AU556818B2 - Powder for electroless plating - Google Patents

Powder for electroless plating

Info

Publication number
AU556818B2
AU556818B2 AU11631/83A AU1163183A AU556818B2 AU 556818 B2 AU556818 B2 AU 556818B2 AU 11631/83 A AU11631/83 A AU 11631/83A AU 1163183 A AU1163183 A AU 1163183A AU 556818 B2 AU556818 B2 AU 556818B2
Authority
AU
Australia
Prior art keywords
powder
substrate
plastic
plastics
catalyst
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU11631/83A
Other versions
AU1163183A (en
Inventor
Gunnar Sorensen
Leo Gulvad Svendsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neselco AS
Original Assignee
Neselco AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neselco AS filed Critical Neselco AS
Publication of AU1163183A publication Critical patent/AU1163183A/en
Application granted granted Critical
Publication of AU556818B2 publication Critical patent/AU556818B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Control Of Electrical Variables (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

A catalytically active powder, its preparation, and its use for activating insulating substrates to receive electrolessly deposited metal in a coherent metal layer are described. The powder of the invention comprises a plastic powder containing catalyzing/activating chemical compounds allowing that the acceleration of the catalyst is not carried out until the powder is melted down onto the substrate. The substrate need not be etched prior to the metallization since the plastic melted down ensures a good adhesion between metal and plastics and between plastics and substrate. Furthermore, the colloidal nature of the catalyzing compounds is stabilized in a particular and especially durable manner by the plastic powder. The use of the powder causes less risk to the environment since the catalyst may be applied as a dry powder, and since the etching of the substrate is avoided.
AU11631/83A 1982-02-18 1983-02-17 Powder for electroless plating Ceased AU556818B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK070582A DK153572C (en) 1982-02-18 1982-02-18 POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOF
DK705/82 1982-02-18

Publications (2)

Publication Number Publication Date
AU1163183A AU1163183A (en) 1983-08-25
AU556818B2 true AU556818B2 (en) 1986-11-20

Family

ID=8096587

Family Applications (1)

Application Number Title Priority Date Filing Date
AU11631/83A Ceased AU556818B2 (en) 1982-02-18 1983-02-17 Powder for electroless plating

Country Status (12)

Country Link
EP (1) EP0087135B1 (en)
JP (1) JPS59500221A (en)
AT (1) ATE23572T1 (en)
AU (1) AU556818B2 (en)
CA (1) CA1212660A (en)
DE (1) DE3367628D1 (en)
DK (1) DK153572C (en)
FI (1) FI73243C (en)
IE (1) IE55891B1 (en)
IL (1) IL67963A (en)
NO (1) NO160452C (en)
WO (1) WO1983002960A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719145A (en) * 1983-09-28 1988-01-12 Rohm And Haas Company Catalytic process and systems
PH23907A (en) * 1983-09-28 1989-12-18 Rohm & Haas Catalytic process and systems
US4593016A (en) * 1985-02-14 1986-06-03 International Business Machines Corporation Process for manufacturing a concentrate of a palladium-tin colloidal catalyst
US5304447A (en) * 1992-02-11 1994-04-19 Elf Technologies, Inc. Plateable toner and method for producing the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521442B2 (en) * 1964-10-16 1975-02-27 Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) Object that can be used for the production of printed circuits from a carrier material with any electrical properties
DE1521445C3 (en) * 1965-06-01 1979-11-29 Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) Process for the production of insulating material surfaces activated for electroless metal coating
DE2207425A1 (en) * 1972-02-12 1973-08-16 Schering Ag Metallising plastics - by process including treatment with aq tenside soln after standard etching
US4287253A (en) * 1975-04-08 1981-09-01 Photocircuits Division Of Kollmorgen Corp. Catalytic filler for electroless metallization of hole walls
US4020009A (en) * 1975-09-30 1977-04-26 Shipley Company, Inc. Catalyst composition and method of preparation
US4048354A (en) * 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
DK153337C (en) * 1979-04-11 1988-11-14 Platonec Aps PROCEDURES FOR TRANS-SENSITIZATION OF AN INSULATING SURFACE
DK427780A (en) * 1980-10-10 1982-04-11 Neselco As POWDER USED BY THROTTLE SENSIBILIZATION FOR CURRENT METALLIZATION
DK148327C (en) * 1981-07-24 1985-11-04 Neselco As POWDER USED BY THROTTLE SENSIBILIZATION FOR CURRENT METALLIZATION

Also Published As

Publication number Publication date
FI833778A0 (en) 1983-10-17
AU1163183A (en) 1983-08-25
FI73243C (en) 1987-09-10
EP0087135B1 (en) 1986-11-12
FI73243B (en) 1987-05-29
DK70582A (en) 1983-08-19
FI833778A (en) 1983-10-17
NO833723L (en) 1983-10-13
DK153572C (en) 1988-12-19
JPS59500221A (en) 1984-02-16
DE3367628D1 (en) 1987-01-02
CA1212660A (en) 1986-10-14
DK153572B (en) 1988-07-25
WO1983002960A1 (en) 1983-09-01
NO160452B (en) 1989-01-09
ATE23572T1 (en) 1986-11-15
EP0087135A1 (en) 1983-08-31
IL67963A (en) 1986-03-31
IE55891B1 (en) 1991-02-14
NO160452C (en) 1989-04-19
IE830339L (en) 1983-08-18

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