DK1155078T3 - Forstærkede polyamider med höjt modul - Google Patents
Forstærkede polyamider med höjt modulInfo
- Publication number
- DK1155078T3 DK1155078T3 DK00913509T DK00913509T DK1155078T3 DK 1155078 T3 DK1155078 T3 DK 1155078T3 DK 00913509 T DK00913509 T DK 00913509T DK 00913509 T DK00913509 T DK 00913509T DK 1155078 T3 DK1155078 T3 DK 1155078T3
- Authority
- DK
- Denmark
- Prior art keywords
- high modulus
- reinforced polyamides
- modulus reinforced
- composition
- polyamides
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12067199P | 1999-02-19 | 1999-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1155078T3 true DK1155078T3 (da) | 2005-11-14 |
Family
ID=22391811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK00913509T DK1155078T3 (da) | 1999-02-19 | 2000-02-18 | Forstærkede polyamider med höjt modul |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1155078B1 (da) |
JP (1) | JP2002537431A (da) |
AT (1) | ATE305950T1 (da) |
CA (1) | CA2362957C (da) |
DE (1) | DE60022985T2 (da) |
DK (1) | DK1155078T3 (da) |
ES (1) | ES2249251T3 (da) |
WO (1) | WO2000049081A1 (da) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2291414B1 (en) | 2008-06-12 | 2015-07-22 | 3M Innovative Properties Company | Methods of compounding nanoparticles with a resin |
EP2617762A1 (en) | 2008-12-19 | 2013-07-24 | 3M Innovative Properties Company | Nanocalcite composites |
WO2011050121A2 (en) | 2009-10-21 | 2011-04-28 | 3M Innovative Properties Company | Solventless functionalization, milling, and compounding process with reactive diluents |
KR101793303B1 (ko) | 2009-12-17 | 2017-11-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 나노방해석 및 비닐 에스테르 복합물 |
US10035909B2 (en) | 2009-12-17 | 2018-07-31 | 3M Innovative Properties Company | High magnesium surface concentration nanocalcite composites |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE792985A (fr) * | 1971-12-20 | 1973-04-16 | Asahi Chemical Ind | Compositions de matieres thermoplastiques |
DE2659933C3 (de) * | 1975-05-30 | 1981-08-06 | Kyowa Chemical Industry Co. Ltd., Tokyo | Feste, mit anionischen oberflächenaktiven Stoffen überzogene Magnesiumhydroxidteilchen und deren Verwendung |
US4795768A (en) * | 1985-07-11 | 1989-01-03 | Union Carbide Corporation | Impact promoters for mineral-filled thermoplastics |
EP0423510A1 (en) * | 1989-10-20 | 1991-04-24 | General Electric Company | Highly dense thermoplastic molding compositions |
JPH03227367A (ja) * | 1990-01-31 | 1991-10-08 | Maruo Calcium Co Ltd | 表面処理無機粉体及び該表面処理無機粉体を填料としてなる合成樹脂組成物 |
JP3110089B2 (ja) * | 1991-07-22 | 2000-11-20 | 三菱化学株式会社 | 樹脂組成物 |
JP3362061B2 (ja) * | 1992-11-20 | 2003-01-07 | 旭化成株式会社 | ポリアミド樹脂組成物 |
DE4312752A1 (de) * | 1993-04-20 | 1994-10-27 | Basf Ag | Flammgeschützte thermoplastische Formmassen auf der Basis von Polyamiden |
IL117216A (en) * | 1995-02-23 | 2003-10-31 | Martinswerk Gmbh | Surface-modified filler composition |
GB2301105A (en) * | 1995-05-23 | 1996-11-27 | Bip Plastics Limited | Moulding compositions containing a polyamide |
-
2000
- 2000-02-18 WO PCT/US2000/004105 patent/WO2000049081A1/en active Search and Examination
- 2000-02-18 JP JP2000599815A patent/JP2002537431A/ja active Pending
- 2000-02-18 ES ES00913509T patent/ES2249251T3/es not_active Expired - Lifetime
- 2000-02-18 DE DE60022985T patent/DE60022985T2/de not_active Expired - Lifetime
- 2000-02-18 CA CA002362957A patent/CA2362957C/en not_active Expired - Fee Related
- 2000-02-18 DK DK00913509T patent/DK1155078T3/da active
- 2000-02-18 AT AT00913509T patent/ATE305950T1/de not_active IP Right Cessation
- 2000-02-18 EP EP00913509A patent/EP1155078B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE305950T1 (de) | 2005-10-15 |
CA2362957A1 (en) | 2000-08-24 |
WO2000049081A1 (en) | 2000-08-24 |
JP2002537431A (ja) | 2002-11-05 |
EP1155078B1 (en) | 2005-10-05 |
CA2362957C (en) | 2009-10-27 |
ES2249251T3 (es) | 2006-04-01 |
DE60022985T2 (de) | 2006-07-27 |
EP1155078A1 (en) | 2001-11-21 |
DE60022985D1 (de) | 2006-02-16 |
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