DE9013668U1 - - Google Patents

Info

Publication number
DE9013668U1
DE9013668U1 DE9013668U DE9013668U DE9013668U1 DE 9013668 U1 DE9013668 U1 DE 9013668U1 DE 9013668 U DE9013668 U DE 9013668U DE 9013668 U DE9013668 U DE 9013668U DE 9013668 U1 DE9013668 U1 DE 9013668U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9013668U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamatech Halbleiter-Maschinenbau und Technologie 7137 Sternenfels De GmbH
Original Assignee
Hamatech Halbleiter-Maschinenbau und Technologie 7137 Sternenfels De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamatech Halbleiter-Maschinenbau und Technologie 7137 Sternenfels De GmbH filed Critical Hamatech Halbleiter-Maschinenbau und Technologie 7137 Sternenfels De GmbH
Priority to DE9013668U priority Critical patent/DE9013668U1/de
Publication of DE9013668U1 publication Critical patent/DE9013668U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67023Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
DE9013668U 1990-09-29 1990-09-29 Expired - Lifetime DE9013668U1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9013668U DE9013668U1 (ja) 1990-09-29 1990-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9013668U DE9013668U1 (ja) 1990-09-29 1990-09-29

Publications (1)

Publication Number Publication Date
DE9013668U1 true DE9013668U1 (ja) 1992-01-30

Family

ID=6857951

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9013668U Expired - Lifetime DE9013668U1 (ja) 1990-09-29 1990-09-29

Country Status (1)

Country Link
DE (1) DE9013668U1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19600985A1 (de) * 1996-01-12 1997-07-17 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Behandeln von Substraten
US10388542B2 (en) 2014-05-26 2019-08-20 Mitsubishi Electric Corporation Resist removing apparatus and method for removing resist

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1305180A (en) * 1919-05-27 Spbayibtx system
US3532072A (en) * 1966-10-17 1970-10-06 Inland Steel Co Spray coating apparatus
DE1752212A1 (de) * 1967-04-20 1971-05-13 Devilbiss Co Anlage zum Beschichten von Gegenstaenden
US3814322A (en) * 1973-07-12 1974-06-04 Amchem Prod Mist coating of strip material
DE2411316A1 (de) * 1973-10-09 1975-04-17 Rimrock Corp Spruehvorrichtung
DE2621952A1 (de) * 1975-05-19 1976-12-09 Fluoroware Systems Corp Vorrichtung zum entplattieren, reinigen usw. von substraten
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
GB2021979A (en) * 1978-05-23 1979-12-12 Fsi Corp Applying processing fluid onto silicon wafers
DE3135819A1 (de) * 1981-09-10 1983-03-17 Chemotec Engineering GmbH, 5220 Waldbröl Verfahren und vorrichtung zur oberflaechennassbehandlung von gegenstaenden
DE3317889A1 (de) * 1982-06-01 1983-12-01 Smiths Industries Public Ltd. Co., London Spruehduese
DE3523532A1 (de) * 1984-07-02 1986-01-09 FSI Corp., Chaska, Minn. Vorrichtung und verfahren zum bearbeiten von substratflaechen in einem chemischen bearbeitungssystem zur herstellung elektronischer vorrichtungen
DE3527516A1 (de) * 1984-08-01 1986-02-13 FSI Corp., Chaska, Minn. Vorrichtung zum bespruehen von substratflaechen oder plaettchen, insbesondere fuer elektronische schaltungen oder bauteile
DE3527515A1 (de) * 1984-08-01 1986-02-13 FSI Corp., Chaska, Minn. Vorrichtung zum bespruehen von silikonplaettchen und kammer hierfuer
DE3523509A1 (de) * 1984-07-02 1986-02-27 FSI Corp., Chaska, Minn. Verfahreen zum vermischen hochaktiver chemikalien und vorrichtung zum auftragen von bearbeitungschemikalien auf substratflaechen
GB2171932A (en) * 1985-03-09 1986-09-10 Spraymatic Co Rotary spraying table machine
US4611695A (en) * 1983-07-06 1986-09-16 Toyota Jidosha Kabushiki Kaisha Automatic painting system
US4674521A (en) * 1985-05-20 1987-06-23 Machine Technology, Inc. Rinsing apparatus and method
US4717078A (en) * 1984-08-20 1988-01-05 Arp George F Eyeball fitting for increasing flow of return water to swimming pool
DE3629696A1 (de) * 1986-09-01 1988-03-10 Thurner Bayer Druckguss Spruehvorrichtung
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
US4827867A (en) * 1985-11-28 1989-05-09 Daikin Industries, Ltd. Resist developing apparatus
US4838979A (en) * 1986-09-19 1989-06-13 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing substrate surface
EP0328907A1 (de) * 1988-02-17 1989-08-23 HANS HÖLLMÜLLER MASCHINENBAU GMBH & CO. Maschine zum Ätzen von Gegenständen
DE3928923A1 (de) * 1988-08-31 1990-03-01 Toshiba Kawasaki Kk Verfahren und apparatur zur erzeugung von photolackmustern durch chemisches entwickeln

