DK0540101T3 - To-lags eller flerlags trykt kredsløbskort - Google Patents
To-lags eller flerlags trykt kredsløbskortInfo
- Publication number
- DK0540101T3 DK0540101T3 DK92203266.9T DK92203266T DK0540101T3 DK 0540101 T3 DK0540101 T3 DK 0540101T3 DK 92203266 T DK92203266 T DK 92203266T DK 0540101 T3 DK0540101 T3 DK 0540101T3
- Authority
- DK
- Denmark
- Prior art keywords
- hole
- layer
- conductor pattern
- solder
- adhesive layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Hall/Mr Elements (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Medicines Containing Material From Animals Or Micro-Organisms (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0217191A AT398876B (de) | 1991-10-31 | 1991-10-31 | Zwei- oder mehrlagige leiterplatte |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0540101T3 true DK0540101T3 (da) | 1995-11-06 |
Family
ID=3529249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK92203266.9T DK0540101T3 (da) | 1991-10-31 | 1992-10-23 | To-lags eller flerlags trykt kredsløbskort |
Country Status (8)
Country | Link |
---|---|
US (1) | US5403978A (da) |
EP (1) | EP0540101B1 (da) |
JP (1) | JPH05218627A (da) |
AT (2) | AT398876B (da) |
DE (1) | DE69202749T2 (da) |
DK (1) | DK0540101T3 (da) |
ES (1) | ES2075599T3 (da) |
MY (1) | MY110093A (da) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6076726A (en) * | 1998-07-01 | 2000-06-20 | International Business Machines Corporation | Pad-on-via assembly technique |
KR100333612B1 (ko) * | 1999-09-21 | 2002-04-24 | 구자홍 | 인쇄회로기판의 회로패턴 노출부 형성방법 |
US6594153B1 (en) * | 2000-06-27 | 2003-07-15 | Intel Corporation | Circuit package for electronic systems |
DE10361650A1 (de) * | 2003-12-30 | 2005-08-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul und Verfahren zu dessen Herstellung |
TWI355220B (en) | 2008-07-14 | 2011-12-21 | Unimicron Technology Corp | Circuit board structure |
CN102281724B (zh) * | 2011-08-26 | 2013-05-22 | 广州杰赛科技股份有限公司 | 双面开窗塞孔的加工方法 |
JP7381323B2 (ja) * | 2019-12-17 | 2023-11-15 | 日東電工株式会社 | 両面配線回路基板の製造方法および両面配線回路基板 |
CN115038253B (zh) * | 2022-06-15 | 2023-07-14 | 江门崇达电路技术有限公司 | 一种线路板上多种类型的pad精准等大的制作方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3739469A (en) * | 1971-12-27 | 1973-06-19 | Ibm | Multilayer printed circuit board and method of manufacture |
FR2296988A1 (fr) * | 1974-12-31 | 1976-07-30 | Ibm France | Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique |
JPS5441102B2 (da) * | 1975-03-04 | 1979-12-06 | ||
DE2716545A1 (de) * | 1977-04-14 | 1978-10-19 | Siemens Ag | Gedruckte schaltungsplatte mit mindestens zwei verdrahtungslagen |
JPS5797970U (da) * | 1980-12-08 | 1982-06-16 | ||
US4963697A (en) * | 1988-02-12 | 1990-10-16 | Texas Instruments Incorporated | Advanced polymers on metal printed wiring board |
US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
-
1991
- 1991-10-31 AT AT0217191A patent/AT398876B/de active
-
1992
- 1992-10-23 ES ES92203266T patent/ES2075599T3/es not_active Expired - Lifetime
- 1992-10-23 DE DE69202749T patent/DE69202749T2/de not_active Expired - Fee Related
- 1992-10-23 EP EP92203266A patent/EP0540101B1/en not_active Expired - Lifetime
- 1992-10-23 AT AT92203266T patent/ATE123372T1/de not_active IP Right Cessation
- 1992-10-23 DK DK92203266.9T patent/DK0540101T3/da active
- 1992-10-27 US US07/966,773 patent/US5403978A/en not_active Expired - Fee Related
- 1992-10-28 MY MYPI92001939A patent/MY110093A/en unknown
- 1992-11-02 JP JP4294453A patent/JPH05218627A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0540101A1 (en) | 1993-05-05 |
EP0540101B1 (en) | 1995-05-31 |
ES2075599T3 (es) | 1995-10-01 |
DE69202749D1 (de) | 1995-07-06 |
US5403978A (en) | 1995-04-04 |
ATE123372T1 (de) | 1995-06-15 |
JPH05218627A (ja) | 1993-08-27 |
DE69202749T2 (de) | 1996-02-08 |
ATA217191A (de) | 1994-06-15 |
MY110093A (en) | 1997-12-31 |
AT398876B (de) | 1995-02-27 |
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