DE69838690D1 - Vorrichtung zum Härten einer Beschichtung und Vorrichtung zum Beschichten - Google Patents

Vorrichtung zum Härten einer Beschichtung und Vorrichtung zum Beschichten

Info

Publication number
DE69838690D1
DE69838690D1 DE69838690T DE69838690T DE69838690D1 DE 69838690 D1 DE69838690 D1 DE 69838690D1 DE 69838690 T DE69838690 T DE 69838690T DE 69838690 T DE69838690 T DE 69838690T DE 69838690 D1 DE69838690 D1 DE 69838690D1
Authority
DE
Germany
Prior art keywords
coating
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69838690T
Other languages
English (en)
Other versions
DE69838690T2 (de
Inventor
Kazuhiro Takeshita
Shinji Nagashima
Makoto Muramatsu
Yoji Mizutani
Kazutoshi Yano
Kyoshige Katayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP36355297A external-priority patent/JP3273754B2/ja
Priority claimed from JP01321798A external-priority patent/JP3225220B2/ja
Priority claimed from JP01496598A external-priority patent/JP3193898B2/ja
Priority claimed from JP01496498A external-priority patent/JP3173725B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69838690D1 publication Critical patent/DE69838690D1/de
Application granted granted Critical
Publication of DE69838690T2 publication Critical patent/DE69838690T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486—Operating the coating or treatment in a controlled atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
DE1998638690 1997-12-15 1998-12-15 Vorrichtung zum Härten einer Beschichtung und Vorrichtung zum Beschichten Expired - Fee Related DE69838690T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP36355297 1997-12-15
JP36355297A JP3273754B2 (ja) 1997-12-15 1997-12-15 塗布膜形成装置
JP1321798 1998-01-07
JP01321798A JP3225220B2 (ja) 1998-01-07 1998-01-07 塗布膜形成方法
JP1496598 1998-01-09
JP01496598A JP3193898B2 (ja) 1998-01-09 1998-01-09 塗布膜形成方法
JP1496498 1998-01-09
JP01496498A JP3173725B2 (ja) 1998-01-09 1998-01-09 塗布膜形成方法、液処理方法及び液処理装置

Publications (2)

Publication Number Publication Date
DE69838690D1 true DE69838690D1 (de) 2007-12-20
DE69838690T2 DE69838690T2 (de) 2008-08-28

Family

ID=38690538

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1998638690 Expired - Fee Related DE69838690T2 (de) 1997-12-15 1998-12-15 Vorrichtung zum Härten einer Beschichtung und Vorrichtung zum Beschichten

Country Status (2)

Country Link
EP (1) EP1523031B1 (de)
DE (1) DE69838690T2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005042769A1 (de) * 2005-09-08 2007-03-15 Disco Hi-Tech Europe Gmbh Verfahren und Vorrichtung zur Formkorrektur eines dünngeschliffenen Wafers

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100370728B1 (ko) * 1994-10-27 2003-04-07 실리콘 밸리 그룹, 인크. 기판을균일하게코팅하는방법및장치

Also Published As

Publication number Publication date
EP1523031B1 (de) 2007-11-07
DE69838690T2 (de) 2008-08-28
EP1523031A1 (de) 2005-04-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee