DK1856303T3 - Enkelt, retvinklet endeblok - Google Patents

Enkelt, retvinklet endeblok

Info

Publication number
DK1856303T3
DK1856303T3 DK06708475T DK06708475T DK1856303T3 DK 1856303 T3 DK1856303 T3 DK 1856303T3 DK 06708475 T DK06708475 T DK 06708475T DK 06708475 T DK06708475 T DK 06708475T DK 1856303 T3 DK1856303 T3 DK 1856303T3
Authority
DK
Denmark
Prior art keywords
target
block
angled end
end block
right angled
Prior art date
Application number
DK06708475T
Other languages
English (en)
Inventor
Krist Dellaert
Bosscher Wilmert De
Boever Joannes De
Gregory Lapeire
Original Assignee
Bekaert Advanced Coatings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bekaert Advanced Coatings filed Critical Bekaert Advanced Coatings
Application granted granted Critical
Publication of DK1856303T3 publication Critical patent/DK1856303T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Joining Of Building Structures In Genera (AREA)
  • Ladders (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
  • Forklifts And Lifting Vehicles (AREA)
  • Cartons (AREA)
DK06708475T 2005-03-11 2006-02-23 Enkelt, retvinklet endeblok DK1856303T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05101906 2005-03-11
PCT/EP2006/060216 WO2006094905A1 (en) 2005-03-11 2006-02-23 Single, right-angled end-block

Publications (1)

Publication Number Publication Date
DK1856303T3 true DK1856303T3 (da) 2009-03-30

Family

ID=34938950

Family Applications (1)

Application Number Title Priority Date Filing Date
DK06708475T DK1856303T3 (da) 2005-03-11 2006-02-23 Enkelt, retvinklet endeblok

Country Status (13)

Country Link
US (1) US20080202925A1 (da)
EP (1) EP1856303B1 (da)
JP (1) JP5004942B2 (da)
KR (1) KR20070108907A (da)
CN (1) CN101137764B (da)
AT (1) ATE420220T1 (da)
DE (1) DE602006004712D1 (da)
DK (1) DK1856303T3 (da)
ES (1) ES2319569T3 (da)
PL (1) PL1856303T3 (da)
PT (1) PT1856303E (da)
SI (1) SI1856303T1 (da)
WO (1) WO2006094905A1 (da)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006097152A1 (en) * 2004-10-18 2006-09-21 Bekaert Advanced Coatings Flat end-block for carrying a rotatable sputtering target
US8182662B2 (en) 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
EP2372744B1 (en) * 2010-04-01 2016-01-13 Applied Materials, Inc. Device for supporting a rotatable target and sputtering installation
EP2371992B1 (en) * 2010-04-01 2013-06-05 Applied Materials, Inc. End-block and sputtering installation
EP2387063B1 (en) * 2010-05-11 2014-04-30 Applied Materials, Inc. Chamber for physical vapor deposition
JP2014523969A (ja) 2011-06-27 2014-09-18 ソレラス・リミテッド スパッタリングターゲット
GB201200574D0 (en) 2012-01-13 2012-02-29 Gencoa Ltd In-vacuum rotational device
BE1024754B9 (nl) * 2016-11-29 2018-07-24 Soleras Advanced Coatings Bvba Een universeel monteerbaar eindblok
CN108893719B (zh) * 2018-09-14 2024-05-07 苏州浩联光电科技有限公司 一种靶材悬挂机构及离子溅射镀膜设备
CN115466930B (zh) * 2022-09-13 2023-05-23 安徽其芒光电科技有限公司 镀膜设备及其靶材承载装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878085A (en) * 1973-07-05 1975-04-15 Sloan Technology Corp Cathode sputtering apparatus
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4422916A (en) * 1981-02-12 1983-12-27 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4445997A (en) * 1983-08-17 1984-05-01 Shatterproof Glass Corporation Rotatable sputtering apparatus
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US4519885A (en) * 1983-12-27 1985-05-28 Shatterproof Glass Corp. Method and apparatus for changing sputtering targets in a magnetron sputtering system
US4575102A (en) * 1984-11-20 1986-03-11 Ferrofluidics Corporation Coaxial, multiple-shaft ferrofluid seal apparatus
US4995958A (en) * 1989-05-22 1991-02-26 Varian Associates, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
US5200049A (en) * 1990-08-10 1993-04-06 Viratec Thin Films, Inc. Cantilever mount for rotating cylindrical magnetrons
WO1992002659A1 (en) * 1990-08-10 1992-02-20 Viratec Thin Films, Inc. Shielding for arc suppression in rotating magnetron sputtering systems
DE4336994C1 (de) * 1993-10-29 1995-03-30 Heinrich Fabschitz Fadenliefervorrichtung mit stufenlos einstellbarer Fadenabzugspannung
US5620577A (en) * 1993-12-30 1997-04-15 Viratec Thin Films, Inc. Spring-loaded mount for a rotatable sputtering cathode
US5445721A (en) * 1994-08-25 1995-08-29 The Boc Group, Inc. Rotatable magnetron including a replacement target structure
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
EP0918351A1 (en) * 1997-11-19 1999-05-26 Sinvaco N.V. Improved planar magnetron with moving magnet assembly
US6488824B1 (en) * 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
JP2002529600A (ja) * 1998-11-06 2002-09-10 シヴァク 高レート・コーティング用のスパッタリング装置および方法
US6263542B1 (en) * 1999-06-22 2001-07-24 Lam Research Corporation Tolerance resistant and vacuum compliant door hinge with open-assist feature
US6375815B1 (en) * 2001-02-17 2002-04-23 David Mark Lynn Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly
US6736948B2 (en) * 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US20030173217A1 (en) * 2002-03-14 2003-09-18 Sputtering Components, Inc. High-power ion sputtering magnetron
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
JP2009513818A (ja) * 2003-07-04 2009-04-02 ベーカート・アドヴァンスト・コーティングス 回転管状スパッタターゲット組立体
WO2006097152A1 (en) * 2004-10-18 2006-09-21 Bekaert Advanced Coatings Flat end-block for carrying a rotatable sputtering target

Also Published As

Publication number Publication date
ATE420220T1 (de) 2009-01-15
KR20070108907A (ko) 2007-11-13
JP5004942B2 (ja) 2012-08-22
PT1856303E (pt) 2009-02-27
EP1856303B1 (en) 2009-01-07
CN101137764A (zh) 2008-03-05
DE602006004712D1 (de) 2009-02-26
US20080202925A1 (en) 2008-08-28
SI1856303T1 (sl) 2009-06-30
ES2319569T3 (es) 2009-05-08
PL1856303T3 (pl) 2009-06-30
CN101137764B (zh) 2010-12-01
JP2008533297A (ja) 2008-08-21
EP1856303A1 (en) 2007-11-21
WO2006094905A1 (en) 2006-09-14

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