5620577A (en) * 1993-12-30 1997-04-15 Viratec Thin Films, Inc. Spring-loaded mount for a rotatable sputtering cathode
US5571393A (en) * 1994-08-24 1996-11-05 Viratec Thin Films, Inc. Magnet housing for a sputtering cathode
US5445721A (en) * 1994-08-25 1995-08-29 The Boc Group, Inc. Rotatable magnetron including a replacement target structure
US5518592A (en) * 1994-08-25 1996-05-21 The Boc Group, Inc. Seal cartridge for a rotatable magnetron
TW347369B (en) * 1996-12-17 1998-12-11 Asahi Glass Co Ltd Organic substrate provided with a light absorptive antireflection film and process for production
US6488824B1 (en) 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
JP2002529600A (ja) 1998-11-06 2002-09-10 シヴァク 高レート・コーティング用のスパッタリング装置および方法
US6436252B1 (en) 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
DE10102493B4 (de) 2001-01-19 2007-07-12 W.C. Heraeus Gmbh Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
DE60238979D1 (de) 2001-04-20 2011-03-03 Gen Plasma Inc Penningentladungsplasmaquelle
US7294283B2 (en) * 2001-04-20 2007-11-13 Applied Process Technologies, Inc. Penning discharge plasma source
US7399385B2 (en) * 2001-06-14 2008-07-15 Tru Vue, Inc. Alternating current rotatable sputter cathode
DE10145201C1 (de) * 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
BR0105474A (pt) * 2001-09-26 2003-09-23 Fundacao De Amparo A Pesquisa Processo de deposição de filme de carbono amorfo hidrogenado, filme de carbono amorfo hidrogenado e artigo revestido com filme de carbono amorfo hidrogenado
US20030173217A1 (en) * 2002-03-14 2003-09-18 Sputtering Components, Inc. High-power ion sputtering magnetron
WO2004005574A2 (en) * 2002-07-02 2004-01-15 Academy Precision Materials A Division Of Academy Corporation Rotary target and method for onsite mechanical assembly of rotary target
US20050276381A1 (en) * 2003-07-02 2005-12-15 Academy Corporation Rotary target locking ring assembly
WO2005028697A1 (en) * 2003-09-12 2005-03-31 Applied Process Technologies, Inc. Magnetic mirror plasma source and method using same
US20050224343A1 (en) * 2004-04-08 2005-10-13 Richard Newcomb Power coupling for high-power sputtering
US20060049043A1 (en) * 2004-08-17 2006-03-09 Matuska Neal W Magnetron assembly
US20060065524A1 (en) * 2004-09-30 2006-03-30 Richard Newcomb Non-bonded rotatable targets for sputtering
PL1799876T3 (pl) * 2004-10-18 2009-07-31 Bekaert Advanced Coatings Płaski blok końcowy do podtrzymywania obrotowego targetu do napylania
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
PT1856303E (pt) * 2005-03-11 2009-02-27 Bekaert Advanced Coatings Bloco de extremidade individual em ângulo recto
US20060260938A1 (en) * 2005-05-20 2006-11-23 Petrach Philip M Module for Coating System and Associated Technology
US20060278524A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for modulating power signals to control sputtering
US20060278521A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for controlling ion density and energy using modulated power signals
ATE415503T1 (de) * 2005-08-10 2008-12-15 Applied Materials Gmbh & Co Kg Vakuumbeschichtungsanlage mit motorisch angetriebener drehkathode
US7842355B2 (en) * 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
US20070095281A1 (en) * 2005-11-01 2007-05-03 Stowell Michael W System and method for power function ramping of microwave liner discharge sources
US8273222B2 (en) * 2006-05-16 2012-09-25 Southwest Research Institute Apparatus and method for RF plasma enhanced magnetron sputter deposition
US20090183983A1 (en) * 2006-06-19 2009-07-23 Bekaert Advanced Coatings Insert piece for an end-block of a sputtering installation
US8277617B2 (en) * 2007-08-14 2012-10-02 Southwest Research Institute Conformal magnetron sputter deposition
DE102008018609B4 (de) * 2008-04-11 2012-01-19 Von Ardenne Anlagentechnik Gmbh Antriebsendblock für ein rotierendes Magnetron
US8182662B2 (en) * 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
WO2011056581A2 (en) 2009-10-26 2011-05-12 General Plasma, Inc. Rotary magnetron magnet bar and apparatus containing the same for high target utilization
US8747631B2 (en) * 2010-03-15 2014-06-10 Southwest Research Institute Apparatus and method utilizing a double glow discharge plasma for sputter cleaning
US8398834B2 (en) 2010-04-02 2013-03-19 NuvoSun, Inc. Target utilization improvement for rotatable magnetrons
EP2788523A1 (en) * 2011-12-09 2014-10-15 Applied Materials, Inc. Rotatable sputter target
GB201200574D0 (en) * 2012-01-13 2012-02-29 Gencoa Ltd In-vacuum rotational device
CN103074587B (zh) * 2013-02-01 2014-10-15 湘潭宏大真空技术股份有限公司 大面积连续磁控溅射镀膜均匀性调整装置及调整方法
DE102021129523A1 (de) 2021-11-12 2023-05-17 VON ARDENNE Asset GmbH & Co. KG Magnetsystem, Sputtervorrichtung und Gehäusedeckel

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2139313C3 (de) * 1971-08-05 1975-09-11 Inst Fiz An Gssr Vorrichtung zum Autbringen von homogenen, dünnen Schichten auf Werkstücke
US4362632A (en) * 1974-08-02 1982-12-07 Lfe Corporation Gas discharge apparatus
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
DE3069702D1 (en) * 1980-08-08 1985-01-10 Battelle Development Corp Apparatus for coating substrates by high-rate cathodic sputtering, as well as sputtering cathode for such apparatus
US4290877A (en) * 1980-09-08 1981-09-22 The United States Of America As Represented By The Secretary Of The Interior Sputtering apparatus for coating elongated tubes and strips
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4376025A (en) * 1982-06-14 1983-03-08 Battelle Development Corporation Cylindrical cathode for magnetically-enhanced sputtering

Also Published As

Publication number Publication date
AU574723B2 (en) 1988-07-14
US4445997A (en) 1984-05-01
DK170685A (da) 1985-04-16
BR8407018A (pt) 1985-07-30
FI851516A0 (fi) 1985-04-16
HU196011B (en) 1988-08-29
WO1985000925A1 (en) 1985-02-28
FI79917C (fi) 1990-03-12
FI79917B (fi) 1989-11-30
EP0152472A1 (en) 1985-08-28
CA1221335A (en) 1987-05-05
NO851458L (no) 1985-04-12
FI851516L (fi) 1985-04-16
JPS61500025A (ja) 1986-01-09
HUT37294A (en) 1985-11-28
AU3390784A (en) 1985-03-12

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment
B1 Patent granted (law 1993)
PBP Patent lapsed