DK1483769T3 - Stöbt relæenhed til overflademontering og fremgangsmåde til fremstilling af denne - Google Patents

Stöbt relæenhed til overflademontering og fremgangsmåde til fremstilling af denne

Info

Publication number
DK1483769T3
DK1483769T3 DK03723687T DK03723687T DK1483769T3 DK 1483769 T3 DK1483769 T3 DK 1483769T3 DK 03723687 T DK03723687 T DK 03723687T DK 03723687 T DK03723687 T DK 03723687T DK 1483769 T3 DK1483769 T3 DK 1483769T3
Authority
DK
Denmark
Prior art keywords
reed switch
signal
conductors
ground
ground conductors
Prior art date
Application number
DK03723687T
Other languages
English (en)
Inventor
James J Motta
Original Assignee
Kearney National Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kearney National Inc filed Critical Kearney National Inc
Application granted granted Critical
Publication of DK1483769T3 publication Critical patent/DK1483769T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281—Mounting of the relay; Encapsulating; Details of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/0056—Apparatus or processes specially adapted for the manufacture of electric switches comprising a successive blank-stamping, insert-moulding and severing operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H2001/5888—Terminals of surface mounted devices [SMD]

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Manufacture Of Switches (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
DK03723687T 2002-03-08 2003-03-06 Stöbt relæenhed til overflademontering og fremgangsmåde til fremstilling af denne DK1483769T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36285602P 2002-03-08 2002-03-08
PCT/US2003/006945 WO2003077269A2 (en) 2002-03-08 2003-03-06 Surface mount molded relay package and method of manufacturing same

Publications (1)

Publication Number Publication Date
DK1483769T3 true DK1483769T3 (da) 2008-01-28

Family

ID=27805238

Family Applications (1)

Application Number Title Priority Date Filing Date
DK03723687T DK1483769T3 (da) 2002-03-08 2003-03-06 Stöbt relæenhed til overflademontering og fremgangsmåde til fremstilling af denne

Country Status (9)

Country Link
US (1) US6683518B2 (da)
EP (1) EP1483769B1 (da)
AT (1) ATE373869T1 (da)
AU (1) AU2003230602A1 (da)
DE (1) DE60316412T2 (da)
DK (1) DK1483769T3 (da)
ES (1) ES2294279T3 (da)
TW (1) TWI226073B (da)
WO (1) WO2003077269A2 (da)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005129452A (ja) * 2003-10-27 2005-05-19 Agilent Technol Inc 導電性ブッシング部を備えたリードリレー及びオフセット電流キャンセル方法
SE527101C2 (sv) * 2004-05-19 2005-12-20 Volvo Lastvagnar Ab Magnetbrytararrangemang och förfarande för att erhålla en differentialmagnetbrytare
US7170376B2 (en) * 2004-12-09 2007-01-30 Eaton Corporation Electrical switching apparatus including a housing and a trip circuit forming a composite structure
TW200744116A (en) * 2006-05-30 2007-12-01 Chen-Kai Lin Method to control the switch by current
FR2907962B1 (fr) * 2006-10-30 2010-01-08 Valeo Securite Habitacle Procede de fabrication d'un module de commutation faible courant et dispositif obtenu par ledit procede
US20080148843A1 (en) * 2006-10-31 2008-06-26 Honeywell International Inc. Integrated thermostat overmolded leadwire construction
US8581113B2 (en) * 2007-12-19 2013-11-12 Bridgewave Communications, Inc. Low cost high frequency device package and methods
GB2468821A (en) 2008-04-15 2010-09-22 Coto Technology Inc Improved form c relay and package using same
US7920038B1 (en) * 2008-05-20 2011-04-05 Keithley Instruments, Inc. Dual shielded relay
GB201305260D0 (en) * 2013-03-22 2013-05-01 Pickering Electronics Ltd Encapsulated Reed Display
JP6392368B2 (ja) * 2014-03-11 2018-09-19 深▲せん▼市智優電池集成技術有限公司Ｓｈｅｎｚｈｅｎ Ｚｈｉｙｏｕ Ｂａｔｔｅｒｙ Ｉｎｔｅｇｒａｔｉｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． リードスイッチリレー
DE202018101423U1 (de) * 2018-03-14 2019-06-17 Tridonic Gmbh & Co Kg Positionierungs- und Montagehilfe für Spulen auf Leiterplatten

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757101A (fr) * 1969-10-06 1971-03-16 Grisby Barton Inc Assemblage de relais
US3939381A (en) * 1974-03-22 1976-02-17 Mcm Industries, Inc. Universal burn-in fixture
US4947235A (en) * 1989-02-21 1990-08-07 Delco Electronics Corporation Integrated circuit shield
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
US5200362A (en) * 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5557142A (en) * 1991-02-04 1996-09-17 Motorola, Inc. Shielded semiconductor device package
FI109960B (fi) * 1991-09-19 2002-10-31 Nokia Corp Elektroninen laite
US5535101A (en) * 1992-11-03 1996-07-09 Motorola, Inc. Leadless integrated circuit package
US5403782A (en) * 1992-12-21 1995-04-04 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with integrated battery mount
CA2092371C (en) * 1993-03-24 1999-06-29 Boris L. Livshits Integrated circuit packaging
US5482898A (en) * 1993-04-12 1996-01-09 Amkor Electronics, Inc. Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
US5294826A (en) * 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
US5355016A (en) * 1993-05-03 1994-10-11 Motorola, Inc. Shielded EPROM package
US5422433A (en) * 1993-11-15 1995-06-06 Motorola, Inc. Radio frequency isolation shield having reclosable opening
DE69400401T2 (de) * 1993-11-16 1997-03-27 Digital Equipment Corp Elektromagnetische Interferenzabschirmung für elektrische Baugruppen
JP3056960B2 (ja) * 1993-12-27 2000-06-26 株式会社東芝 半導体装置及びｂｇａパッケージ
US5583378A (en) * 1994-05-16 1996-12-10 Amkor Electronics, Inc. Ball grid array integrated circuit package with thermal conductor
AU2371795A (en) * 1994-05-17 1995-12-05 Olin Corporation Electronic packages with improved electrical performance
US5459287A (en) * 1994-05-18 1995-10-17 Dell Usa, L.P. Socketed printed circuit board BGA connection apparatus and associated methods
US5486720A (en) * 1994-05-26 1996-01-23 Analog Devices, Inc. EMF shielding of an integrated circuit package
JP2565300B2 (ja) * 1994-05-31 1996-12-18 日本電気株式会社 半導体装置
US5436203A (en) * 1994-07-05 1995-07-25 Motorola, Inc. Shielded liquid encapsulated semiconductor device and method for making the same
US5741729A (en) * 1994-07-11 1998-04-21 Sun Microsystems, Inc. Ball grid array package for an integrated circuit
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
JPH0846073A (ja) * 1994-07-28 1996-02-16 Mitsubishi Electric Corp 半導体装置
US5525834A (en) * 1994-10-17 1996-06-11 W. L. Gore & Associates, Inc. Integrated circuit package
US5701032A (en) * 1994-10-17 1997-12-23 W. L. Gore & Associates, Inc. Integrated circuit package
US5541450A (en) * 1994-11-02 1996-07-30 Motorola, Inc. Low-profile ball-grid array semiconductor package
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5530202A (en) * 1995-01-09 1996-06-25 At&T Corp. Metallic RF or thermal shield for automatic vacuum placement
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
US5789068A (en) * 1995-06-29 1998-08-04 Fry's Metals, Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors
GB9515651D0 (en) * 1995-07-31 1995-09-27 Sgs Thomson Microelectronics A method of manufacturing a ball grid array package
US5650659A (en) * 1995-08-04 1997-07-22 National Semiconductor Corporation Semiconductor component package assembly including an integral RF/EMI shield
US5633786A (en) * 1995-08-21 1997-05-27 Motorola Shield assembly and method of shielding suitable for use in a communication device
KR100201380B1 (ko) * 1995-11-15 1999-06-15 김규현 Bga 반도체 패키지의 열방출 구조
MY128748A (en) * 1995-12-19 2007-02-28 Texas Instruments Inc Plastic packaging for a surface mounted integrated circuit
US5796170A (en) * 1996-02-15 1998-08-18 Northern Telecom Limited Ball grid array (BGA) integrated circuit packages
US5684441A (en) * 1996-02-29 1997-11-04 Graeber; Roger R. Reverse power protection circuit and relay
US5694300A (en) * 1996-04-01 1997-12-02 Northrop Grumman Corporation Electromagnetically channelized microwave integrated circuit
US5789815A (en) * 1996-04-23 1998-08-04 Motorola, Inc. Three dimensional semiconductor package having flexible appendages
US6008708A (en) * 1996-07-16 1999-12-28 Fujitsu Takamisawa Component Limited Reed relay and method for fabrication thereof
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
US5854512A (en) * 1996-09-20 1998-12-29 Vlsi Technology, Inc. High density leaded ball-grid array package
US5831832A (en) * 1997-08-11 1998-11-03 Motorola, Inc. Molded plastic ball grid array package
US5798567A (en) * 1997-08-21 1998-08-25 Hewlett-Packard Company Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors
JPH11204010A (ja) * 1998-01-08 1999-07-30 Fujitsu Takamisawa Component Ltd リードリレーおよびその製造方法
US6052045A (en) * 1999-03-12 2000-04-18 Kearney-National, Inc. Electromechanical switching device package with controlled impedance environment
US6025768A (en) * 1999-03-12 2000-02-15 Kearny-National, Inc. Electromechanical switching device package with controlled impedance environment
US6294971B1 (en) * 2000-07-21 2001-09-25 Kearney-National Inc. Inverted board mounted electromechanical device

Also Published As

Publication number Publication date
DE60316412D1 (de) 2007-10-31
ATE373869T1 (de) 2007-10-15
EP1483769B1 (en) 2007-09-19
AU2003230602A8 (en) 2003-09-22
US6683518B2 (en) 2004-01-27
EP1483769A4 (en) 2005-10-26
DE60316412T2 (de) 2008-11-20
WO2003077269A2 (en) 2003-09-18
TW200402076A (en) 2004-02-01
EP1483769A2 (en) 2004-12-08
AU2003230602A1 (en) 2003-09-22
ES2294279T3 (es) 2008-04-01
WO2003077269A3 (en) 2003-12-18
US20030169138A1 (en) 2003-09-11
TWI226073B (en) 2005-01-01

Similar Documents

Publication Publication Date Title
US8319245B2 (en) Lead frame, and light emitting diode module having the same
DK1483769T3 (da) Stöbt relæenhed til overflademontering og fremgangsmåde til fremstilling af denne
IT1276178B1 (it) Componente elettronico pluripolare montabile sulla superficie
EP1011810A4 (en) FLEXIBLE COMPACT LADDER PLATE ASSEMBLY
ATE263441T1 (de) Elektrischer verbinder hoher dichte
ATE416478T1 (de) Leistungshalbleitermodul
ATE319201T1 (de) Kontakt für elektrische komponente
BR9712107A (pt) Módulo de chip e processo para a fabricação de um módulo de chip.
CY1110279T1 (el) Βυσματικος συνδετηρας καλωδιων για τυπωμενα κυκλωματα
US7147337B1 (en) Module for lighted garments, shoes or accessories
TW200605279A (en) Semiconductor device and manufacturing method thereof
DE60011792D1 (de) Elektrische/elektronische schaltungsanordnung
KR920001692A (ko) 제로 전력 ic 모듈
WO2004080134A3 (en) High frequency chip packages with connecting elements
WO2006005304A3 (de) Halbleiterbauteil mit einem halbleiterchip und elektrischen verbindungselementen zu einer leiterstruktur
US6717260B2 (en) Clip-type lead frame for source mounted die
ATE365371T1 (de) Träger für eine elektrische schaltung, insbesondere für einen elektrischen schalter
WO2002060004A3 (en) An integrated antenna system
WO2004003575A3 (de) Testvorrichtung für bauteile integrierter schaltungen
ATE316688T1 (de) Spulenk rper und spule f r leiterplattenmontage
DE59805322D1 (de) Gehäuse für eine elektronische oder elektrische schaltung
DE50102494D1 (de) Baugruppenträger für elektrische/elektronische bauelemente
WO2001097285A3 (de) Elektronisches bauteil aus einem gehäuse und einem substrat
WO2002082584A3 (en) Electrical terminal tail aligner
PL1784110T3 (pl) Odkurzacz z płytką drukowaną mocowaną bez naprężeń