DE60316412D1 - Relaisformgehäuse zur oberflächenanbringung und verfahren zu seiner herstellung - Google Patents

Relaisformgehäuse zur oberflächenanbringung und verfahren zu seiner herstellung

Info

Publication number
DE60316412D1
DE60316412D1 DE60316412T DE60316412T DE60316412D1 DE 60316412 D1 DE60316412 D1 DE 60316412D1 DE 60316412 T DE60316412 T DE 60316412T DE 60316412 T DE60316412 T DE 60316412T DE 60316412 D1 DE60316412 D1 DE 60316412D1
Authority
DE
Germany
Prior art keywords
reed switch
signal
conductors
ground
ground conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60316412T
Other languages
English (en)
Other versions
DE60316412T2 (de
Inventor
James J Motta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
COTO TECHNOLOGY,INC., WARWICK, R.I., US
Original Assignee
Kearney National Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kearney National Inc filed Critical Kearney National Inc
Publication of DE60316412D1 publication Critical patent/DE60316412D1/de
Application granted granted Critical
Publication of DE60316412T2 publication Critical patent/DE60316412T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281—Mounting of the relay; Encapsulating; Details of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/0056—Apparatus or processes specially adapted for the manufacture of electric switches comprising a successive blank-stamping, insert-moulding and severing operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H2001/5888—Terminals of surface mounted devices [SMD]

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Manufacture Of Switches (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
DE60316412T 2002-03-08 2003-03-06 Relaisformgehäuse zur oberflächenanbringung und verfahren zu seiner herstellung Expired - Fee Related DE60316412T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36285602P 2002-03-08 2002-03-08
US362856P 2002-03-08
PCT/US2003/006945 WO2003077269A2 (en) 2002-03-08 2003-03-06 Surface mount molded relay package and method of manufacturing same

Publications (2)

Publication Number Publication Date
DE60316412D1 true DE60316412D1 (de) 2007-10-31
DE60316412T2 DE60316412T2 (de) 2008-11-20

Family

ID=27805238

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60316412T Expired - Fee Related DE60316412T2 (de) 2002-03-08 2003-03-06 Relaisformgehäuse zur oberflächenanbringung und verfahren zu seiner herstellung

Country Status (9)

Country Link
US (1) US6683518B2 (de)
EP (1) EP1483769B1 (de)
AT (1) ATE373869T1 (de)
AU (1) AU2003230602A1 (de)
DE (1) DE60316412T2 (de)
DK (1) DK1483769T3 (de)
ES (1) ES2294279T3 (de)
TW (1) TWI226073B (de)
WO (1) WO2003077269A2 (de)

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JP2005129452A (ja) * 2003-10-27 2005-05-19 Agilent Technol Inc 導電性ブッシング部を備えたリードリレー及びオフセット電流キャンセル方法
SE527101C2 (sv) * 2004-05-19 2005-12-20 Volvo Lastvagnar Ab Magnetbrytararrangemang och förfarande för att erhålla en differentialmagnetbrytare
US7170376B2 (en) * 2004-12-09 2007-01-30 Eaton Corporation Electrical switching apparatus including a housing and a trip circuit forming a composite structure
TW200744116A (en) * 2006-05-30 2007-12-01 Chen-Kai Lin Method to control the switch by current
FR2907962B1 (fr) * 2006-10-30 2010-01-08 Valeo Securite Habitacle Procede de fabrication d'un module de commutation faible courant et dispositif obtenu par ledit procede
US20080148843A1 (en) * 2006-10-31 2008-06-26 Honeywell International Inc. Integrated thermostat overmolded leadwire construction
US8581113B2 (en) * 2007-12-19 2013-11-12 Bridgewave Communications, Inc. Low cost high frequency device package and methods
GB2468821A (en) 2008-04-15 2010-09-22 Coto Technology Inc Improved form c relay and package using same
US7920038B1 (en) * 2008-05-20 2011-04-05 Keithley Instruments, Inc. Dual shielded relay
GB201305260D0 (en) * 2013-03-22 2013-05-01 Pickering Electronics Ltd Encapsulated Reed Display
JP6392368B2 (ja) * 2014-03-11 2018-09-19 深▲せん▼市智優電池集成技術有限公司Ｓｈｅｎｚｈｅｎ Ｚｈｉｙｏｕ Ｂａｔｔｅｒｙ Ｉｎｔｅｇｒａｔｉｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． リードスイッチリレー
DE202018101423U1 (de) * 2018-03-14 2019-06-17 Tridonic Gmbh & Co Kg Positionierungs- und Montagehilfe für Spulen auf Leiterplatten

