DK153572C - POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOF - Google Patents
POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOFInfo
- Publication number
- DK153572C DK153572C DK070582A DK70582A DK153572C DK 153572 C DK153572 C DK 153572C DK 070582 A DK070582 A DK 070582A DK 70582 A DK70582 A DK 70582A DK 153572 C DK153572 C DK 153572C
- Authority
- DK
- Denmark
- Prior art keywords
- powder
- substrate
- plastic
- metallization
- plastics
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Control Of Electrical Variables (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
A catalytically active powder, its preparation, and its use for activating insulating substrates to receive electrolessly deposited metal in a coherent metal layer are described. The powder of the invention comprises a plastic powder containing catalyzing/activating chemical compounds allowing that the acceleration of the catalyst is not carried out until the powder is melted down onto the substrate. The substrate need not be etched prior to the metallization since the plastic melted down ensures a good adhesion between metal and plastics and between plastics and substrate. Furthermore, the colloidal nature of the catalyzing compounds is stabilized in a particular and especially durable manner by the plastic powder. The use of the powder causes less risk to the environment since the catalyst may be applied as a dry powder, and since the etching of the substrate is avoided.
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK070582A DK153572C (en) | 1982-02-18 | 1982-02-18 | POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOF |
IE339/83A IE55891B1 (en) | 1982-02-18 | 1983-02-17 | A powder for use for dry activation of a substrate for electroless metallization |
AU11631/83A AU556818B2 (en) | 1982-02-18 | 1983-02-17 | Powder for electroless plating |
CA000421842A CA1212660A (en) | 1982-02-18 | 1983-02-17 | Powder for use in dry activation for electroless metallizing |
JP83500754A JPS59500221A (en) | 1982-02-18 | 1983-02-18 | Powder used in dry activation process for electroless metallization |
EP83101561A EP0087135B1 (en) | 1982-02-18 | 1983-02-18 | A powder for use for dry activation of a substrate for electroless metallization |
AT83101561T ATE23572T1 (en) | 1982-02-18 | 1983-02-18 | POWDER FOR DRY ACTIVATION OF A SUBSTRATE FOR ELECTRICAL METALLIZATION. |
DE8383101561T DE3367628D1 (en) | 1982-02-18 | 1983-02-18 | A powder for use for dry activation of a substrate for electroless metallization |
PCT/DK1983/000017 WO1983002960A1 (en) | 1982-02-18 | 1983-02-18 | A powder for use in dry activation for electroless metallizing |
IL67963A IL67963A (en) | 1982-02-18 | 1983-02-21 | Powder for use in dry activation for electroless metallizing |
NO83833723A NO160452C (en) | 1982-02-18 | 1983-10-13 | POWDER FOR USE IN DRIVER ACTIVATION FOR CURRENT METALLIZATION. |
FI833778A FI73243C (en) | 1982-02-18 | 1983-10-17 | POWDER FOR OVERDRAWING VIDEO STRUCTURING FOR METALIZATION. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK070582A DK153572C (en) | 1982-02-18 | 1982-02-18 | POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOF |
DK70582 | 1982-02-18 |
Publications (3)
Publication Number | Publication Date |
---|---|
DK70582A DK70582A (en) | 1983-08-19 |
DK153572B DK153572B (en) | 1988-07-25 |
DK153572C true DK153572C (en) | 1988-12-19 |
Family
ID=8096587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK070582A DK153572C (en) | 1982-02-18 | 1982-02-18 | POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOF |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP0087135B1 (en) |
JP (1) | JPS59500221A (en) |
AT (1) | ATE23572T1 (en) |
AU (1) | AU556818B2 (en) |