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1305180A (en) * 1919-05-27 Spbayibtx system
US3532072A (en) * 1966-10-17 1970-10-06 Inland Steel Co Spray coating apparatus
DE1752212A1 (de) * 1967-04-20 1971-05-13 Devilbiss Co Anlage zum Beschichten von Gegenstaenden
US3814322A (en) * 1973-07-12 1974-06-04 Amchem Prod Mist coating of strip material
DE2411316A1 (de) * 1973-10-09 1975-04-17 Rimrock Corp Spruehvorrichtung
DE2621952A1 (de) * 1975-05-19 1976-12-09 Fluoroware Systems Corp Vorrichtung zum entplattieren, reinigen usw. von substraten
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
GB2021979A (en) * 1978-05-23 1979-12-12 Fsi Corp Applying processing fluid onto silicon wafers
DE3135819A1 (de) * 1981-09-10 1983-03-17 Chemotec Engineering GmbH, 5220 Waldbröl Verfahren und vorrichtung zur oberflaechennassbehandlung von gegenstaenden
DE3317889A1 (de) * 1982-06-01 1983-12-01 Smiths Industries Public Ltd. Co., London Spruehduese
US4611695A (en) * 1983-07-06 1986-09-16 Toyota Jidosha Kabushiki Kaisha Automatic painting system
DE3523532A1 (de) * 1984-07-02 1986-01-09 FSI Corp., Chaska, Minn. Vorrichtung und verfahren zum bearbeiten von substratflaechen in einem chemischen bearbeitungssystem zur herstellung elektronischer vorrichtungen
US4609575A (en) * 1984-07-02 1986-09-02 Fsi Corporation Method of apparatus for applying chemicals to substrates in an acid processing system
DE3523509A1 (de) * 1984-07-02 1986-02-27 FSI Corp., Chaska, Minn. Verfahreen zum vermischen hochaktiver chemikalien und vorrichtung zum auftragen von bearbeitungschemikalien auf substratflaechen
DE3527515A1 (de) * 1984-08-01 1986-02-13 FSI Corp., Chaska, Minn. Vorrichtung zum bespruehen von silikonplaettchen und kammer hierfuer
DE3527516A1 (de) * 1984-08-01 1986-02-13 FSI Corp., Chaska, Minn. Vorrichtung zum bespruehen von substratflaechen oder plaettchen, insbesondere fuer elektronische schaltungen oder bauteile
US4691722A (en) * 1984-08-01 1987-09-08 Fsi Corporation Bowl for liquid spray processing machine
US4717078A (en) * 1984-08-20 1988-01-05 Arp George F Eyeball fitting for increasing flow of return water to swimming pool
GB2171932A (en) * 1985-03-09 1986-09-10 Spraymatic Co Rotary spraying table machine
US4674521A (en) * 1985-05-20 1987-06-23 Machine Technology, Inc. Rinsing apparatus and method
US4827867A (en) * 1985-11-28 1989-05-09 Daikin Industries, Ltd. Resist developing apparatus
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
DE3629696A1 (de) * 1986-09-01 1988-03-10 Thurner Bayer Druckguss Spruehvorrichtung
US4838979A (en) * 1986-09-19 1989-06-13 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing substrate surface
EP0328907A1 (de) * 1988-02-17 1989-08-23 HANS HÖLLMÜLLER MASCHINENBAU GMBH & CO. Maschine zum Ätzen von Gegenständen
DE3928923A1 (de) * 1988-08-31 1990-03-01 Toshiba Kawasaki Kk Verfahren und apparatur zur erzeugung von photolackmustern durch chemisches entwickeln

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
1-186618 A. E-836, Oct.26, 1989, Vol.13/No.474 *
1-216533 A. E-851, Nov.28, 1989, Vol.13/No.531 *
1-227437 A. E-856, Dec. 7, 1989, Vol.13/No.548 *
1-228129 A. E-857, Dec. 8, 1989, Vol.13/No.551 *
1-256127 A. E-871, Jan.11, 1990, Vol.14/No. 12 *
1-282819 A. E-883, Feb. 5, 1990, Vol.14/No. 62 *
63-187630 A. E-690, Dec. 7, 1988, Vol.12/No.465 *
Patents Abstracts of Japan: 62-263634 A. E-605, May 6, 1988, Vol.12/No.146 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19600985A1 (de) * 1996-01-12 1997-07-17 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Behandeln von Substraten
US10388542B2 (en) 2014-05-26 2019-08-20 Mitsubishi Electric Corporation Resist removing apparatus and method for removing resist

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