DK0613608T3 - - Google Patents
Info
- Publication number
- DK0613608T3 DK0613608T3 DK93921699.0T DK93921699T DK0613608T3 DK 0613608 T3 DK0613608 T3 DK 0613608T3 DK 93921699 T DK93921699 T DK 93921699T DK 0613608 T3 DK0613608 T3 DK 0613608T3
- Authority
- DK
- Denmark
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/951,504 US5396397A (en) | 1992-09-24 | 1992-09-24 | Field control and stability enhancement in multi-layer, 3-dimensional structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK0613608T3 true DK0613608T3 (US06815460-20041109-C00097.png) | 1997-05-05 |
Family
ID=25491760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK93921699.0T DK0613608T3 (US06815460-20041109-C00097.png) | 1992-09-24 | 1993-09-21 |
Country Status (10)
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5780375A (en) * | 1993-10-19 | 1998-07-14 | E. I. Du Pont De Nemours And Company | Thick film composition for modifying the electrical properties of a dielectric layer |
| US5590017A (en) * | 1995-04-03 | 1996-12-31 | Aluminum Company Of America | Alumina multilayer wiring substrate provided with high dielectric material layer |
| US5886597A (en) * | 1997-03-28 | 1999-03-23 | Virginia Tech Intellectual Properties, Inc. | Circuit structure including RF/wideband resonant vias |
| US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
| US5929729A (en) | 1997-10-24 | 1999-07-27 | Com Dev Limited | Printed lumped element stripline circuit ground-signal-ground structure |
| JP2000124612A (ja) * | 1998-01-19 | 2000-04-28 | Toshiba Corp | 配線基板とその製造方法、その配線基板を具える電気機器 |
| JP3119630B2 (ja) * | 1998-09-18 | 2000-12-25 | 日本電気株式会社 | 半導体チップモジュール用多層回路基板およびその製造方法 |
| KR20000034924A (ko) * | 1998-11-17 | 2000-06-26 | 제닌 엠. 데이비스 | 저온 동시소성 다층세라믹내 수동 전자소자들 |
| US6288906B1 (en) * | 1998-12-18 | 2001-09-11 | Intel Corporation | Multiple layer printed circuit board having power planes on outer layers |
| CN1339199A (zh) * | 1999-02-03 | 2002-03-06 | 西门子公司 | 集成的天线耦合元件 |
| US6205032B1 (en) * | 1999-03-16 | 2001-03-20 | Cts Corporation | Low temperature co-fired ceramic with improved registration |
| US6429383B1 (en) * | 1999-04-14 | 2002-08-06 | Intel Corporation | Apparatus and method for improving circuit board solder |
| US6492600B1 (en) * | 1999-06-28 | 2002-12-10 | International Business Machines Corporation | Laminate having plated microvia interconnects and method for forming the same |
| US6395996B1 (en) * | 2000-05-16 | 2002-05-28 | Silicon Integrated Systems Corporation | Multi-layered substrate with a built-in capacitor design |
| JP2002111222A (ja) * | 2000-10-02 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 多層基板 |
| DE10063437A1 (de) * | 2000-12-20 | 2002-07-11 | Bosch Gmbh Robert | Antennenanordnung |
| JP3586435B2 (ja) * | 2001-03-30 | 2004-11-10 | ユーディナデバイス株式会社 | 高周波半導体装置 |
| JP3818864B2 (ja) * | 2001-03-30 | 2006-09-06 | ユーディナデバイス株式会社 | 高周波半導体装置 |
| JP3781178B2 (ja) * | 2001-03-30 | 2006-05-31 | ユーディナデバイス株式会社 | 高周波半導体装置の多層配線構造 |
| US6900992B2 (en) * | 2001-09-18 | 2005-05-31 | Intel Corporation | Printed circuit board routing and power delivery for high frequency integrated circuits |
| US6963493B2 (en) * | 2001-11-08 | 2005-11-08 | Avx Corporation | Multilayer electronic devices with via components |
| JP3792635B2 (ja) * | 2001-12-14 | 2006-07-05 | 富士通株式会社 | 電子装置 |
| JP2003204209A (ja) * | 2002-01-07 | 2003-07-18 | Kyocera Corp | 高周波用配線基板 |
| US6711029B2 (en) * | 2002-05-21 | 2004-03-23 | Cts Corporation | Low temperature co-fired ceramic with improved shrinkage control |
| US7349225B1 (en) * | 2002-10-22 | 2008-03-25 | Odyssian Technology, Llc | Multifunctional composite sandwich element with embedded electronics |
| US7265300B2 (en) | 2003-03-21 | 2007-09-04 | Commscope Solutions Properties, Llc | Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes |
| US8569142B2 (en) * | 2003-11-28 | 2013-10-29 | Blackberry Limited | Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
| US7342181B2 (en) * | 2004-03-12 | 2008-03-11 | Commscope Inc. Of North Carolina | Maximizing capacitance per unit area while minimizing signal transmission delay in PCB |
| US6908809B1 (en) * | 2004-04-02 | 2005-06-21 | Harris Corporation | Embedded capacitors using conductor filled vias |
| US7190594B2 (en) * | 2004-05-14 | 2007-03-13 | Commscope Solutions Properties, Llc | Next high frequency improvement by using frequency dependent effective capacitance |