CA (1) | CA1212660A (en) |
DE (1) | DE3367628D1 (en) |
DK (1) | DK153572C (en) |
FI (1) | FI73243C (en) |
IE (1) | IE55891B1 (en) |
IL (1) | IL67963A (en) |
NO (1) | NO160452C (en) |
WO (1) | WO1983002960A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4719145A (en) * | 1983-09-28 | 1988-01-12 | Rohm And Haas Company | Catalytic process and systems |
PH23907A (en) * | 1983-09-28 | 1989-12-18 | Rohm & Haas | Catalytic process and systems |
US4593016A (en) * | 1985-02-14 | 1986-06-03 | International Business Machines Corporation | Process for manufacturing a concentrate of a palladium-tin colloidal catalyst |
US5304447A (en) * | 1992-02-11 | 1994-04-19 | Elf Technologies, Inc. | Plateable toner and method for producing the same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1521442B2 (en) * | 1964-10-16 | 1975-02-27 | Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) | Object that can be used for the production of printed circuits from a carrier material with any electrical properties |
DE1521445C3 (en) * | 1965-06-01 | 1979-11-29 | Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) | Process for the production of insulating material surfaces activated for electroless metal coating |
DE2207425A1 (en) * | 1972-02-12 | 1973-08-16 | Schering Ag | Metallising plastics - by process including treatment with aq tenside soln after standard etching |
US4287253A (en) * | 1975-04-08 | 1981-09-01 | Photocircuits Division Of Kollmorgen Corp. | Catalytic filler for electroless metallization of hole walls |
US4020009A (en) * | 1975-09-30 | 1977-04-26 | Shipley Company, Inc. | Catalyst composition and method of preparation |
US4048354A (en) * | 1975-10-23 | 1977-09-13 | Nathan Feldstein | Method of preparation and use of novel electroless plating catalysts |
DK153337C (en) * | 1979-04-11 | 1988-11-14 | Platonec Aps | PROCEDURES FOR TRANS-SENSITIZATION OF AN INSULATING SURFACE |
DK427780A (en) * | 1980-10-10 | 1982-04-11 | Neselco As | POWDER USED BY THROTTLE SENSIBILIZATION FOR CURRENT METALLIZATION |
DK148327C (en) * | 1981-07-24 | 1985-11-04 | Neselco As | POWDER USED BY THROTTLE SENSIBILIZATION FOR CURRENT METALLIZATION |
-
1982
- 1982-02-18 DK DK070582A patent/DK153572C/en not_active IP Right Cessation
-
1983
- 1983-02-17 IE IE339/83A patent/IE55891B1/en unknown
- 1983-02-17 AU AU11631/83A patent/AU556818B2/en not_active Ceased
- 1983-02-17 CA CA000421842A patent/CA1212660A/en not_active Expired
- 1983-02-18 JP JP83500754A patent/JPS59500221A/en active Pending
- 1983-02-18 AT AT83101561T patent/ATE23572T1/en not_active IP Right Cessation
- 1983-02-18 WO PCT/DK1983/000017 patent/WO1983002960A1/en active IP Right Grant
- 1983-02-18 EP EP83101561A patent/EP0087135B1/en not_active Expired
- 1983-02-18 DE DE8383101561T patent/DE3367628D1/en not_active Expired
- 1983-02-21 IL IL67963A patent/IL67963A/en unknown
- 1983-10-13 NO NO83833723A patent/NO160452C/en unknown
- 1983-10-17 FI FI833778A patent/FI73243C/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FI833778A0 (en) | 1983-10-17 |
AU556818B2 (en) | 1986-11-20 |
FI73243C (en) | 1987-09-10 |
IE55891B1 (en) | 1991-02-14 |
DK153572B (en) | 1988-07-25 |
FI73243B (en) | 1987-05-29 |
ATE23572T1 (en) | 1986-11-15 |
DK70582A (en) | 1983-08-19 |
IE830339L (en) | 1983-08-18 |
EP0087135B1 (en) | 1986-11-12 |
DE3367628D1 (en) | 1987-01-02 |
EP0087135A1 (en) | 1983-08-31 |
IL67963A (en) | 1986-03-31 |
NO160452C (en) | 1989-04-19 |
CA1212660A (en) | 1986-10-14 |
FI833778A (en) | 1983-10-17 |
AU1163183A (en) | 1983-08-25 |
NO160452B (en) | 1989-01-09 |
NO833723L (en) | 1983-10-13 |
JPS59500221A (en) | 1984-02-16 |
WO1983002960A1 (en) | 1983-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PBP | Patent lapsed |