DE69817194D1 - Eine negativ arbeitende fotoresistzusammensetzung auf basis von polyimid-vorläufern - Google Patents

Eine negativ arbeitende fotoresistzusammensetzung auf basis von polyimid-vorläufern

Info

Publication number
DE69817194D1
DE69817194D1 DE69817194T DE69817194T DE69817194D1 DE 69817194 D1 DE69817194 D1 DE 69817194D1 DE 69817194 T DE69817194 T DE 69817194T DE 69817194 T DE69817194 T DE 69817194T DE 69817194 D1 DE69817194 D1 DE 69817194D1
Authority
DE
Germany
Prior art keywords
photoresist composition
composition based
negative working
working photoresist
polyimide precursors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69817194T
Other languages
English (en)
Inventor
Sigurd Hagen
Nadia Reichlin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arch Specialty Chemicals Inc
Original Assignee
Arch Specialty Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arch Specialty Chemicals Inc filed Critical Arch Specialty Chemicals Inc
Priority claimed from PCT/US1998/018774 external-priority patent/WO1999013381A1/en
Application granted granted Critical
Publication of DE69817194D1 publication Critical patent/DE69817194D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D257/00—Heterocyclic compounds containing rings having four nitrogen atoms as the only ring hetero atoms
    • C07D257/02—Heterocyclic compounds containing rings having four nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D257/04—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D401/00—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom
    • C07D401/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings
    • C07D401/04—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings directly linked by a ring-member-to-ring-member bond
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D498/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms
    • C07D498/12—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms in which the condensed system contains three hetero rings
    • C07D498/14—Ortho-condensed systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69817194T 1997-09-11 1998-09-10 Eine negativ arbeitende fotoresistzusammensetzung auf basis von polyimid-vorläufern Expired - Lifetime DE69817194D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH214497 1997-09-11
PCT/US1998/018774 WO1999013381A1 (en) 1997-09-11 1998-09-10 A negatively acting photoresist composition based on polyimide precursors

Publications (1)

Publication Number Publication Date
DE69817194D1 true DE69817194D1 (de) 2003-09-18

Family

ID=4226906

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69817194T Expired - Lifetime DE69817194D1 (de) 1997-09-11 1998-09-10 Eine negativ arbeitende fotoresistzusammensetzung auf basis von polyimid-vorläufern

Country Status (4)

Country Link
JP (1) JP3916396B2 (de)
KR (1) KR100525586B1 (de)
DE (1) DE69817194D1 (de)
TW (1) TW536664B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI298076B (en) 2004-04-30 2008-06-21 Eternal Chemical Co Ltd Precursor solution for polyimide/silica composite material, its manufacture method and polyimide/silica composite material having low volume shrinkage
KR101126142B1 (ko) * 2010-04-05 2012-03-22 삼성모바일디스플레이주식회사 폴리이미드 전구체 함유 감광성 수지 조성물
JP2014143221A (ja) * 2011-05-18 2014-08-07 Panasonic Corp 回路基板の製造方法、並びに、その製造方法で得られる回路基板
KR102336227B1 (ko) * 2014-08-29 2021-12-07 헨켈 아게 운트 코. 카게아아 유기규소 개질된 광개시제 및 그의 광경화성 접착제 조성물
KR102021305B1 (ko) * 2015-06-30 2019-09-16 후지필름 가부시키가이샤 네거티브형 감광성 수지 조성물, 경화막, 경화막의 제조 방법 및 반도체 디바이스
TWI810158B (zh) * 2016-08-01 2023-08-01 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、 積層體的製造方法及半導體元件
KR102499391B1 (ko) * 2019-12-31 2023-02-10 삼성에스디아이 주식회사 초박막 형성이 가능한 레지스트 하층막 조성물

Also Published As

Publication number Publication date
KR100525586B1 (ko) 2005-11-03
KR20010023860A (ko) 2001-03-26
JP3916396B2 (ja) 2007-05-16
JP2001516074A (ja) 2001-09-25
TW536664B (en) 2003-06-11

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Legal Events

Date Code Title Description
8332 No legal effect for de