| US7980900B2 (en) * | 2004-05-14 | 2011-07-19 | Commscope, Inc. Of North Carolina | Next high frequency improvement by using frequency dependent effective capacitance |
| US7067026B2 (en) * | 2004-11-22 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
| US7175724B2 (en) * | 2004-11-22 | 2007-02-13 | E. I. Du Pont De Nemours And Company | Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
| US20060213686A1 (en) * | 2004-12-28 | 2006-09-28 | Shin-Hsien Wu | Cut Via Structure For And Manufacturing Method Of Connecting Separate Conductors |
| KR20070107746A (ko) | 2005-03-01 | 2007-11-07 | 엑스2와이 어테뉴에이터스, 엘.엘.씨 | 내부 중첩된 조절기 |
| JP4907281B2 (ja) * | 2006-09-26 | 2012-03-28 | 日東電工株式会社 | フレキシブル配線回路基板 |
| US7742276B2 (en) * | 2007-03-30 | 2010-06-22 | Industrial Technology Research Institute | Wiring structure of laminated capacitors |
| CN101772994B (zh) * | 2007-07-26 | 2011-07-20 | 株式会社村田制作所 | 多层陶瓷基板及其制造方法 |
| US8047879B2 (en) * | 2009-01-26 | 2011-11-01 | Commscope, Inc. Of North Carolina | Printed wiring boards and communication connectors having series inductor-capacitor crosstalk compensation circuits that share a common inductor |
| KR101038234B1 (ko) * | 2009-02-24 | 2011-06-01 | 삼성전기주식회사 | 전자기 밴드갭 구조를 이용한 ｅｍｉ 노이즈 저감 기판 |
| JP5397539B2 (ja) * | 2010-03-31 | 2014-01-22 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法 |
| US20130052433A1 (en) * | 2011-08-29 | 2013-02-28 | E I Du Pont De Nemours And Company | Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom |
| TW201817280A (zh) * | 2016-07-06 | 2018-05-01 | 亮銳公司 | 用於整合式發光二極體驅動器之印刷電路板 |
| CN206451500U (zh) * | 2017-02-06 | 2017-08-29 | 京东方科技集团股份有限公司 | 显示装置控制单元和显示装置 |
| CN115483033A (zh) * | 2022-09-02 | 2022-12-16 | 深圳聚源新材科技有限公司 | 电容器、电路板及电路板埋容工艺 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55130198A (en) * | 1979-03-30 | 1980-10-08 | Hitachi Ltd | Hybrid integrated circuit board for tuner |
| US4567542A (en) * | 1984-04-23 | 1986-01-28 | Nec Corporation | Multilayer ceramic substrate with interlayered capacitor |
| JPS61147406A (ja) * | 1984-12-18 | 1986-07-05 | 太陽誘電株式会社 | 誘電体磁器組成物 |
| GB2197540B (en) * | 1986-11-12 | 1991-04-17 | Murata Manufacturing Co | A circuit structure. |
| JPH0682927B2 (ja) * | 1988-01-26 | 1994-10-19 | 松下電工株式会社 | ポリフェニレンオキサイド樹脂系ｌｃｒ多層板 |
| JPH0614600B2 (ja) * | 1988-01-26 | 1994-02-23 | 松下電工株式会社 | Ｌｃｒ多層板 |
| US5089881A (en) * | 1988-11-03 | 1992-02-18 | Micro Substrates, Inc. | Fine-pitch chip carrier |
| US4882650A (en) * | 1988-12-05 | 1989-11-21 | Sprague Electric Company | Magnesium titanate ceramic and dual dielectric substrate using same |
| JPH02281688A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板 |
| JP3033972B2 (ja) * | 1989-06-15 | 2000-04-17 | 日本特殊陶業株式会社 | アルミナ多層配線基板及びその製造方法 |
| US5010641A (en) * | 1989-06-30 | 1991-04-30 | Unisys Corp. | Method of making multilayer printed circuit board |
| JPH03187503A (ja) * | 1989-12-15 | 1991-08-15 | Matsushita Electric Works Ltd | 多層基板 |
| US5055966A (en) * | 1990-12-17 | 1991-10-08 | Hughes Aircraft Company | Via capacitors within multi-layer, 3 dimensional structures/substrates |
| US5144526A (en) * | 1991-08-05 | 1992-09-01 | Hughes Aircraft Company | Low temperature co-fired ceramic structure containing buried capacitors |
| US5185690A (en) * | 1991-10-16 | 1993-02-09 | Miller Mark L | High dielectric constant sheet material |
-
1992
- 1992-09-24 US US07/951,504 patent/US5396397A/en not_active Expired - Lifetime
-
1993
- 1993-09-21 EP EP93921699A patent/EP0613608B1/en not_active Expired - Lifetime
- 1993-09-21 DE DE69309652T patent/DE69309652T2/de not_active Expired - Fee Related
- 1993-09-21 CA CA002125994A patent/CA2125994C/en not_active Expired - Fee Related
- 1993-09-21 ES ES93921699T patent/ES2101345T3/es not_active Expired - Lifetime
- 1993-09-21 WO PCT/US1993/008901 patent/WO1994007347A1/en active IP Right Grant
- 1993-09-21 DK DK93921699.0T patent/DK0613608T3/da active
- 1993-09-21 JP JP6508384A patent/JPH07501909A/ja active Pending
- 1993-09-24 MX MX9305884A patent/MX9305884A/es not_active IP Right Cessation
-
1997
- 1997-06-06 GR GR970401347T patent/GR3023705T3/el unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO1994007347A1 (en) | 1994-03-31 |
| EP0613608A1 (en) | 1994-09-07 |
| ES2101345T3 (es) | 1997-07-01 |
| EP0613608B1 (en) | 1997-04-09 |
| DE69309652T2 (de) | 1997-10-30 |
| CA2125994C (en) | 1997-08-12 |
| MX9305884A (es) | 1994-05-31 |
| JPH07501909A (ja) | 1995-02-23 |
| GR3023705T3 (en) | 1997-09-30 |
| DE69309652D1 (de) | 1997-05-15 |
| CA2125994A1 (en) | 1994-03-31 |
| US5396397A (en) | 1995-03-07 |
