DE8912397U1 - - Google Patents

Info

Publication number
DE8912397U1
DE8912397U1 DE8912397U DE8912397U DE8912397U1 DE 8912397 U1 DE8912397 U1 DE 8912397U1 DE 8912397 U DE8912397 U DE 8912397U DE 8912397 U DE8912397 U DE 8912397U DE 8912397 U1 DE8912397 U1 DE 8912397U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8912397U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Publication of DE8912397U1 publication Critical patent/DE8912397U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
DE8912397U 1988-10-28 1989-10-19 Expired - Lifetime DE8912397U1 (US06303180-20011016-M00001.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63273873A JPH0787275B2 (ja) 1988-10-28 1988-10-28 導電性シール材

Publications (1)

Publication Number Publication Date
DE8912397U1 true DE8912397U1 (US06303180-20011016-M00001.png) 1989-12-07

Family

ID=17533755

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8912397U Expired - Lifetime DE8912397U1 (US06303180-20011016-M00001.png) 1988-10-28 1989-10-19
DE3934845A Expired - Lifetime DE3934845C2 (de) 1988-10-28 1989-10-19 Leitfähige Dichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3934845A Expired - Lifetime DE3934845C2 (de) 1988-10-28 1989-10-19 Leitfähige Dichtung

Country Status (4)

Country Link
US (1) US5008485A (US06303180-20011016-M00001.png)
JP (1) JPH0787275B2 (US06303180-20011016-M00001.png)
DE (2) DE8912397U1 (US06303180-20011016-M00001.png)
GB (1) GB2224604B (US06303180-20011016-M00001.png)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0472489A2 (en) * 1990-08-02 1992-02-26 Scanvaegt A/S An apparatus or indicator cabinet of watertight design
EP0643552A1 (en) * 1993-09-10 1995-03-15 Parker-Hannifin Corporation Form-in-place EMI gaskets
US5641438A (en) * 1995-01-24 1997-06-24 Bunyan; Michael H. Method for forming an EMI shielding gasket
US5731541A (en) * 1993-11-22 1998-03-24 Emi-Tec Elektronische Materialien Gmbh Screening element and process for producing it
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
US6303180B1 (en) 1993-09-10 2001-10-16 Parker-Hannifin Corporation Form-in-place EMI gaskets
US6635354B2 (en) 1995-01-20 2003-10-21 Parker-Hannifin Corporation Form-in place EMI gaskets
DE102011012433A1 (de) * 2011-02-25 2012-08-30 C E S Control Enclosure Systems Gmbh Dichtelement und Dichtungssystem für Hohlprofile
CN103477519A (zh) * 2011-02-25 2013-12-25 Ces控制机柜系统有限公司 用于空心型材的密封元件和密封系统

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JPH0817278B2 (ja) * 1988-10-26 1996-02-21 北川工業株式会社 電磁波シールド用ガスケット
JPH02124990A (ja) * 1988-11-02 1990-05-14 Kitagawa Kogyo Kk 炭素繊維配合シール材組成物
US4968854A (en) * 1988-11-10 1990-11-06 Vanguard Products Corporation Dual elastomer gasket shield for electronic equipment
DE9014003U1 (US06303180-20011016-M00001.png) * 1990-10-08 1990-12-13 Alfred Kunz Gmbh & Co, 8000 Muenchen, De
DE4345594B4 (de) * 1993-06-14 2011-08-11 EMI-tec Elektronische Materialien GmbH, 12277 Verfahren zur Herstellung eines eine Abschirmung gegen elektromagnetische Abstrahlung aufweisenden Gehäuses
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
DE4343702C1 (de) * 1993-12-21 1995-03-09 Siemens Audiologische Technik Am Kopf tragbares Hörgerät
DE4405408C1 (de) * 1994-02-21 1995-05-04 Rolec Gehaeusesysteme Rose & R Metallgehäuse für den Einbau elektronischer Bauteile
DE19506801C2 (de) * 1995-02-27 1998-04-16 Siemens Nixdorf Inf Syst Anordnung zur EMV-gerechten Herausführung eines auf einer Leiterplatte angeordneten elektrischen Anschlusses aus einem abschirmenden Gehäuse
US5656795A (en) * 1995-04-03 1997-08-12 Schlegel Corporation Segmented shielding structure for connector panels
US5646369A (en) * 1995-04-03 1997-07-08 Schlegel Corporation Segmented shielding structure for connector panels
DE19529624C2 (de) * 1995-08-11 1999-07-01 Knuerr Mechanik Ag Verfahren und Vorrichtung zum Herstellen einer Abschirmdichtung
AU709051B2 (en) * 1996-01-19 1999-08-19 Helmut Kahl Electrically screening housing
US5804762A (en) * 1996-03-22 1998-09-08 Parker-Hannifin Corporation EMI shielding gasket having shear surface attachments
TW486238U (en) * 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
JP2001510635A (ja) * 1996-08-18 2001-07-31 カール ヘルムート 伝導性シール材料及び成形シール部材
US5761031A (en) * 1996-11-15 1998-06-02 International Business Machines Corporation Conductive shock mount for reducing electromagnetic interference in a disk drive system
ATE319284T1 (de) 1997-03-05 2006-03-15 Bernd Tiburtius Verfahren zur herstellung eines abschirmgehäuses
SE511964C2 (sv) * 1997-05-29 1999-12-20 Ericsson Telefon Ab L M Skärmningshölje jämte förfaranden för att framställa ett skärmningshölje
DE19733627C1 (de) * 1997-07-29 1998-06-18 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung und Verfahren zu deren Herstellung
DE19737685C2 (de) * 1997-08-29 1999-08-12 Sonderhoff Ernst Fa Abschirmdichtung
US6075205A (en) * 1997-10-27 2000-06-13 Parker-Hannifin Corporation Tubular extrusion gasket profile exhibiting a controlled deflection response for improved environmental sealing and EMI shielding
DE19821928C1 (de) * 1998-05-15 2000-01-13 Harting Kgaa Abgeschirmter Steckverbinder
US6613976B1 (en) 1998-12-15 2003-09-02 Vanguard Products Corporation Electromagnetic interference shielding gasket
JP4176310B2 (ja) 1998-12-15 2008-11-05 ヴァンガード プロダクツ コーポレイション 電磁干渉遮蔽装置
US6303854B1 (en) 1999-07-22 2001-10-16 Marconi Communications, Inc. EMI shielded telecommunications enclosure
WO2001054466A1 (de) * 2000-01-22 2001-07-26 Helmut Kahl Verfahren zur herstellung einer elektromagnetischen abschirmung
DE10039068B4 (de) * 2000-08-10 2006-01-05 Hugo Kern Und Liebers Gmbh & Co. Kg Platinen- Und Federnfabrik Dichtung, Verfahren und Vorrichtung zur Herstellung einer Dichtung
KR20000054452A (ko) * 2000-06-07 2000-09-05 대한민국 관리부서 정보통신부 전파연구소 전자기기의 실딩방법
US6348654B1 (en) 2000-10-12 2002-02-19 Parker-Hannifin Corporation Compound waveform gasket for low closure force EMI shielding applications
AU2001297005A1 (en) * 2000-10-12 2002-04-22 Delphi Technologies, Inc. Seals with improved corrosion resistance and a method for manufacturing same
US7012189B2 (en) * 2001-03-28 2006-03-14 Apple Computer, Inc. Computer enclosure
EP1386527A1 (en) 2001-05-10 2004-02-04 Parker Hannifin Corporation Manufacture of electronics enclosure having a metallized shielding layer
DE60206489T2 (de) 2001-05-11 2006-07-13 Parker-Hannifin Corp., Cleveland Gezahnte Dichtung für EMI-Abschirmungsanwendungen mit niedrigen Verpressungskräften
US6809254B2 (en) 2001-07-20 2004-10-26 Parker-Hannifin Corporation Electronics enclosure having an interior EMI shielding and cosmetic coating
US20030091777A1 (en) * 2001-08-14 2003-05-15 Peter Jones Clean release tape for EMI shielding
WO2003030610A1 (en) 2001-10-02 2003-04-10 Parker Hannifin Corporation Emi shielding gasket construction
JP2003186465A (ja) 2001-12-19 2003-07-04 Yamaha Corp 弦楽器の弦張設機構
US20040071970A1 (en) * 2002-03-11 2004-04-15 Helmut Kahl Device housing having a shielding gasket or wall comprising a conductive coating
CN100407886C (zh) * 2002-03-11 2008-07-30 赫尔穆特·卡尔 带有一个电磁屏蔽区的设备罩
US7208192B2 (en) * 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
EP1565681B1 (en) * 2002-11-26 2007-01-31 Parker-Hannifin Corporation Tubular polymeric composites for tubing and hose constructions
JP2005187793A (ja) * 2003-12-24 2005-07-14 Rohm & Haas Electronic Materials Llc 改良された接着剤
JP4016959B2 (ja) 2004-03-19 2007-12-05 ヤマハ株式会社 弦楽器の弦張設装置
CN101248714B (zh) * 2005-05-19 2010-06-09 派克汉尼芬公司 用于电磁干扰屏蔽的条带垫圈
US20060280889A1 (en) * 2005-06-10 2006-12-14 Powell Steven M Tubular nylon alloy members for tubing and hose constructions
KR20100061672A (ko) 2007-10-02 2010-06-08 파커-한니핀 코포레이션 Ｅｍｉ 가스켓용 나노 코팅
US20090116208A1 (en) * 2007-11-02 2009-05-07 Nokia Corporation Electronic device electrical shielding
US8687359B2 (en) * 2008-10-13 2014-04-01 Apple Inc. Portable computer unified top case
JP2014510882A (ja) 2011-02-25 2014-05-01 シー イー エス コントロール エンクロージャー システムズ ゲーエムベーハー 中空プロフィールのためのコーナーコネクター
CN103476999B (zh) 2011-02-25 2015-06-24 Ces控制机柜系统有限公司 从扁平片状金属生产矩形或正方形壁元件的方法及由此生产的壁元件
JP2012182227A (ja) * 2011-02-28 2012-09-20 Panasonic Corp パッキン部材
US9617783B2 (en) 2011-09-20 2017-04-11 Mitsubishi Aircraft Corporation Gasket seal, door of aircraft, seal structure for opening portion of aircraft, and aircraft
KR101296379B1 (ko) * 2011-12-26 2013-08-14 (주)에이엔티 방수 및 전자파 차폐기능을 구비하는 함
CN104053329B (zh) * 2013-03-14 2017-01-11 宏达国际电子股份有限公司 电子模块
US9531853B2 (en) * 2013-03-14 2016-12-27 Htc Corporation Electronic module and electronic device
US11291199B2 (en) * 2014-11-19 2022-04-05 Engineered Materials, Inc. Insect barrier
CN106114824B (zh) * 2016-07-01 2018-04-10 中航飞机股份有限公司西安飞机分公司 一种起落架舱门的电磁防护结构
DE102017123653B4 (de) 2017-10-11 2022-04-28 Schaeffler Technologies AG & Co. KG Temperierbares Dichtungselement und Dichtungsanordnung mit diesem
DE102017123654B4 (de) 2017-10-11 2022-01-27 Schaeffler Technologies AG & Co. KG Temperierbare Dichtungsanordnung und Temperierelement für diese

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DE6607180U (de) * 1962-09-28 1971-01-28 Siemens Ag Elektrisches geraet mit abschirmung
US3296356A (en) * 1965-03-02 1967-01-03 James H Mcadams Radio frequency electromagnetic energy r. f. barrier
US3583930A (en) * 1968-04-16 1971-06-08 Chomerics Inc Plastics made conductive with coarse metal fillers
US4447492A (en) * 1977-11-21 1984-05-08 Occidental Chemical Corporation Articles having an electrically conductive surface
US4399317A (en) * 1981-09-18 1983-08-16 Keene Corporation Sealing apparatus for radio frequency shielding enclosure
JPS58180615A (ja) * 1982-04-10 1983-10-22 Morinobu Endo 気相法による炭素繊維の製造方法
JPS58179708U (ja) * 1982-05-26 1983-12-01 興國ゴム工業株式会社 導電被覆構造を有するゴム状弾性体
DE3372252D1 (en) * 1982-10-29 1987-07-30 Plessey Overseas Conductive gaskets
JPS59179816A (ja) * 1983-03-28 1984-10-12 Showa Denko Kk 層間化合物を形成している黒鉛繊維
JPS60249392A (ja) * 1984-05-24 1985-12-10 ティーディーケイ株式会社 電磁シ−ルド材料
SE442938B (sv) * 1984-06-18 1986-02-03 Ellemtel Utvecklings Ab Tetningsanordning vid ett metallskap, som anvends som skerm mot elektromagnetiska felt
JPS6127399U (ja) * 1984-07-25 1986-02-18 積水化学工業株式会社 電磁シ−ルド用ガスケツト
GB2174551B (en) * 1985-03-28 1988-06-08 Rainford Metals Limited Screened rack
CH668347A5 (de) * 1985-06-28 1988-12-15 Jakob Senn Dichtung an gehaeuseartigen einrichtungen mit elektrischen geraeten.
US4749625A (en) * 1986-03-31 1988-06-07 Hiraoka & Co., Ltd. Amorphous metal laminate sheet
GB2194579B (en) * 1986-08-30 1989-12-20 Marconi Co Ltd Electromagnetic sealing arrangement for a door assembly
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JPH0282698A (ja) * 1988-09-20 1990-03-23 Kitagawa Kogyo Kk 電磁波シールド用部材
JPH0627700A (ja) * 1992-07-09 1994-02-04 Mita Ind Co Ltd 電子写真感光体
JPH0638472A (ja) * 1992-07-10 1994-02-10 Olympus Optical Co Ltd 可変リラクタンスモータ
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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0472489A3 (en) * 1990-08-02 1992-04-15 Scanvaegt A/S An apparatus or indicator cabinet of watertight design
EP0472489A2 (en) * 1990-08-02 1992-02-26 Scanvaegt A/S An apparatus or indicator cabinet of watertight design
US6331349B1 (en) 1993-09-10 2001-12-18 Parker-Hannifin Corporation Form-in-place EMI gaskets
EP0643552A1 (en) * 1993-09-10 1995-03-15 Parker-Hannifin Corporation Form-in-place EMI gaskets
EP0643551A1 (en) * 1993-09-10 1995-03-15 Parker-Hannifin Corporation Form-in-place EMI gaskets
US6096413A (en) * 1993-09-10 2000-08-01 Chomerics, Inc. Form-in-place EMI gaskets
US6303180B1 (en) 1993-09-10 2001-10-16 Parker-Hannifin Corporation Form-in-place EMI gaskets
US5731541A (en) * 1993-11-22 1998-03-24 Emi-Tec Elektronische Materialien Gmbh Screening element and process for producing it
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
US6635354B2 (en) 1995-01-20 2003-10-21 Parker-Hannifin Corporation Form-in place EMI gaskets
US5641438A (en) * 1995-01-24 1997-06-24 Bunyan; Michael H. Method for forming an EMI shielding gasket
US6056527A (en) * 1995-01-24 2000-05-02 Bunyan; Michael H. Apparatus for forming a gasket
DE102011012433A1 (de) * 2011-02-25 2012-08-30 C E S Control Enclosure Systems Gmbh Dichtelement und Dichtungssystem für Hohlprofile
CN103477519A (zh) * 2011-02-25 2013-12-25 Ces控制机柜系统有限公司 用于空心型材的密封元件和密封系统
EP2678909B1 (de) * 2011-02-25 2015-04-01 C E S Control Enclosure Systems GmbH Dichtelement und dichtungssystem für hohlprofile
CN103477519B (zh) * 2011-02-25 2016-01-20 Ces控制机柜系统有限公司 用于空心型材的密封元件和密封系统

Also Published As

Publication number Publication date
US5008485A (en) 1991-04-16
GB2224604B (en) 1993-04-21
JPH02119300A (ja) 1990-05-07
DE3934845A1 (de) 1990-05-03
GB8923829D0 (en) 1989-12-13
DE3934845C2 (de) 2002-01-24
JPH0787275B2 (ja) 1995-09-20
GB2224604A (en) 1990-05-09

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