DE9105233U1 - Flüssigkeitsgekühlter Kühlkopf für Mikroprozessoren - Google Patents
Flüssigkeitsgekühlter Kühlkopf für MikroprozessorenInfo
- Publication number
- DE9105233U1 DE9105233U1 DE9105233U DE9105233U DE9105233U1 DE 9105233 U1 DE9105233 U1 DE 9105233U1 DE 9105233 U DE9105233 U DE 9105233U DE 9105233 U DE9105233 U DE 9105233U DE 9105233 U1 DE9105233 U1 DE 9105233U1
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- liquid
- microprocessors
- processor
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims description 25
- 239000007788 liquid Substances 0.000 claims description 6
- 239000002826 coolant Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9105233U DE9105233U1 (de) | 1991-04-27 | 1991-04-27 | Flüssigkeitsgekühlter Kühlkopf für Mikroprozessoren |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9105233U DE9105233U1 (de) | 1991-04-27 | 1991-04-27 | Flüssigkeitsgekühlter Kühlkopf für Mikroprozessoren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE9105233U1 true DE9105233U1 (de) | 1991-08-01 |
Family
ID=6866794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE9105233U Expired - Lifetime DE9105233U1 (de) | 1991-04-27 | 1991-04-27 | Flüssigkeitsgekühlter Kühlkopf für Mikroprozessoren |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE9105233U1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19645709A1 (de) * | 1996-11-06 | 1998-05-07 | Walter Mueller | CPU-Kühler |
| DE29821758U1 (de) | 1998-12-07 | 1999-05-12 | Hagedorn, Markus, 41468 Neuss | Kühlvorrichtung für Computerfunktionseinheiten |
| DE102004052149B3 (de) * | 2004-10-26 | 2006-02-16 | Kermi Gmbh | Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor |
| EP2123141A2 (fr) * | 2007-03-20 | 2009-11-25 | Conti Temic Microelectronic GmbH | Appareil de commande à utiliser dans un compartiment moteur ou dans la boîte de vitesses d'un véhicule automobile et système de refroidissement d'un tel appareil de commande |
-
1991
- 1991-04-27 DE DE9105233U patent/DE9105233U1/de not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19645709A1 (de) * | 1996-11-06 | 1998-05-07 | Walter Mueller | CPU-Kühler |
| DE29821758U1 (de) | 1998-12-07 | 1999-05-12 | Hagedorn, Markus, 41468 Neuss | Kühlvorrichtung für Computerfunktionseinheiten |
| DE102004052149B3 (de) * | 2004-10-26 | 2006-02-16 | Kermi Gmbh | Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor |
| EP2123141A2 (fr) * | 2007-03-20 | 2009-11-25 | Conti Temic Microelectronic GmbH | Appareil de commande à utiliser dans un compartiment moteur ou dans la boîte de vitesses d'un véhicule automobile et système de refroidissement d'un tel appareil de commande |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69510443T2 (de) | Gehäuse mit wärmeabgebender einrichtung | |
| DE69401137T2 (de) | Kühlungsanordnung für elektrische Leistungsbauteile | |
| JP6389364B2 (ja) | 液冷システムを備える電子ボード | |
| DE102007050417B4 (de) | Leistungsmodul mit einem in sich geschlossenen Kühlungssystem | |
| DE102009040444B4 (de) | Leistungsmodul | |
| DE602004010422T2 (de) | Strömungsverteilungseinheit und kühleinheit | |
| US6031720A (en) | Cooling system for semiconductor die carrier | |
| US6313399B1 (en) | Cooling element for an unevenly distributed heat load | |
| US9204579B2 (en) | Power electronics device and its cooling arrangement | |
| EP0947128B1 (fr) | Support de composants a refroidissement par circulation d'air des composants electriques | |
| DE102008026550B4 (de) | Halbleitereinrichtungen mit Schichten mit erweiterten Umfängen für eine verbesserte Kühlung und Verfahren zum Kühlen von Halbleitereinrichtungen | |
| US6157539A (en) | Cooling apparatus for electronic devices | |
| DE112020003635T5 (de) | Wiedereintritt-Strömungskälteplatte | |
| DE19643717A1 (de) | Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul | |
| DE102005032968A1 (de) | Umrichtermotor | |
| DE10154866A1 (de) | Elektrische Maschine, vorzugsweise Drehstromgenerator für Kraftfahrzeuge | |
| DE69307372T2 (de) | Kühlanlage für elektronische Einheit | |
| DE112016002611T5 (de) | Für eine Fahrzeugbatterie bestimmte thermoelektrische Vorrichtung mit integrierter Kühlplattenbaugruppe | |
| DE9105233U1 (de) | Flüssigkeitsgekühlter Kühlkopf für Mikroprozessoren | |
| WO2016147345A1 (fr) | Module d'alimentation électrique et unité extérieure de climatiseur l'utilisant | |
| WO2002035898A1 (fr) | Boitier refroidi par un liquide | |
| WO2019101589A1 (fr) | Appareil de coupure basse tension avec système de refroidissement défini | |
| DE10334798B4 (de) | Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten | |
| DE102006021829A1 (de) | Wärmestrahler mit einem thermoelektrischen Kühler und mit mehreren Wärmestrahlmodulen sowie deren Anwendungsmethode | |
| DE112017005354T5 (de) | Wärmeableitende Struktur und diese nutzende Bordleistungsversorgungsvorrichtung |