DE69924767D1 - Plasmabearbeitungsgerät und Werkzeug zur Impedanzmessung - Google Patents

Plasmabearbeitungsgerät und Werkzeug zur Impedanzmessung

Info

Publication number
DE69924767D1
DE69924767D1 DE69924767T DE69924767T DE69924767D1 DE 69924767 D1 DE69924767 D1 DE 69924767D1 DE 69924767 T DE69924767 T DE 69924767T DE 69924767 T DE69924767 T DE 69924767T DE 69924767 D1 DE69924767 D1 DE 69924767D1
Authority
DE
Germany
Prior art keywords
tool
processing device
plasma processing
impedance measurement
impedance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69924767T
Other languages
English (en)
Other versions
DE69924767T2 (de
Inventor
Akira Nakano
Chul Kim
Koichi Fukuda
Yasuhiko Kasama
Tadahiro Ohmi
Shoichi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34080698A external-priority patent/JP3710081B2/ja
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Application granted granted Critical
Publication of DE69924767D1 publication Critical patent/DE69924767D1/de
Publication of DE69924767T2 publication Critical patent/DE69924767T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
DE69924767T 1998-11-30 1999-11-25 Plasmabearbeitungsgerät und Werkzeug zur Impedanzmessung Expired - Lifetime DE69924767T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34080698 1998-11-30
JP34080698A JP3710081B2 (ja) 1997-11-30 1998-11-30 プラズマ処理装置

Publications (2)

Publication Number Publication Date
DE69924767D1 true DE69924767D1 (de) 2005-05-19
DE69924767T2 DE69924767T2 (de) 2005-09-01

Family

ID=18340473

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69927780T Expired - Lifetime DE69927780T2 (de) 1998-11-30 1999-11-25 Plasmabearbeitungsgerät und Werkzeug zur Impedanzmessung
DE69924767T Expired - Lifetime DE69924767T2 (de) 1998-11-30 1999-11-25 Plasmabearbeitungsgerät und Werkzeug zur Impedanzmessung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69927780T Expired - Lifetime DE69927780T2 (de) 1998-11-30 1999-11-25 Plasmabearbeitungsgerät und Werkzeug zur Impedanzmessung

Country Status (3)

Country Link
US (1) US6349670B1 (de)
EP (2) EP1406292B1 (de)
DE (2) DE69927780T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6364958B1 (en) * 2000-05-24 2002-04-02 Applied Materials, Inc. Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridges
JP2004288984A (ja) * 2003-03-24 2004-10-14 Sharp Corp 成膜装置及び成膜方法
US7083702B2 (en) * 2003-06-12 2006-08-01 Applied Materials, Inc. RF current return path for a large area substrate plasma reactor
US7107125B2 (en) * 2003-10-29 2006-09-12 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot
KR100710923B1 (ko) * 2004-06-02 2007-04-23 동경 엘렉트론 주식회사 플라즈마 처리장치 및 임피던스 조정방법
JP4185483B2 (ja) * 2004-10-22 2008-11-26 シャープ株式会社 プラズマ処理装置
JP2006196681A (ja) * 2005-01-13 2006-07-27 Sharp Corp プラズマ処理装置および同装置により製造された半導体素子
JP4584722B2 (ja) * 2005-01-13 2010-11-24 シャープ株式会社 プラズマ処理装置および同装置により製造された半導体素子
KR101197020B1 (ko) * 2006-06-09 2012-11-06 주성엔지니어링(주) 균일한 플라즈마 방전을 위한 기판처리장치 및 이를이용하여 플라즈마 방전세기를 조절하는 방법
US8004293B2 (en) * 2006-11-20 2011-08-23 Applied Materials, Inc. Plasma processing chamber with ground member integrity indicator and method for using the same
CN102177769B (zh) * 2008-10-09 2016-02-03 应用材料公司 大等离子体处理室所用的射频回流路径
CN102308675B (zh) * 2009-02-04 2016-01-13 应用材料公司 用于等离子体工艺的接地回流路径
JP5782226B2 (ja) * 2010-03-24 2015-09-24 東京エレクトロン株式会社 基板処理装置
US10224182B2 (en) * 2011-10-17 2019-03-05 Novellus Systems, Inc. Mechanical suppression of parasitic plasma in substrate processing chamber
US9846130B2 (en) 2014-02-24 2017-12-19 Applied Materials, Inc. Ceramic ring test device
CN111326389B (zh) * 2018-12-17 2023-06-16 中微半导体设备(上海)股份有限公司 一种电容耦合等离子体刻蚀设备
CN111326387B (zh) 2018-12-17 2023-04-21 中微半导体设备(上海)股份有限公司 一种电容耦合等离子体刻蚀设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129839A (en) * 1977-03-09 1978-12-12 Raytheon Company Radio frequency energy combiner or divider
DE4200636A1 (de) * 1992-01-13 1993-07-15 Fraunhofer Ges Forschung Vorrichtung zur messung von plasmaparametern in hochfrequenzentladungen
US5760573A (en) * 1993-11-18 1998-06-02 Texas Instruments Incorporated Plasma density monitor and method
US5467013A (en) 1993-12-07 1995-11-14 Sematech, Inc. Radio frequency monitor for semiconductor process control
AU2003195A (en) * 1994-06-21 1996-01-04 Boc Group, Inc., The Improved power distribution for multiple electrode plasma systems using quarter wavelength transmission lines
US5688358A (en) * 1995-03-08 1997-11-18 Applied Materials, Inc. R.F. plasma reactor with larger-than-wafer pedestal conductor
US5817534A (en) * 1995-12-04 1998-10-06 Applied Materials, Inc. RF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafers
US5942039A (en) * 1997-05-01 1999-08-24 Applied Materials, Inc. Self-cleaning focus ring
US6051100A (en) * 1997-10-24 2000-04-18 International Business Machines Corporation High conductance plasma containment structure

Also Published As

Publication number Publication date
EP1030345B1 (de) 2005-10-19
DE69927780D1 (de) 2006-03-02
DE69924767T2 (de) 2005-09-01
EP1406292A2 (de) 2004-04-07
EP1406292B1 (de) 2005-04-13
DE69927780T2 (de) 2006-07-13
EP1030345A2 (de) 2000-08-23
US6349670B1 (en) 2002-02-26
EP1406292A3 (de) 2004-06-09
EP1030345A3 (de) 2003-02-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition