DE69903539D1 - Verfahren und vorrichtung zur implantation mit ionen niedriger energie - Google Patents

Verfahren und vorrichtung zur implantation mit ionen niedriger energie

Info

Publication number
DE69903539D1
DE69903539D1 DE69903539T DE69903539T DE69903539D1 DE 69903539 D1 DE69903539 D1 DE 69903539D1 DE 69903539 T DE69903539 T DE 69903539T DE 69903539 T DE69903539 T DE 69903539T DE 69903539 D1 DE69903539 D1 DE 69903539D1
Authority
DE
Germany
Prior art keywords
implanting
ions
low energy
energy
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69903539T
Other languages
English (en)
Other versions
DE69903539T2 (de
Inventor
Philip Sullivan
George Michael Gammel
Damian Francis Brennan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Application granted granted Critical
Publication of DE69903539D1 publication Critical patent/DE69903539D1/de
Publication of DE69903539T2 publication Critical patent/DE69903539T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/047—Changing particle velocity
    • H01J2237/0475—Changing particle velocity decelerating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE69903539T 1998-05-22 1999-05-10 Verfahren und vorrichtung zur implantation mit ionen niedriger energie Expired - Fee Related DE69903539T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8390498A 1998-05-22 1998-05-22
PCT/US1999/010169 WO1999062098A1 (en) 1998-05-22 1999-05-10 Method and apparatus for low energy ion implantation

Publications (2)

Publication Number Publication Date
DE69903539D1 true DE69903539D1 (de) 2002-11-21
DE69903539T2 DE69903539T2 (de) 2003-06-12

Family

ID=22181405

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69903539T Expired - Fee Related DE69903539T2 (de) 1998-05-22 1999-05-10 Verfahren und vorrichtung zur implantation mit ionen niedriger energie

Country Status (7)

Country Link
US (1) US6528804B1 (de)
EP (1) EP1080482B1 (de)
JP (1) JP2002517068A (de)
KR (1) KR20010043738A (de)
DE (1) DE69903539T2 (de)
TW (1) TW446987B (de)
WO (1) WO1999062098A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6791097B2 (en) * 2001-01-18 2004-09-14 Varian Semiconductor Equipment Associates, Inc. Adjustable conductance limiting aperture for ion implanters
US20080223409A1 (en) * 2003-12-12 2008-09-18 Horsky Thomas N Method and apparatus for extending equipment uptime in ion implantation
US20080073559A1 (en) * 2003-12-12 2008-03-27 Horsky Thomas N Controlling the flow of vapors sublimated from solids
KR101160642B1 (ko) * 2003-12-12 2012-06-28 세미이큅, 인코포레이티드 고체로부터 승화된 증기의 유동제어
WO2009039382A1 (en) * 2007-09-21 2009-03-26 Semequip. Inc. Method for extending equipment uptime in ion implantation
US8461554B1 (en) * 2011-12-07 2013-06-11 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for charge neutralization during processing of a workpiece
CN103779162A (zh) * 2012-11-09 2014-05-07 北京中科信电子装备有限公司 一种离子注入机加速器
JP6429763B2 (ja) * 2015-12-22 2018-11-28 三菱電機株式会社 イオン注入装置
DE102016005537A1 (de) * 2016-05-04 2017-11-09 Forschungszentrum Jülich GmbH Fachbereich Patente Verfahren zur Herstellung von Schichten von ReRAM-Speichern und Verwendung eines Implanters

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3908183A (en) * 1973-03-14 1975-09-23 California Linear Circuits Inc Combined ion implantation and kinetic transport deposition process
US4011449A (en) 1975-11-05 1977-03-08 Ibm Corporation Apparatus for measuring the beam current of charged particle beam
US4135097A (en) * 1977-05-05 1979-01-16 International Business Machines Corporation Ion implantation apparatus for controlling the surface potential of a target surface
US4276477A (en) 1979-09-17 1981-06-30 Varian Associates, Inc. Focusing apparatus for uniform application of charged particle beam
US4283631A (en) 1980-02-22 1981-08-11 Varian Associates, Inc. Bean scanning and method of use for ion implantation
US4922106A (en) 1986-04-09 1990-05-01 Varian Associates, Inc. Ion beam scanning method and apparatus
US4892752A (en) * 1987-08-12 1990-01-09 Oki Electric Industry Co., Ltd. Method of ion implantation
US4899059A (en) 1988-05-18 1990-02-06 Varian Associates, Inc. Disk scanning apparatus for batch ion implanters
JP2704438B2 (ja) * 1989-09-04 1998-01-26 東京エレクトロン株式会社 イオン注入装置
NL9000822A (nl) 1990-04-09 1991-11-01 Philips Nv Werkwijze voor bestraling van een object met een geladen deeltjesbundel en inrichting voor uitvoering van de werkwijze.
JP2648642B2 (ja) 1990-04-17 1997-09-03 アプライド マテリアルズ インコーポレイテッド 巾広ビームでイオンインプランテーションを行なう方法及び装置
JPH05106037A (ja) * 1991-10-16 1993-04-27 Mitsubishi Electric Corp イオン注入装置及びその制御方法
US5466929A (en) * 1992-02-21 1995-11-14 Hitachi, Ltd. Apparatus and method for suppressing electrification of sample in charged beam irradiation apparatus
US5343047A (en) 1992-06-27 1994-08-30 Tokyo Electron Limited Ion implantation system
US5319212A (en) * 1992-10-07 1994-06-07 Genus, Inc. Method of monitoring ion beam current in ion implantation apparatus for use in manufacturing semiconductors
US5393985A (en) 1992-11-26 1995-02-28 Shimadzu Corporation Apparatus for focusing an ion beam
JP3054302B2 (ja) 1992-12-02 2000-06-19 アプライド マテリアルズ インコーポレイテッド イオン注入中の半導体ウェハにおける帯電を低減するプラズマ放出システム
US5350926A (en) 1993-03-11 1994-09-27 Diamond Semiconductor Group, Inc. Compact high current broad beam ion implanter
JP3123345B2 (ja) 1994-05-31 2001-01-09 株式会社日立製作所 イオン打込み装置
GB2344213B (en) 1995-11-08 2000-08-09 Applied Materials Inc An ion implanter with improved field control
GB2343545B (en) 1995-11-08 2000-06-21 Applied Materials Inc An ion implanter with three electrode deceleration structure and upstream mass selection
GB2307592B (en) 1995-11-23 1999-11-10 Applied Materials Inc Ion implantation apparatus withimproved post mass selection deceleration
JP3407548B2 (ja) * 1996-03-29 2003-05-19 株式会社日立製作所 イオン打込み装置及びこれを用いた半導体製造方法
JP2921500B2 (ja) 1996-07-30 1999-07-19 日本電気株式会社 イオン注入装置
US5909031A (en) * 1997-09-08 1999-06-01 Eaton Corporation Ion implanter electron shower having enhanced secondary electron emission

Also Published As

Publication number Publication date
TW446987B (en) 2001-07-21
DE69903539T2 (de) 2003-06-12
EP1080482A1 (de) 2001-03-07
US6528804B1 (en) 2003-03-04
WO1999062098A1 (en) 1999-12-02
EP1080482B1 (de) 2002-10-16
KR20010043738A (ko) 2001-05-25
JP2002517068A (ja) 2002-06-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee