DE69932140D1 - Zulieferungsanlage für elektronische komponente - Google Patents

Zulieferungsanlage für elektronische komponente

Info

Publication number
DE69932140D1
DE69932140D1 DE69932140T DE69932140T DE69932140D1 DE 69932140 D1 DE69932140 D1 DE 69932140D1 DE 69932140 T DE69932140 T DE 69932140T DE 69932140 T DE69932140 T DE 69932140T DE 69932140 D1 DE69932140 D1 DE 69932140D1
Authority
DE
Germany
Prior art keywords
electronic components
subcontracting
subcontracting system
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69932140T
Other languages
English (en)
Other versions
DE69932140T2 (de
Inventor
Shuichi Kubota
Takao Kashiwazaki
Koji Okawa
Tadashi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69932140D1 publication Critical patent/DE69932140D1/de
Publication of DE69932140T2 publication Critical patent/DE69932140T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69932140T 1998-12-25 1999-12-21 Elekronikbauteil-Zuführungsvorrichtung Expired - Lifetime DE69932140T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP37162098 1998-12-25
JP37162098 1998-12-25

Publications (2)

Publication Number Publication Date
DE69932140D1 true DE69932140D1 (de) 2006-08-10
DE69932140T2 DE69932140T2 (de) 2007-05-16

Family

ID=18499019

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69932140T Expired - Lifetime DE69932140T2 (de) 1998-12-25 1999-12-21 Elekronikbauteil-Zuführungsvorrichtung

Country Status (3)

Country Link
US (1) US6321817B1 (de)
EP (1) EP1014775B8 (de)
DE (1) DE69932140T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6601729B1 (en) * 1999-03-26 2003-08-05 Papp Enterprises, Llc Automated portable medication radial dispensing apparatus and method using a carrier tape
DE102008049479A1 (de) 2008-09-29 2009-12-17 Siemens Aktiengesellschaft Bauelementegurt für Lagerung und Zufuhr von elektronischen Bauelementen
US9209442B1 (en) * 2014-06-09 2015-12-08 Akoio, Llc Product dispenser
WO2020194519A1 (ja) * 2019-03-26 2020-10-01 株式会社Ｆｕｊｉ テープ案内部材およびそれを備えるテープフィーダ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662948B2 (ja) 1986-10-30 1997-10-15 ニツト− システム テクノロジ− インコ−ポレ−テツド チップテープのトップテープ除去装置
US5214653A (en) * 1990-10-22 1993-05-25 Harris Corporation Fault finder expert system
DE69737545T2 (de) 1996-05-13 2007-12-13 Matsushita Electric Industrial Co., Ltd., Kadoma Vorrichtung zum zuführen von elektronischen bauelementen
JP3670404B2 (ja) * 1996-06-28 2005-07-13 株式会社日立ハイテクインスツルメンツ 部品供給装置
US6082954A (en) * 1997-02-21 2000-07-04 Summit Holding Two, Inc. Tape feeders and systems using the same

Also Published As

Publication number Publication date
EP1014775B8 (de) 2006-09-27
DE69932140T2 (de) 2007-05-16
EP1014775A1 (de) 2000-06-28
EP1014775B1 (de) 2006-06-28
US6321817B1 (en) 2001-11-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)