DE19681744T1 - Verfahren und Vorrichtung zum Charakterisieren einer Oberfläche - Google Patents

Verfahren und Vorrichtung zum Charakterisieren einer Oberfläche

Info

Publication number
DE19681744T1
DE19681744T1 DE19681744T DE19681744T DE19681744T1 DE 19681744 T1 DE19681744 T1 DE 19681744T1 DE 19681744 T DE19681744 T DE 19681744T DE 19681744 T DE19681744 T DE 19681744T DE 19681744 T1 DE19681744 T1 DE 19681744T1
Authority
DE
Germany
Prior art keywords
characterizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19681744T
Other languages
English (en)
Inventor
Todd F Schiff
Marvin L Bernt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCHMITT MEASUREMENT SYSTEMS IN
Original Assignee
SCHMITT MEASUREMENT SYSTEMS IN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SCHMITT MEASUREMENT SYSTEMS IN filed Critical SCHMITT MEASUREMENT SYSTEMS IN
Publication of DE19681744T1 publication Critical patent/DE19681744T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
    • G01N21/474—Details of optical heads therefor, e.g. using optical fibres
DE19681744T 1995-11-27 1996-11-22 Verfahren und Vorrichtung zum Charakterisieren einer Oberfläche Withdrawn DE19681744T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/562,876 US5625451A (en) 1995-11-27 1995-11-27 Methods and apparatus for characterizing a surface
PCT/US1996/018723 WO1997020192A1 (en) 1995-11-27 1996-11-22 Methods and apparatus for characterizing a surface

Publications (1)

Publication Number Publication Date
DE19681744T1 true DE19681744T1 (de) 1999-03-11

Family

ID=24248171

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681744T Withdrawn DE19681744T1 (de) 1995-11-27 1996-11-22 Verfahren und Vorrichtung zum Charakterisieren einer Oberfläche

Country Status (7)

Country Link
US (2) US5625451A (de)
JP (1) JP2000501182A (de)
KR (1) KR19990071667A (de)
AU (1) AU1058397A (de)
DE (1) DE19681744T1 (de)
GB (1) GB2322191B (de)
WO (1) WO1997020192A1 (de)

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US6625558B1 (en) * 1999-11-05 2003-09-23 Zoran Corporation Method and apparatus for testing CMOS image sensors
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
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US6437861B1 (en) 2000-02-16 2002-08-20 Expo Photonic Solutions Inc. Compact light integration interface
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US6700657B1 (en) 2002-05-10 2004-03-02 Schmitt Measurement Systems, Inc. System and method for detecting surface roughness
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US6798526B2 (en) * 2002-09-12 2004-09-28 Seh America, Inc. Methods and apparatus for predicting oxygen-induced stacking fault density in wafers
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US7240875B2 (en) * 2003-10-14 2007-07-10 Sonoco Development, Inc. Yarn carrier
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US7298938B2 (en) * 2004-10-01 2007-11-20 University Of Washington Configuration memory for a scanning beam device
TWI412735B (zh) * 2004-10-08 2013-10-21 Koninkl Philips Electronics Nv 測試表面之光學檢測
US7159782B2 (en) * 2004-12-23 2007-01-09 University Of Washington Methods of driving a scanning beam device to achieve high frame rates
US7784697B2 (en) 2004-12-23 2010-08-31 University Of Washington Methods of driving a scanning beam device to achieve high frame rates
US7189961B2 (en) 2005-02-23 2007-03-13 University Of Washington Scanning beam device with detector assembly
US20060226231A1 (en) * 2005-03-29 2006-10-12 University Of Washington Methods and systems for creating sequential color images
US7395967B2 (en) * 2005-07-21 2008-07-08 University Of Washington Methods and systems for counterbalancing a scanning beam device
US7312879B2 (en) * 2005-08-23 2007-12-25 University Of Washington Distance determination in a scanned beam image capture device
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US7528944B2 (en) * 2006-05-22 2009-05-05 Kla-Tencor Technologies Corporation Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool
US8280649B2 (en) * 2006-06-27 2012-10-02 Nec Corporation Board or electronic component warp analyzing method, board or electronic component warp analyzing system and board or electronic component warp analyzing program
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BRPI0811794A2 (pt) * 2007-07-19 2014-11-11 3M Innovative Properties Co "sensor de propriedade ótica"
US8611639B2 (en) 2007-07-30 2013-12-17 Kla-Tencor Technologies Corp Semiconductor device property extraction, generation, visualization, and monitoring methods
US7912658B2 (en) * 2008-05-28 2011-03-22 Kla-Tencor Corp. Systems and methods for determining two or more characteristics of a wafer
US8494802B2 (en) * 2008-06-19 2013-07-23 Kla-Tencor Corp. Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer
US8269960B2 (en) * 2008-07-24 2012-09-18 Kla-Tencor Corp. Computer-implemented methods for inspecting and/or classifying a wafer
US8269980B1 (en) 2009-05-11 2012-09-18 Engineering Synthesis Design, Inc. White light scanning interferometer with simultaneous phase-shifting module
KR101008846B1 (ko) 2010-06-23 2011-01-19 (주)큐엠씨 전자 소자 검사 장치
US9662047B2 (en) 2010-08-05 2017-05-30 Massachusetts Institute Of Technology Portable raman diagnostic system
US8582117B2 (en) 2011-04-08 2013-11-12 Schmitt Industries, Inc. Systems and methods for calibrating an optical non-contact surface roughness measurement device
US9534883B1 (en) 2011-11-22 2017-01-03 Engineering Synthesis Design, Inc. Methods for determining error in an interferometry system
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US10772445B2 (en) 2016-09-21 2020-09-15 Purple Innovation, Llc Pillow including gelatinous elastomer cushion having deformable wall members and related methods
US10863837B2 (en) 2016-09-21 2020-12-15 Purple Innovation, Llc Pillow including gelatinous elastomer cushioning materials
JP6581614B2 (ja) * 2017-03-14 2019-09-25 株式会社サイオクス 半導体構造体の製造方法、検査方法、およびプログラム
JP7178573B2 (ja) 2018-06-11 2022-11-28 日亜化学工業株式会社 発光装置の測定装置及び発光装置の測定方法
WO2021056425A1 (zh) * 2019-09-27 2021-04-01 深圳市汇顶科技股份有限公司 滤光片、指纹检测的装置和电子设备
JP7339232B2 (ja) 2020-12-04 2023-09-05 トヨタ自動車株式会社 構造測定システム、構造測定方法、処理装置および処理プログラム

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Also Published As

Publication number Publication date
GB2322191B (en) 1999-09-01
GB2322191A (en) 1998-08-19
US5625451A (en) 1997-04-29
WO1997020192A1 (en) 1997-06-05
GB9810832D0 (en) 1998-07-22
KR19990071667A (ko) 1999-09-27
US5661556A (en) 1997-08-26
AU1058397A (en) 1997-06-19
JP2000501182A (ja) 2000-02-02

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8139 Disposal/non-payment of the annual fee