DE69937213D1 - Leitende Paste und Verfahren zum Herstellen eines keramischen Substrates welches diese Paste verwendet - Google Patents

Leitende Paste und Verfahren zum Herstellen eines keramischen Substrates welches diese Paste verwendet

Info

Publication number
DE69937213D1
DE69937213D1 DE69937213T DE69937213T DE69937213D1 DE 69937213 D1 DE69937213 D1 DE 69937213D1 DE 69937213 T DE69937213 T DE 69937213T DE 69937213 T DE69937213 T DE 69937213T DE 69937213 D1 DE69937213 D1 DE 69937213D1
Authority
DE
Germany
Prior art keywords
paste
making
ceramic substrate
conductive paste
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69937213T
Other languages
English (en)
Other versions
DE69937213T2 (de
Inventor
Kazuhito Ohshita
Yoshiki Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE69937213D1 publication Critical patent/DE69937213D1/de
Application granted granted Critical
Publication of DE69937213T2 publication Critical patent/DE69937213T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE69937213T 1998-03-25 1999-03-19 Leitende Paste und Verfahren zum Herstellen eines keramischen Substrates welches diese Paste verwendet Expired - Lifetime DE69937213T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP07735398A JP3539195B2 (ja) 1998-03-25 1998-03-25 導電ペーストおよびそれを用いたセラミック基板の製造方法
JP7735398 1998-03-25

Publications (2)

Publication Number Publication Date
DE69937213D1 true DE69937213D1 (de) 2007-11-15
DE69937213T2 DE69937213T2 (de) 2008-01-17

Family

ID=13631558

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937213T Expired - Lifetime DE69937213T2 (de) 1998-03-25 1999-03-19 Leitende Paste und Verfahren zum Herstellen eines keramischen Substrates welches diese Paste verwendet

Country Status (4)

Country Link
US (2) US6120708A (de)
EP (1) EP0954026B1 (de)
JP (1) JP3539195B2 (de)
DE (1) DE69937213T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475555B2 (en) * 1999-10-29 2002-11-05 International Business Machines Corporation Process for screening features on an electronic substrate with a low viscosity paste
JP3757771B2 (ja) * 2000-09-07 2006-03-22 株式会社村田製作所 導電性ペーストおよびそれを用いる積層セラミック電子部品の製造方法
US6855222B2 (en) * 2002-06-19 2005-02-15 Murata Manufacturing Co., Ltd. Method for manufacturing laminated multilayer electronic components
US7467928B2 (en) * 2002-12-12 2008-12-23 Board Of Trustees Of The University Of Arkansas Microfluidic device utilizing magnetohydrodynamics and method for fabrication thereof
US6989110B2 (en) 2003-06-13 2006-01-24 Murata Manufacturing Co., Ltd. Electroconductive paste and method of producing the same
US7083859B2 (en) * 2003-07-08 2006-08-01 Hitachi Chemical Co., Ltd. Conductive powder and method for preparing the same
TWI264969B (en) 2003-11-28 2006-10-21 Murata Manufacturing Co Multilayer ceramic electronic component and its manufacturing method
JP4778444B2 (ja) * 2004-11-25 2011-09-21 日本電気株式会社 半導体装置及びその製造方法、配線基板及びその製造方法、半導体パッケージ並びに電子機器
US7442879B2 (en) * 2005-07-11 2008-10-28 Endicott Interconect Technologies, Inc. Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate
US7334323B2 (en) * 2005-07-11 2008-02-26 Endicott Interconnect Technologies, Inc. Method of making mutilayered circuitized substrate assembly having sintered paste connections
US7342183B2 (en) * 2005-07-11 2008-03-11 Endicott Interconnect Technologies, Inc. Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same
US8063315B2 (en) 2005-10-06 2011-11-22 Endicott Interconnect Technologies, Inc. Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
US7629559B2 (en) * 2005-12-19 2009-12-08 Endicott Interconnect Technologies, Inc. Method of improving electrical connections in circuitized substrates
US20070278002A1 (en) * 2006-05-31 2007-12-06 Romi Mayder Method and apparatus for a low thermal impedance printed circuit board assembly
JP4914769B2 (ja) * 2007-05-31 2012-04-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 固体電解コンデンサ電極用導体ペーストおよび該導体ペーストを使用した固体電解コンデンサの電極の製造方法
US8555491B2 (en) * 2007-07-19 2013-10-15 Alpha Metals, Inc. Methods of attaching a die to a substrate
JP2010126560A (ja) * 2008-11-25 2010-06-10 Samsung Sdi Co Ltd ペースト組成物、プラズマディスプレイパネル用パネル基板の製造方法およびプラズマディスプレイパネル
JP4860762B2 (ja) * 2009-04-17 2012-01-25 日本特殊陶業株式会社 ガスセンサ
DE102010045713B4 (de) * 2010-09-16 2016-06-23 MTU Aero Engines AG Verfahren und Vorrichtung zum Herstellen oder Reparieren von Bauteilen, insbesondere Turbomaschinenkomponenten
TWI410198B (zh) * 2011-03-24 2013-09-21 Hon Hai Prec Ind Co Ltd 印刷電路板
KR20170020433A (ko) * 2014-06-20 2017-02-22 보르그워너 인코퍼레이티드 조정가능 베인을 갖는 터보차저
US10185191B2 (en) 2016-08-02 2019-01-22 Omnivision Technologies, Inc. Panel carrier and method for attaching a liquid-crystal-on-silicon panel thereto
JP7398382B2 (ja) * 2018-10-19 2023-12-14 藤倉化成株式会社 導電性ペースト

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521204A (en) * 1978-08-01 1980-02-15 Sumitomo Bakelite Co Thermal hardening resin laminated structure and its preparation
US4986849A (en) * 1988-09-23 1991-01-22 Johnson Matthey Inc. Silver-glass pastes
JP2781420B2 (ja) * 1989-08-07 1998-07-30 株式会社日立製作所 導体ペーストの製造方法
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト
JP3015621B2 (ja) * 1993-05-10 2000-03-06 松下電器産業株式会社 導体ペ−スト組成物
JP3419244B2 (ja) * 1996-05-24 2003-06-23 株式会社村田製作所 導電ペースト及びセラミック基板の製造方法

Also Published As

Publication number Publication date
EP0954026A3 (de) 1999-11-17
US6120708A (en) 2000-09-19
US6080335A (en) 2000-06-27
EP0954026A2 (de) 1999-11-03
JP3539195B2 (ja) 2004-07-07
EP0954026B1 (de) 2007-10-03
JPH11274717A (ja) 1999-10-08
DE69937213T2 (de) 2008-01-17

Similar Documents

Publication Publication Date Title
DE69937213D1 (de) Leitende Paste und Verfahren zum Herstellen eines keramischen Substrates welches diese Paste verwendet
ATE275187T1 (de) Zusammensetzung und verfahren zum substratbleichen
DE59813331D1 (de) Verfahren und einrichtung zum vakuumbeschichten eines substrates
DE69421699T2 (de) Kohlenstoffzusammensetzungen und verfahren zur vorbereitung nichtleitender substrate zum elektrochemischen beschichten
DE59605597D1 (de) Verfahren zum Beschichten von metallischen und keramischen substraten
DE60011691D1 (de) Zusammensetzung und Verfahren zum Chemischreinigen
DE69518548T2 (de) Verfahren zur Herstellung eines keramischen Substrates
AU4697800A (en) A method and apparatus for inspecting solder paste deposits on substrates
DE69939995D1 (de) Verfahren zum Bilden von Mustern und Vorrichtung zum Herstellen von Substraten
DE69940949D1 (de) Verfahren und vorrichtung zum schnellen herstellen eines punktmotives
DE60027946D1 (de) Verfahren zum Ätzen und Reinigen und Vorrichtung dafür
DE69619602D1 (de) Verfahren zum Herstellen eines Halbleiter-Substrats
DE59400189D1 (de) Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE60045636D1 (de) Verfahren zur behandlung eines halbleitersubstrats
DE60045416D1 (de) Verfahren zur behandlung von mikroelektroniksubstraten
DE69916728D1 (de) Verfahren zur Reinigung eines Halbleitersubstrats
DE69910635D1 (de) Pulverzusammensetzung, Verfahren zum Beschichten eines Substrats mit dieser Pulverlackbeschichtungszusammensetzung
DE69837103D1 (de) Lötzusammensetzung und verfahren zum löten mit der zusammensetzung
DE69526286D1 (de) Verfahren zur Herstellung eines keramischen Substrates
DE60030495D1 (de) Verfahren zum Reinigen/Schaben und Vorrichtung dafür
DE50004050D1 (de) Elastische Walze und Verfahren zum Herstellen einer solchen
DE69838116D1 (de) Verfahren zur Behandlung einer Substratoberfläche und Behandlungsmittel hierfür
GB0001208D0 (en) Corrosion inhibitor compositions method of use and process for production ther eof
DE69901322T2 (de) Zusammensetzung für keramisches Substrat sowie keramischer Bestandteil eines Schaltkreises
DE59409429D1 (de) Verfahren zum Herstellen eines Metall-Keramik-Substrates

Legal Events

Date Code Title Description
8364 No opposition during term of opposition