DE69905968D1 - Eine Fotoresistzusammensetzung - Google Patents

Eine Fotoresistzusammensetzung

Info

Publication number
DE69905968D1
DE69905968D1 DE69905968T DE69905968T DE69905968D1 DE 69905968 D1 DE69905968 D1 DE 69905968D1 DE 69905968 T DE69905968 T DE 69905968T DE 69905968 T DE69905968 T DE 69905968T DE 69905968 D1 DE69905968 D1 DE 69905968D1
Authority
DE
Germany
Prior art keywords
photoresist composition
photoresist
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69905968T
Other languages
English (en)
Other versions
DE69905968T2 (de
Inventor
Koji Ichikawa
Nobuhito Fukui
Koshiro Ochiai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of DE69905968D1 publication Critical patent/DE69905968D1/de
Application granted granted Critical
Publication of DE69905968T2 publication Critical patent/DE69905968T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/11—Vinyl alcohol polymer or derivative

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
DE69905968T 1998-05-08 1999-05-07 Eine Fotoresistzusammensetzung Expired - Fee Related DE69905968T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12602398 1998-05-08
JP36075698A JP3743187B2 (ja) 1998-05-08 1998-12-18 フォトレジスト組成物

Publications (2)

Publication Number Publication Date
DE69905968D1 true DE69905968D1 (de) 2003-04-24
DE69905968T2 DE69905968T2 (de) 2003-12-24

Family

ID=26462293

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69905968T Expired - Fee Related DE69905968T2 (de) 1998-05-08 1999-05-07 Eine Fotoresistzusammensetzung

Country Status (8)

Country Link
US (1) US6153349A (de)
EP (1) EP0955563B1 (de)
JP (1) JP3743187B2 (de)
KR (1) KR100569615B1 (de)
CN (1) CN1167982C (de)
DE (1) DE69905968T2 (de)
SG (1) SG80626A1 (de)
TW (1) TW581930B (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI277830B (en) 1999-01-28 2007-04-01 Sumitomo Chemical Co Resist composition
US6200728B1 (en) * 1999-02-20 2001-03-13 Shipley Company, L.L.C. Photoresist compositions comprising blends of photoacid generators
TW538316B (en) * 2001-01-19 2003-06-21 Sumitomo Chemical Co Chemical amplifying type positive resist composition
JP2003280198A (ja) * 2002-03-20 2003-10-02 Sumitomo Chem Co Ltd 化学増幅型ポジ型レジスト組成物
US6858378B1 (en) * 2002-04-17 2005-02-22 Sandia National Laboratories Photoimageable composition
US7323290B2 (en) * 2002-09-30 2008-01-29 Eternal Technology Corporation Dry film photoresist
US7148265B2 (en) * 2002-09-30 2006-12-12 Rohm And Haas Electronic Materials Llc Functional polymer
US20040191674A1 (en) * 2003-03-28 2004-09-30 Yukio Hanamoto Chemical amplification resist composition
JP4583860B2 (ja) * 2004-10-04 2010-11-17 富士通株式会社 レジストパターン厚肉化材料、レジストパターンの形成方法、並びに、半導体装置及びその製造方法
US20070002296A1 (en) * 2005-06-30 2007-01-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography defect reduction
US7927779B2 (en) 2005-06-30 2011-04-19 Taiwan Semiconductor Manufacturing Companym, Ltd. Water mark defect prevention for immersion lithography
US8383322B2 (en) 2005-08-05 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography watermark reduction
TW200715067A (en) * 2005-09-06 2007-04-16 Koninkl Philips Electronics Nv Lithographic method
TW200715068A (en) * 2005-09-06 2007-04-16 Koninkl Philips Electronics Nv Lithographic method
US7993808B2 (en) 2005-09-30 2011-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. TARC material for immersion watermark reduction
KR20070101789A (ko) * 2006-04-13 2007-10-17 가부시키가이샤 뉴플레어 테크놀로지 레지스트 패턴의 형성 방법 및 하전 입자선 묘화 방법
US20100178611A1 (en) * 2006-04-13 2010-07-15 Nuflare Technology, Inc. Lithography method of electron beam
US8518628B2 (en) 2006-09-22 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Surface switchable photoresist
US7749680B2 (en) * 2007-01-05 2010-07-06 Hynix Semiconductor Inc. Photoresist composition and method for forming pattern of a semiconductor device
JP5703197B2 (ja) 2011-01-18 2015-04-15 富士フイルム株式会社 化学増幅型レジスト組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、レジストパターン形成方法、及び、フォトマスク、並びに、高分子化合物
JP5723829B2 (ja) 2011-11-10 2015-05-27 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、マスクブランクス及びパターン形成方法
JP5919122B2 (ja) 2012-07-27 2016-05-18 富士フイルム株式会社 樹脂組成物及びそれを用いたパターン形成方法
CN103309160B (zh) * 2013-07-03 2015-08-26 北京科华微电子材料有限公司 一种负性化学放大光刻胶及其成像方法
KR101847429B1 (ko) * 2014-06-19 2018-04-10 후지필름 가부시키가이샤 감방사선성 또는 감활성광선성 수지 조성물과 그것을 이용한 레지스트막, 마스크 블랭크, 레지스트 패턴 형성 방법, 전자 디바이스의 제조 방법, 및 전자 디바이스

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5558971A (en) * 1994-09-02 1996-09-24 Wako Pure Chemical Industries, Ltd. Resist material
JP3506817B2 (ja) * 1995-07-26 2004-03-15 クラリアント インターナショナル リミテッド 放射線感応性組成物
EP0780732B1 (de) * 1995-12-21 2003-07-09 Wako Pure Chemical Industries Ltd Polymerzusammensetzung und Rezistmaterial
DE69612182T3 (de) * 1996-02-09 2005-08-04 Wako Pure Chemical Industries, Ltd. Polymer und Resistmaterial

Also Published As

Publication number Publication date
JP2000029220A (ja) 2000-01-28
EP0955563B1 (de) 2003-03-19
SG80626A1 (en) 2001-05-22
CN1235281A (zh) 1999-11-17
EP0955563A1 (de) 1999-11-10
US6153349A (en) 2000-11-28
TW581930B (en) 2004-04-01
DE69905968T2 (de) 2003-12-24
KR100569615B1 (ko) 2006-04-11
CN1167982C (zh) 2004-09-22
JP3743187B2 (ja) 2006-02-08
KR19990088114A (ko) 1999-12-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee