DE969491C - Halbleiteruebertragungseinrichtung - Google Patents

Halbleiteruebertragungseinrichtung

Info

Publication number
DE969491C
DE969491C DEW5665A DEW0005665A DE969491C DE 969491 C DE969491 C DE 969491C DE W5665 A DEW5665 A DE W5665A DE W0005665 A DEW0005665 A DE W0005665A DE 969491 C DE969491 C DE 969491C
Authority
DE
Germany
Prior art keywords
semiconductor
transmission device
semiconductor body
cavity
sheath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEW5665A
Other languages
German (de)
English (en)
Inventor
Joseph Victor Domaleski
Emmet Loyola Gartland
Joseph John Kleimack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of DE969491C publication Critical patent/DE969491C/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thermistors And Varistors (AREA)
DEW5665A 1950-11-30 1951-04-25 Halbleiteruebertragungseinrichtung Expired DE969491C (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US198294A US2688110A (en) 1950-11-30 1950-11-30 Semiconductor translating device

Publications (1)

Publication Number Publication Date
DE969491C true DE969491C (de) 1958-06-12

Family

ID=22732771

Family Applications (1)

Application Number Title Priority Date Filing Date
DEW5665A Expired DE969491C (de) 1950-11-30 1951-04-25 Halbleiteruebertragungseinrichtung

Country Status (7)

Country Link
US (1) US2688110A (enrdf_load_stackoverflow)
BE (1) BE507187A (enrdf_load_stackoverflow)
CH (1) CH297595A (enrdf_load_stackoverflow)
DE (1) DE969491C (enrdf_load_stackoverflow)
FR (1) FR61630E (enrdf_load_stackoverflow)
GB (1) GB728223A (enrdf_load_stackoverflow)
NL (2) NL82047C (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1146205B (de) * 1960-02-23 1963-03-28 Siemens Ag Halbleiteranordnung

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2820983A (en) * 1951-05-17 1958-01-28 Western Electric Co Assembly fixture for point contact device
US2758261A (en) * 1952-06-02 1956-08-07 Rca Corp Protection of semiconductor devices
US2745045A (en) * 1952-07-19 1956-05-08 Sylvania Electric Prod Semiconductor devices and methods of fabrication
NL269213A (enrdf_load_stackoverflow) * 1953-07-28 1900-01-01
DE1043515B (de) * 1953-10-01 1958-11-13 Siemens Ag Verfahren zur Herstellung einer in einem mit Vergussmasse ausgefuellten, vakuumdichtabgeschlossenen Gehaeuse untergebrachten Halbleiteranordnung
US2850687A (en) * 1953-10-13 1958-09-02 Rca Corp Semiconductor devices
US2725506A (en) * 1954-01-25 1955-11-29 Clevite Corp Point contact semiconductor unit
US2829320A (en) * 1955-01-12 1958-04-01 Bell Telephone Labor Inc Encapsulation for electrical components and method of manufacture
DE1020121B (de) * 1955-02-19 1957-11-28 Kieler Howaldtswerke Ag Verfahren zur Herstellung von Halbleitergeraeten kleinster Abmessungen und Vorrichtung zur Ausuebung des Verfahrens
DE1019766B (de) * 1955-03-31 1957-11-21 Licentia Gmbh Isolations- und Korrosionsschutz fuer Gleichrichterplatten
US2846625A (en) * 1955-03-31 1958-08-05 Columbia Broadcasting Syst Inc Semiconductor device
US2888736A (en) * 1955-03-31 1959-06-02 Raytheon Mfg Co Transistor packages
US2888619A (en) * 1955-05-20 1959-05-26 John P Hammes Semiconductor devices
US2981873A (en) * 1957-05-02 1961-04-25 Sarkes Tarzian Semiconductor device
DE1059571B (de) * 1957-08-13 1959-06-18 Siemens Ag Trockengleichrichteranordnung kleiner Bauweise und Verfahren zu ihrer Herstellung
US3189801A (en) * 1960-11-04 1965-06-15 Microwave Ass Point contact semiconductor devices
US3189799A (en) * 1961-06-14 1965-06-15 Microwave Ass Semiconductor devices and method of fabricating them
US3243670A (en) * 1963-09-30 1966-03-29 Int Standard Electric Corp Mountings for semiconductor devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH264445A (de) * 1947-09-04 1949-10-15 Geyer Karol Verfahren zur Herstellung von Kristalldioden und Einrichtung zur Durchführung des Verfahrens, sowie nach diesem Verfahren hergestellte Kristalldiode.
US2486776A (en) * 1948-04-21 1949-11-01 Bell Telephone Labor Inc Self-biased electric translating device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2406405A (en) * 1941-05-19 1946-08-27 Sperry Gyroscope Co Inc Coaxial condenser crystal and method of making same
US2432594A (en) * 1942-08-26 1947-12-16 Union Switch & Signal Co Rectifying detector for high-frequency alternating electric currents
NL64085C (enrdf_load_stackoverflow) * 1943-11-08 1900-01-01
US2468845A (en) * 1944-11-20 1949-05-03 Union Switch & Signal Co Alternating electric current rectifier
US2467811A (en) * 1945-03-21 1949-04-19 Gen Electric Rectifier terminal device
US2475641A (en) * 1946-10-29 1949-07-12 John Archer Carter Prompting system
US2516344A (en) * 1947-07-18 1950-07-25 Daniel W Ross Rectifier
GB674935A (en) * 1947-10-25 1952-07-02 Distillers Co Yeast Ltd Drying apparatus and process
US2606960A (en) * 1949-06-01 1952-08-12 Bell Telephone Labor Inc Semiconductor translating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH264445A (de) * 1947-09-04 1949-10-15 Geyer Karol Verfahren zur Herstellung von Kristalldioden und Einrichtung zur Durchführung des Verfahrens, sowie nach diesem Verfahren hergestellte Kristalldiode.
US2486776A (en) * 1948-04-21 1949-11-01 Bell Telephone Labor Inc Self-biased electric translating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1146205B (de) * 1960-02-23 1963-03-28 Siemens Ag Halbleiteranordnung

Also Published As

Publication number Publication date
BE507187A (enrdf_load_stackoverflow)
CH297595A (de) 1954-03-31
US2688110A (en) 1954-08-31
NL162726B (nl)
FR61630E (fr) 1955-05-16
GB728223A (en) 1955-04-13
NL82047C (enrdf_load_stackoverflow)

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