DK0697018T3 - Fremgangsmåde til fremstilling af glycidylestere til brug i elektronik-klæbemidler - Google Patents
Fremgangsmåde til fremstilling af glycidylestere til brug i elektronik-klæbemidlerInfo
- Publication number
- DK0697018T3 DK0697018T3 DK95912035T DK95912035T DK0697018T3 DK 0697018 T3 DK0697018 T3 DK 0697018T3 DK 95912035 T DK95912035 T DK 95912035T DK 95912035 T DK95912035 T DK 95912035T DK 0697018 T3 DK0697018 T3 DK 0697018T3
- Authority
- DK
- Denmark
- Prior art keywords
- glycidyl esters
- producing glycidyl
- adhesives
- electronics
- electronics adhesives
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
- Epoxy Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/206,778 US5536855A (en) | 1994-03-04 | 1994-03-04 | Process for preparing glycidyl esters for use in electronics adhesives |
PCT/US1995/002623 WO1995023794A2 (en) | 1994-03-04 | 1995-03-03 | Glycidyl esters for use in electronics adhesives and process for their preparation |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0697018T3 true DK0697018T3 (da) | 1999-08-02 |
Family
ID=22767924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK95912035T DK0697018T3 (da) | 1994-03-04 | 1995-03-03 | Fremgangsmåde til fremstilling af glycidylestere til brug i elektronik-klæbemidler |
Country Status (10)
Country | Link |
---|---|
US (1) | US5536855A (da) |
EP (1) | EP0697018B1 (da) |
JP (1) | JPH08510473A (da) |
KR (1) | KR100263526B1 (da) |
AU (1) | AU1938295A (da) |
CA (1) | CA2162253C (da) |
DE (2) | DE69506056T2 (da) |
DK (1) | DK0697018T3 (da) |
GB (1) | GB2292148B (da) |
WO (1) | WO1995023794A2 (da) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5770706A (en) * | 1995-06-07 | 1998-06-23 | National Starch And Chemical Investment Holding Corporation | Snap-cure epoxy adhesives |
US5717054A (en) * | 1995-06-07 | 1998-02-10 | National Starch & Chemical Investment Holding Corp. | Epoxy resins consisting of flexible chains terminated with glycidyloxyphenyl groups for use in microelectronics adhesives |
US5646315A (en) * | 1995-06-07 | 1997-07-08 | National Starch And Chemical Investment Holding Corporation | Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives |
US6211572B1 (en) * | 1995-10-31 | 2001-04-03 | Tessera, Inc. | Semiconductor chip package with fan-in leads |
WO2002028849A1 (en) * | 2000-10-04 | 2002-04-11 | Henkel Loctite Corporation | Reworkable epoxidized 1-(cyclo)alkenyl ether/polycarboxylic acid product |
US20050137357A1 (en) * | 2003-12-18 | 2005-06-23 | Skoglund Michael J. | Epoxy adhesive composition method of preparing and using |
US20070299218A1 (en) * | 2006-06-22 | 2007-12-27 | Syh-Tau Yeh | Solder-resistant flexible thermosetting epoxy resin system |
JP5449150B2 (ja) | 2007-06-28 | 2014-03-19 | ビーエーエスエフ ソシエタス・ヨーロピア | C10アルカン酸グリシドエステル及びその使用 |
DE102009056187A1 (de) | 2008-11-28 | 2010-07-15 | Basf Se | Polyesterharz auf Basis von 2-Propylheptansäureglycidester und/oder 4-Methyl-2 propylhexansäureglycidester |
JP6686457B2 (ja) * | 2016-01-15 | 2020-04-22 | 住友ベークライト株式会社 | 封止用樹脂組成物および電子装置 |
CN114478622A (zh) * | 2022-03-17 | 2022-05-13 | 沈阳金久奇科技有限公司 | 一种磷脂酰胆碱的制备方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE7514137L (sv) * | 1975-01-24 | 1976-07-26 | Ciba Geigy Ag | Sett att framstella polykarboxylsyrapolyglycidylestrar |
CH619218A5 (en) * | 1975-12-03 | 1980-09-15 | Ciba Geigy Ag | Process for the preparation of polyglycidyl polycarboxylates |
DE2835886A1 (de) * | 1978-08-16 | 1980-02-28 | Bayer Ag | Verfahren zur herstellung von glycidylestern aromatischer polycarbonsaeuren |
DE2835881A1 (de) * | 1978-08-16 | 1980-02-28 | Bayer Ag | Verfahren zur herstellung von glycidylestern cycloaliphatischer polycarbonsaeuren |
JPS588710B2 (ja) * | 1978-10-31 | 1983-02-17 | 大阪曹達株式会社 | ロジングリシジルエステルの製法 |
JPS6011910B2 (ja) * | 1979-10-26 | 1985-03-28 | 岡村製油株式会社 | ポリカルボン酸グリシジルエステル |
JPS58201866A (ja) * | 1982-05-19 | 1983-11-24 | Arakawa Chem Ind Co Ltd | ロジンジグリセリドの選択的製造法 |
DE3247255A1 (de) * | 1982-12-21 | 1984-06-28 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von isolierung von polyglycidylverbindungen |
US4866108A (en) * | 1988-01-19 | 1989-09-12 | Hughes Aircraft Company | Flexible epoxy adhesive blend |
US4975221A (en) * | 1989-05-12 | 1990-12-04 | National Starch And Chemical Investment Holding Corporation | High purity epoxy formulations for use as die attach adhesives |
US5036154A (en) * | 1989-11-15 | 1991-07-30 | The Dow Chemical Company | Preparation of glycidyl esters |
US5138078A (en) * | 1990-03-15 | 1992-08-11 | Ciba-Geigy Corporation | Glycidyl esters of tricarboxylic acid adducts |
US5250600A (en) * | 1992-05-28 | 1993-10-05 | Johnson Matthey Inc. | Low temperature flexible die attach adhesive and articles using same |
US5218063A (en) * | 1991-06-26 | 1993-06-08 | W. R. Grace & Co.-Conn. | Epoxy adhesives and methods of using cured compositions therefrom |
JP3142610B2 (ja) * | 1991-09-25 | 2001-03-07 | 株式会社日本触媒 | 不飽和エステル化合物の製造方法 |
-
1994
- 1994-03-04 US US08/206,778 patent/US5536855A/en not_active Expired - Lifetime
-
1995
- 1995-03-03 CA CA002162253A patent/CA2162253C/en not_active Expired - Fee Related
- 1995-03-03 DE DE69506056T patent/DE69506056T2/de not_active Expired - Fee Related
- 1995-03-03 DE DE0697018T patent/DE697018T1/de active Pending
- 1995-03-03 WO PCT/US1995/002623 patent/WO1995023794A2/en active IP Right Grant
- 1995-03-03 GB GB9522618A patent/GB2292148B/en not_active Expired - Fee Related
- 1995-03-03 KR KR1019950704793A patent/KR100263526B1/ko not_active IP Right Cessation
- 1995-03-03 EP EP95912035A patent/EP0697018B1/en not_active Expired - Lifetime
- 1995-03-03 JP JP7523037A patent/JPH08510473A/ja active Pending
- 1995-03-03 AU AU19382/95A patent/AU1938295A/en not_active Abandoned
- 1995-03-03 DK DK95912035T patent/DK0697018T3/da active
Also Published As
Publication number | Publication date |
---|---|
GB2292148B (en) | 1996-05-01 |
KR100263526B1 (ko) | 2001-11-30 |
WO1995023794A2 (en) | 1995-09-08 |
US5536855A (en) | 1996-07-16 |
WO1995023794A3 (en) | 1995-10-19 |
CA2162253C (en) | 1998-06-30 |
DE697018T1 (de) | 1996-10-10 |
DE69506056D1 (de) | 1998-12-24 |
GB9522618D0 (en) | 1996-01-03 |
CA2162253A1 (en) | 1995-09-08 |
DE69506056T2 (de) | 1999-07-15 |
EP0697018B1 (en) | 1998-11-18 |
AU1938295A (en) | 1995-09-18 |
GB2292148A (en) | 1996-02-14 |
EP0697018A1 (en) | 1996-02-21 |
JPH08510473A (ja) | 1996-11-05 |
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