DE763951C - Process for the vacuum-tight closure of a ceramic or metallic vessel provided with a pump nozzle - Google Patents

Process for the vacuum-tight closure of a ceramic or metallic vessel provided with a pump nozzle

Info

Publication number
DE763951C
DE763951C DEN44309D DEN0044309D DE763951C DE 763951 C DE763951 C DE 763951C DE N44309 D DEN44309 D DE N44309D DE N0044309 D DEN0044309 D DE N0044309D DE 763951 C DE763951 C DE 763951C
Authority
DE
Germany
Prior art keywords
pump nozzle
solder
ceramic
vacuum
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEN44309D
Other languages
German (de)
Inventor
Otto Trost
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NSF NUERNBERGER SCHRAUBENFABRI
ELEKTROWERK GmbH
Original Assignee
NSF NUERNBERGER SCHRAUBENFABRI
ELEKTROWERK GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NSF NUERNBERGER SCHRAUBENFABRI, ELEKTROWERK GmbH filed Critical NSF NUERNBERGER SCHRAUBENFABRI
Priority to DEN44309D priority Critical patent/DE763951C/en
Application granted granted Critical
Publication of DE763951C publication Critical patent/DE763951C/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/40—Closing vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

In der Technik tritt oft die Forderung auf, elektrotechnische Bauteile verschiedenster Art, z. B. schwingende Stromrichter. Relais, Kondensatoren od. dg'l.. vakuumdicht abzuschließen.In technology there is often a requirement to use electrical components of various kinds, e.g. B. oscillating converters. Relays, capacitors, etc. to close vacuum-tight.

Es ist nun gefunden worden, daß man bei einem Verfahren zum vakuumdichten Abschließen eines mit einem Pumpstutzen versehenen keramischen oder metallischen Gefäßes a dieses Ziel am besten erfindungsgemäß erreicht. indem in einer Erweiterung der Bohrung des aus Metall bestehenden Pumpstutzens h eine kleine 'Menge Lötmetall in Form einer Perle d eingebracht wird, und dar darauf das Gefäß leergepumpt und der in senkrechter Lage befindliche Pumpstutzen durch eine Stichflamme so weit erhitzt wird, daß das Lötmetall zerfließt und den Pumpkanal abschließt.It has now been found that one can use a method for vacuum sealing Completion of a ceramic or metallic one provided with a pump nozzle Vessel a this goal is best achieved according to the invention. by putting in an extension the bore of the metal pump nozzle h a small 'amount of solder in the form of a pearl d is introduced, and then the vessel is pumped empty and the pump nozzle, which is in a vertical position, is heated so far by a jet flame is that the solder melts and closes the pump channel.

Von Vorteil ist es, an den verschiedenen Lötstellen c des Verschlusses, -,vie an sich bekannt, Lötlegierungen mit verschieden hohem Schmelzpunkt zu verwenden, damit beispielsweise beim Verlöten des Bechers mit dem Verschluß. des metallischen Verschlußteils mit einem keramischen Deckel und vor allem beim Abdichten durch Schmelzen der Lötperle keine Beeinträchtigung der übrigen Lötstellen erfolgt.It is advantageous to use the different soldering points c of the fastener, -, well known per se, to use soldering alloys with different melting points, thus, for example, when soldering the cup to the closure. of the metallic Closure part with a ceramic lid and especially when sealing by melting the solder bump does not affect the remaining soldering points.

Solche Verschlüsse lassen sich auch vorteilbafterweise bei den Behältern verwenden. die mit einer Gasatmosphäre gefüllt werden sollen. Es können zu diesem Zwecke natürlich ein oder mehrere solche' metallischen Verschlußteile mit Lötperlen vorhanden sein.Such closures can also advantageously be used on the containers use. which are to be filled with a gas atmosphere. It can lead to this Purposes, of course, one or more such 'metallic closure parts with solder balls to be available.

Claims (2)

PATEVTAVSPPLCHE: i. Verfahren zum vakuumdichten Abschließen eines mit einem Pumpstutzen versehenen keramischen oder metallischen Gefäßes, dadurch gekennzeichnet, daß in einer Erweiterung der Bohrung des aus Metall bestehenden Pumpstutzens eine kleine ''enge Lötmetall in Form einer Perle eingebracht und daß darauf das Gefäß leergepumpt und der in senkrechter Lage befindliche Pumpstutzen durch eine Stichflamme so weit erhitzt wird, daß das Lötmetall zerfließt und den Pumpkanal abschließt. PATEVTAVSPPLCHE: i. Method for the vacuum-tight closure of a ceramic or metallic vessel provided with a pump nozzle, thereby characterized in that in an extension of the bore of the existing metal Pump socket introduced a small '' tight solder in the form of a bead and that then the vessel is pumped empty and the pump nozzle located in a vertical position is heated by a jet flame so far that the solder dissolves and the Pump channel closes. 2. Verfahren nach Anspruch i, dadurch gekennzeichnet. daß die Lötperle einen tiefer liegenden Schmelzpunkt hat als die Lötlegierung, die zur Verbindung des Pilmpstutzens mit dem Gefäß dient. ZurAbgrenzung des Erfindungsgegenstands vom Stand der Technik sind im Erteilungsverfahren folgende Druckschriften in Betracht gezogen worden: Deutsche Patentschrift Nr. 113 590; schweizerische Patentschrift \?r. 196 799.2. The method according to claim i, characterized. that the solder bump has a lower melting point than the solder alloy that is used to connect the Pilmpstutzens with the vessel. To delimit the subject matter of the invention from the state of the art, the following publications were considered in the grant procedure: German Patent No. 1 1 3 590; Swiss patent specification \? r. 196 799.
DEN44309D 1940-11-12 1940-11-12 Process for the vacuum-tight closure of a ceramic or metallic vessel provided with a pump nozzle Expired DE763951C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEN44309D DE763951C (en) 1940-11-12 1940-11-12 Process for the vacuum-tight closure of a ceramic or metallic vessel provided with a pump nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEN44309D DE763951C (en) 1940-11-12 1940-11-12 Process for the vacuum-tight closure of a ceramic or metallic vessel provided with a pump nozzle

Publications (1)

Publication Number Publication Date
DE763951C true DE763951C (en) 1954-05-03

Family

ID=7348857

Family Applications (1)

Application Number Title Priority Date Filing Date
DEN44309D Expired DE763951C (en) 1940-11-12 1940-11-12 Process for the vacuum-tight closure of a ceramic or metallic vessel provided with a pump nozzle

Country Status (1)

Country Link
DE (1) DE763951C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4406046A (en) * 1979-09-08 1983-09-27 Mtu Motoren- Und Turbinen-Union Munchen, Gmbh Process for the production of a sodium-filled valve
EP0470278A1 (en) * 1990-08-07 1992-02-12 Siemens Aktiengesellschaft Hermetically sealed gas laser

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE113590C (en) *
CH196799A (en) * 1936-07-27 1938-03-31 Aeg Process for making vacuum-tight connections in discharge tubes.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE113590C (en) *
CH196799A (en) * 1936-07-27 1938-03-31 Aeg Process for making vacuum-tight connections in discharge tubes.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4406046A (en) * 1979-09-08 1983-09-27 Mtu Motoren- Und Turbinen-Union Munchen, Gmbh Process for the production of a sodium-filled valve
EP0470278A1 (en) * 1990-08-07 1992-02-12 Siemens Aktiengesellschaft Hermetically sealed gas laser

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