DE69704998D1 - Ausrichtungsvorrichtung und lithographischer apparat mit einer solchen vorrichtung - Google Patents
Ausrichtungsvorrichtung und lithographischer apparat mit einer solchen vorrichtungInfo
- Publication number
- DE69704998D1 DE69704998D1 DE69704998T DE69704998T DE69704998D1 DE 69704998 D1 DE69704998 D1 DE 69704998D1 DE 69704998 T DE69704998 T DE 69704998T DE 69704998 T DE69704998 T DE 69704998T DE 69704998 D1 DE69704998 D1 DE 69704998D1
- Authority
- DE
- Germany
- Prior art keywords
- lithographic apparatus
- alignment
- alignment device
- lithographic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96200725 | 1996-03-15 | ||
PCT/IB1997/000170 WO1997035234A1 (en) | 1996-03-15 | 1997-02-27 | Alignment device and lithographic apparatus provided with such a device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69704998D1 true DE69704998D1 (de) | 2001-07-05 |
DE69704998T2 DE69704998T2 (de) | 2001-09-27 |
Family
ID=8223790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69704998T Expired - Fee Related DE69704998T2 (de) | 1996-03-15 | 1997-02-27 | Ausrichtungsvorrichtung und lithographischer apparat mit einer solchen vorrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5917604A (de) |
EP (1) | EP0826165B1 (de) |
JP (1) | JP4023695B2 (de) |
DE (1) | DE69704998T2 (de) |
TW (1) | TW385377B (de) |
WO (1) | WO1997035234A1 (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090273634A1 (en) * | 1997-07-15 | 2009-11-05 | Silverbrook Research Pty Ltd | Printhead Integrated Circuit With Thin Nozzle Layer |
US7246881B2 (en) * | 1997-07-15 | 2007-07-24 | Silverbrook Research Pty Ltd | Printhead assembly arrangement for a wide format pagewidth inkjet printer |
US6160622A (en) * | 1997-12-29 | 2000-12-12 | Asm Lithography, B.V. | Alignment device and lithographic apparatus comprising such a device |
US6417922B1 (en) | 1997-12-29 | 2002-07-09 | Asml Netherlands B.V. | Alignment device and lithographic apparatus comprising such a device |
US6377337B1 (en) * | 1998-05-02 | 2002-04-23 | Canon Kabushiki Kaisha | Projection exposure apparatus |
DE19830438A1 (de) * | 1998-07-08 | 2000-01-13 | Zeiss Carl Fa | Verfahren zur Dekontamination von Mikrolithographie-Projektionsbelichtungsanlagen |
US6061606A (en) | 1998-08-25 | 2000-05-09 | International Business Machines Corporation | Geometric phase analysis for mask alignment |
DE19949009A1 (de) | 1999-10-11 | 2001-04-12 | Zeiss Carl Fa | Verfahren und Vorrichtung zum gegenseitigen Ausrichten eines in einer Maske gebildeten Maskenmusters und eines Substrates |
TWI282909B (en) * | 1999-12-23 | 2007-06-21 | Asml Netherlands Bv | Lithographic apparatus and a method for manufacturing a device |
EP1111473A3 (de) * | 1999-12-23 | 2004-04-21 | ASML Netherlands B.V. | Lithographischer Apparat mit Vakuumkammer und interferometrischem Ausrichtungssystem |
JP4414535B2 (ja) * | 2000-01-13 | 2010-02-10 | 進 野田 | 半導体装置の製造方法 |
TW522287B (en) * | 2000-01-14 | 2003-03-01 | Asml Netherlands Bv | Lithographic projection apparatus, method of calibrating a lithographic projection apparatus, method of manufacturing a device using a lithographic projection apparatus, and device manufactured thereby |
US6766211B1 (en) * | 2000-10-03 | 2004-07-20 | International Business Machines Corporation | Structure and method for amplifying target overlay errors using the synthesized beat signal between interleaved arrays of differing periodicity |