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US4947235A (en) * 1989-02-21 1990-08-07 Delco Electronics Corporation Integrated circuit shield
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US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5557142A (en) * 1991-02-04 1996-09-17 Motorola, Inc. Shielded semiconductor device package
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US5403782A (en) * 1992-12-21 1995-04-04 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with integrated battery mount
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US5482898A (en) * 1993-04-12 1996-01-09 Amkor Electronics, Inc. Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
US5294826A (en) * 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
US5355016A (en) * 1993-05-03 1994-10-11 Motorola, Inc. Shielded EPROM package
US5422433A (en) * 1993-11-15 1995-06-06 Motorola, Inc. Radio frequency isolation shield having reclosable opening
DE69400401T2 (de) * 1993-11-16 1997-03-27 Digital Equipment Corp Elektromagnetische Interferenzabschirmung für elektrische Baugruppen
JP3056960B2 (ja) * 1993-12-27 2000-06-26 株式会社東芝 半導体装置及びｂｇａパッケージ
US5583378A (en) * 1994-05-16 1996-12-10 Amkor Electronics, Inc. Ball grid array integrated circuit package with thermal conductor
AU2371795A (en) * 1994-05-17 1995-12-05 Olin Corporation Electronic packages with improved electrical performance
US5459287A (en) * 1994-05-18 1995-10-17 Dell Usa, L.P. Socketed printed circuit board BGA connection apparatus and associated methods
US5486720A (en) * 1994-05-26 1996-01-23 Analog Devices, Inc. EMF shielding of an integrated circuit package
JP2565300B2 (ja) * 1994-05-31 1996-12-18 日本電気株式会社 半導体装置
US5436203A (en) * 1994-07-05 1995-07-25 Motorola, Inc. Shielded liquid encapsulated semiconductor device and method for making the same
US5741729A (en) * 1994-07-11 1998-04-21 Sun Microsystems, Inc. Ball grid array package for an integrated circuit
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
JPH0846073A (ja) * 1994-07-28 1996-02-16 Mitsubishi Electric Corp 半導体装置
US5525834A (en) * 1994-10-17 1996-06-11 W. L. Gore & Associates, Inc. Integrated circuit package
US5701032A (en) * 1994-10-17 1997-12-23 W. L. Gore & Associates, Inc. Integrated circuit package
US5541450A (en) * 1994-11-02 1996-07-30 Motorola, Inc. Low-profile ball-grid array semiconductor package
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5530202A (en) * 1995-01-09 1996-06-25 At&T Corp. Metallic RF or thermal shield for automatic vacuum placement
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
US5789068A (en) * 1995-06-29 1998-08-04 Fry's Metals, Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors
GB9515651D0 (en) * 1995-07-31 1995-09-27 Sgs Thomson Microelectronics A method of manufacturing a ball grid array package
US5650659A (en) * 1995-08-04 1997-07-22 National Semiconductor Corporation Semiconductor component package assembly including an integral RF/EMI shield
US5633786A (en) * 1995-08-21 1997-05-27 Motorola Shield assembly and method of shielding suitable for use in a communication device
KR100201380B1 (ko) * 1995-11-15 1999-06-15 김규현 Bga 반도체 패키지의 열방출 구조
MY128748A (en) * 1995-12-19 2007-02-28 Texas Instruments Inc Plastic packaging for a surface mounted integrated circuit
US5796170A (en) * 1996-02-15 1998-08-18 Northern Telecom Limited Ball grid array (BGA) integrated circuit packages
US5684441A (en) * 1996-02-29 1997-11-04 Graeber; Roger R. Reverse power protection circuit and relay
US5694300A (en) * 1996-04-01 1997-12-02 Northrop Grumman Corporation Electromagnetically channelized microwave integrated circuit
US5789815A (en) * 1996-04-23 1998-08-04 Motorola, Inc. Three dimensional semiconductor package having flexible appendages
US6008708A (en) * 1996-07-16 1999-12-28 Fujitsu Takamisawa Component Limited Reed relay and method for fabrication thereof
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
US5854512A (en) * 1996-09-20 1998-12-29 Vlsi Technology, Inc. High density leaded ball-grid array package
US5831832A (en) * 1997-08-11 1998-11-03 Motorola, Inc. Molded plastic ball grid array package
US5798567A (en) * 1997-08-21 1998-08-25 Hewlett-Packard Company Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors
JPH11204010A (ja) * 1998-01-08 1999-07-30 Fujitsu Takamisawa Component Ltd リードリレーおよびその製造方法
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US6294971B1 (en) * 2000-07-21 2001-09-25 Kearney-National Inc. Inverted board mounted electromechanical device

Also Published As

Publication number Publication date
ATE373869T1 (de) 2007-10-15
EP1483769B1 (de) 2007-09-19
AU2003230602A8 (en) 2003-09-22
US6683518B2 (en) 2004-01-27
DK1483769T3 (da) 2008-01-28
EP1483769A4 (de) 2005-10-26
DE60316412T2 (de) 2008-11-20
WO2003077269A2 (en) 2003-09-18
TW200402076A (en) 2004-02-01
EP1483769A2 (de) 2004-12-08
AU2003230602A1 (en) 2003-09-22
ES2294279T3 (es) 2008-04-01
WO2003077269A3 (en) 2003-12-18
US20030169138A1 (en) 2003-09-11
TWI226073B (en) 2005-01-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: COTO TECHNOLOGY,INC., WARWICK, R.I., US

8339 Ceased/non-payment of the annual fee