DK170274B1 - Fremgangsmåde og apparat til kontrol af snitforløbet ved fraskillelse af skiver fra ikke-magnetiserbare arbejdsemner - Google Patents

Fremgangsmåde og apparat til kontrol af snitforløbet ved fraskillelse af skiver fra ikke-magnetiserbare arbejdsemner Download PDF

Info

Publication number
DK170274B1
DK170274B1 DK384289A DK384289A DK170274B1 DK 170274 B1 DK170274 B1 DK 170274B1 DK 384289 A DK384289 A DK 384289A DK 384289 A DK384289 A DK 384289A DK 170274 B1 DK170274 B1 DK 170274B1
Authority
DK
Denmark
Prior art keywords
magnetic
tool
separation
separating
measurement
Prior art date
Application number
DK384289A
Other languages
Danish (da)
English (en)
Other versions
DK384289D0 (da
DK384289A (da
Inventor
Joachim Junge
Johann Glas
Johann Niedermeier
Gerhard Brehm
Original Assignee
Wacker Siltronic Halbleitermat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic Halbleitermat filed Critical Wacker Siltronic Halbleitermat
Publication of DK384289D0 publication Critical patent/DK384289D0/da
Publication of DK384289A publication Critical patent/DK384289A/da
Application granted granted Critical
Publication of DK170274B1 publication Critical patent/DK170274B1/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DK384289A 1988-08-05 1989-08-04 Fremgangsmåde og apparat til kontrol af snitforløbet ved fraskillelse af skiver fra ikke-magnetiserbare arbejdsemner DK170274B1 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3826698A DE3826698A1 (de) 1988-08-05 1988-08-05 Verfahren und vorrichtung zur kontrolle des schnittverlaufes beim abtrennen von scheiben von nichtmagnetisierbaren werkstuecken
DE3826698 1988-08-05

Publications (3)

Publication Number Publication Date
DK384289D0 DK384289D0 (da) 1989-08-04
DK384289A DK384289A (da) 1990-02-06
DK170274B1 true DK170274B1 (da) 1995-07-24

Family

ID=6360333

Family Applications (1)

Application Number Title Priority Date Filing Date
DK384289A DK170274B1 (da) 1988-08-05 1989-08-04 Fremgangsmåde og apparat til kontrol af snitforløbet ved fraskillelse af skiver fra ikke-magnetiserbare arbejdsemner

Country Status (5)

Country Link
US (1) US5030910A (fr)
EP (1) EP0353745B1 (fr)
JP (1) JPH0714608B2 (fr)
DE (2) DE3826698A1 (fr)
DK (1) DK170274B1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0813457B2 (ja) * 1988-12-21 1996-02-14 三菱マテリアル株式会社 半導体切断装置
JPH0569436A (ja) * 1991-05-17 1993-03-23 Mitsubishi Materials Corp スライシングマシンのブレード位置補正装置
CH687301A5 (fr) * 1992-01-22 1996-11-15 W S Technologies Ltd Dispositif de sciage par fil.
JPH06712U (ja) * 1992-06-16 1994-01-11 トーヨーエイテック株式会社 スライシング装置
JP3195504B2 (ja) * 1994-11-24 2001-08-06 トーヨーエイテック株式会社 スライシング装置のブレード変位検出装置
JP3102364B2 (ja) 1996-11-06 2000-10-23 株式会社村田製作所 スライシング方法およびスライシング装置
DE19812271B4 (de) * 1998-03-20 2013-08-01 Deere & Company Einrichtung zum Überwachen des Abstandes zwischen einem Messer einer rotierenden Schneidtrommel und einer Gegenschneide einer Erntemaschine
FI107319B (fi) * 1999-02-10 2001-07-13 Joint Capital Oy Solwo Sahausmenetelmä puulevyn irrottamiseksi
DE10032963C2 (de) * 2000-07-06 2002-05-02 Fraunhofer Ges Forschung Verfahren und Anordnung zum Abtrennen dünner Oberflächenbereiche von Substraten
DE10052154A1 (de) 2000-10-20 2002-05-08 Freiberger Compound Mat Gmbh Verfahren und Vorrichtung zum Trennen von Einkristallen, Justiervorrichtung und Testverfahren zum Ermitteln einer Orientierung eines Einkristalls für ein derartiges Verfahren
JP4487710B2 (ja) * 2004-09-28 2010-06-23 ヤマハ株式会社 センサ及び同センサを用いた物理量の測定方法
EP2564727A1 (fr) * 2011-08-27 2013-03-06 Braun GmbH Dispositif de rognage de filament doté d'un bord tranchant résistant à l'abrasion et procédé de rognage de filaments
JP5924492B2 (ja) * 2012-07-11 2016-05-25 日立工機株式会社 卓上切断機

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1279328B (de) * 1966-04-23 1968-10-03 Continental Gummi Werke Ag Einrichtung zum Steuern des Rauhwerkzeuges an einer Rauhmaschine
CH615503A5 (fr) * 1977-02-08 1980-01-31 Zumbach Electronic Ag
US4205797A (en) * 1978-10-30 1980-06-03 Sperry Corporation Magnetic clearance sensor
US4198006A (en) * 1978-10-30 1980-04-15 Sperry Corporation Magnetic clearance sensor
US4438754A (en) * 1979-08-14 1984-03-27 Shell Oil Company Method for sensing and remotely controlling a tool to workpiece spatial relationship
JPS6179550A (ja) * 1984-09-28 1986-04-23 Nippon Sheet Glass Co Ltd 工作機械
JPH049139Y2 (fr) * 1985-10-22 1992-03-06
DE3608572A1 (de) * 1986-03-14 1987-09-17 Krupp Gmbh Verfahren und vorrichtung zur beruehrungslosen bruch- und verschleissueberwachung von werkzeugen
DE3640645A1 (de) * 1986-11-28 1988-06-09 Wacker Chemitronic Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben
JPH0813457B2 (ja) * 1988-12-21 1996-02-14 三菱マテリアル株式会社 半導体切断装置

Also Published As

Publication number Publication date
DK384289D0 (da) 1989-08-04
EP0353745A3 (fr) 1991-08-07
EP0353745B1 (fr) 1993-10-20
DK384289A (da) 1990-02-06
DE3826698A1 (de) 1990-02-08
US5030910A (en) 1991-07-09
JPH0714608B2 (ja) 1995-02-22
EP0353745A2 (fr) 1990-02-07
DE58905945D1 (de) 1993-11-25
JPH0281608A (ja) 1990-03-22

Similar Documents

Publication Publication Date Title
DK170274B1 (da) Fremgangsmåde og apparat til kontrol af snitforløbet ved fraskillelse af skiver fra ikke-magnetiserbare arbejdsemner
Bagchi et al. Stress analysis in machining with the use of sapphire tools
JPH01503577A (ja) 磁気デバイスを使用した物品の認知及び／又は検知
Koschny et al. Magneto-optical sensors accurately analyze magnetic field distribution of magnetic materials
US4498345A (en) Method for measuring saw blade flexure
US5036274A (en) Method of monitoring the path of an annular blade through a semiconductor material
CN116657249A (zh) 一种应力呈均向分布的碳化硅晶片及无损且精确测定晶片各向应力的方法
EP4328361A1 (fr) Élément magnétostrictif et procédé de production d'élément magnétostrictif
Kang et al. Surface layer damage of silicon wafers sliced by wire saw process
EP4064372A1 (fr) Élément magnétostrictif et procédé de production d'élément magnétostrictif
Stančeková et al. The Application of Grinding of Ceramic Materials
Ge et al. Thickness measurement of deterioration layer of monocrystalline silicon by specific crystallographic plane cutting of wire electrical discharge machining
Mašek et al. A comprehensive methodology for testing hard layers of cutting tool properties in orthogonal turning
Kubo Instrument for the measurement of slope and height distribution of surface roughness
KR20180048669A (ko) 단결정 웨이퍼의 표리 판정 방법
EP4293145A1 (fr) Élément magnétostrictif et procédé de fabrication d'élément magnétostrictif
SU1048302A1 (ru) Способ измерени толщины ферромагнитных изделий и покрытий
SHINNO et al. In-process monitoring system for machining environment based on heat flux sensing
WO2006097684A1 (fr) Appareil et procédé pour entailler
SU1580237A1 (ru) Способ неразрушающего контрол физико-механических параметров ферромагнитных изделий
JPH09141648A (ja) スライシングマシンのブレード変位検出装置
JPH03252132A (ja) スライス装置の切削抵抗検出方法
Shi et al. Brittle Fracture Effect on Dislocation Density of Single Crystal Germanium During Turning
SU1211646A1 (ru) Способ контрол штампуемости листовых ферромагнитных материалов
JP2008224224A (ja) 金属ガラス評価方法およびその装置

Legal Events

Date Code Title Description
B1 Patent granted (law 1993)
PBP Patent lapsed