US7009704B1 (en) * | 2000-10-26 | 2006-03-07 | Kla-Tencor Technologies Corporation | Overlay error detection |
KR100500469B1 (ko) * | 2001-01-12 | 2005-07-12 | 삼성전자주식회사 | 정렬마크와 이를 이용하는 노광정렬시스템 및 그 정렬방법 |
US6904201B1 (en) * | 2001-05-09 | 2005-06-07 | Intel Corporation | Phase-controlled fiber Bragg gratings and manufacturing methods |
KR100391983B1 (ko) * | 2001-07-03 | 2003-07-22 | 삼성전자주식회사 | 반도체 노광 장비의 정렬 시스템 |
CN100337089C (zh) * | 2002-09-20 | 2007-09-12 | Asml荷兰有限公司 | 器件检验 |
SG138445A1 (en) * | 2003-02-14 | 2008-01-28 | Asml Netherlands Bv | Device and method for wafer alignment with reduced tilt sensitivity |
EP1450211A3 (de) * | 2003-02-14 | 2009-04-15 | ASML Netherlands B.V. | Vorrichtung und Verfahren zum Ausrichten von Wafern mit verringerter Empfindlichkeit auf Knippneigung |
US7573580B2 (en) * | 2003-11-17 | 2009-08-11 | Asml Holding N.V. | Optical position measuring system and method using a low coherence light source |
US7288779B2 (en) | 2003-12-17 | 2007-10-30 | Asml Netherlands B.V. | Method for position determination, method for overlay optimization, and lithographic projection apparatus |
US7433018B2 (en) * | 2005-12-27 | 2008-10-07 | Asml Netherlands B.V. | Pattern alignment method and lithographic apparatus |
CN100456142C (zh) * | 2006-10-18 | 2009-01-28 | 上海微电子装备有限公司 | 一种对准标记及其制造方法 |
US9625811B2 (en) * | 2009-12-18 | 2017-04-18 | Asml Netherlands B.V. | Imprint lithography |
CN102566338B (zh) * | 2010-12-28 | 2013-11-13 | 上海微电子装备有限公司 | 光刻对准系统中对对准位置进行修正的方法 |
NL2014956A (en) * | 2014-07-16 | 2016-04-12 | Asml Netherlands Bv | Lithographic Method and Apparatus. |
NL2017710A (en) | 2015-11-30 | 2017-06-07 | Asml Netherlands Bv | Lithographic Method and Apparatus |
NL2018651A (en) | 2016-05-04 | 2017-11-07 | Asml Netherlands Bv | Lithographic method and apparatus |
CN111505914B (zh) * | 2019-01-31 | 2021-06-25 | 上海微电子装备(集团)股份有限公司 | 光学对准装置及光刻系统 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7606548A (nl) * | 1976-06-17 | 1977-12-20 | Philips Nv | Werkwijze en inrichting voor het uitrichten van een i.c.-patroon ten opzichte van een halfgelei- dend substraat. |
NL8600639A (nl) * | 1986-03-12 | 1987-10-01 | Asm Lithography Bv | Werkwijze voor het ten opzichte van elkaar uitrichten van een masker en een substraat en inrichting voor het uitvoeren van de werkwijze. |
NL8900991A (nl) * | 1989-04-20 | 1990-11-16 | Asm Lithography Bv | Apparaat voor het afbeelden van een maskerpatroon op een substraat. |
NL9001611A (nl) * | 1990-07-16 | 1992-02-17 | Asm Lithography Bv | Apparaat voor het afbeelden van een maskerpatroon op een substraat. |
-
1997
- 1997-02-27 DE DE69704998T patent/DE69704998T2/de not_active Expired - Fee Related
- 1997-02-27 JP JP53329097A patent/JP4023695B2/ja not_active Expired - Fee Related
- 1997-02-27 EP EP97902547A patent/EP0826165B1/de not_active Expired - Lifetime
- 1997-02-27 WO PCT/IB1997/000170 patent/WO1997035234A1/en active IP Right Grant
- 1997-03-11 TW TW086103002A patent/TW385377B/zh not_active IP Right Cessation
- 1997-03-13 US US08/818,143 patent/US5917604A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5917604A (en) | 1999-06-29 |
EP0826165B1 (de) | 2001-05-30 |
JPH11505673A (ja) | 1999-05-21 |
EP0826165A1 (de) | 1998-03-04 |
DE69704998T2 (de) | 2001-09-27 |
TW385377B (en) | 2000-03-21 |
JP4023695B2 (ja) | 2007-12-19 |
WO1997035234A1 (en) | 1997-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |