DE69738559D1 - Photoempfindliche umarbeitungsfähige Einkapselungszusammensetzung - Google Patents
Photoempfindliche umarbeitungsfähige EinkapselungszusammensetzungInfo
- Publication number
- DE69738559D1 DE69738559D1 DE69738559T DE69738559T DE69738559D1 DE 69738559 D1 DE69738559 D1 DE 69738559D1 DE 69738559 T DE69738559 T DE 69738559T DE 69738559 T DE69738559 T DE 69738559T DE 69738559 D1 DE69738559 D1 DE 69738559D1
- Authority
- DE
- Germany
- Prior art keywords
- encapsulant composition
- reversible
- photosensitive
- photosensitive reversible
- encapsulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US696398 | 1996-08-14 | ||
US08/696,398 US6008266A (en) | 1996-08-14 | 1996-08-14 | Photosensitive reworkable encapsulant |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69738559D1 true DE69738559D1 (de) | 2008-04-24 |
DE69738559T2 DE69738559T2 (de) | 2009-04-02 |
Family
ID=24796893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69738559T Expired - Lifetime DE69738559T2 (de) | 1996-08-14 | 1997-07-30 | Photoempfindliche umarbeitungsfähige Einkapselungszusammensetzung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6008266A (de) |
EP (1) | EP0829502B1 (de) |
JP (1) | JP3449595B2 (de) |
DE (1) | DE69738559T2 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002540235A (ja) * | 1999-03-23 | 2002-11-26 | ロックタイト コーポレーション | 再処理可能な熱硬化性樹脂組成物 |
CN1178287C (zh) * | 1999-06-17 | 2004-12-01 | 洛克泰特公司 | 可再处理的热固性树脂组合物 |
US20040155364A1 (en) * | 1999-06-17 | 2004-08-12 | Takahisa Doba | Reworkable thermosetting resin compositions |
US6255500B1 (en) | 2000-01-21 | 2001-07-03 | Loctite Corporation | Process for the epoxidation of diene esters |
US7012120B2 (en) | 2000-03-31 | 2006-03-14 | Henkel Corporation | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
US20050288458A1 (en) * | 2002-07-29 | 2005-12-29 | Klemarczyk Philip T | Reworkable thermosetting resin composition |
US6887737B1 (en) | 2001-12-13 | 2005-05-03 | Henkel Corporation | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
US6740193B2 (en) | 2001-12-21 | 2004-05-25 | Henkel Corporation | Gem-diesters and epoxidized derivatives thereof |
FR2838048B1 (fr) * | 2002-04-03 | 2005-05-27 | Prod Dentaires Pierre Rolland | Produit dentaire reticulable/dereticulable |
US7314700B2 (en) * | 2002-12-05 | 2008-01-01 | International Business Machines Corporation | High sensitivity resist compositions for electron-based lithography |
KR100920612B1 (ko) * | 2007-11-08 | 2009-10-08 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름 |
US8962779B2 (en) * | 2013-07-16 | 2015-02-24 | Dow Global Technologies Llc | Method of forming polyaryl polymers |
US9063420B2 (en) | 2013-07-16 | 2015-06-23 | Rohm And Haas Electronic Materials Llc | Photoresist composition, coated substrate, and method of forming electronic device |
US9410016B2 (en) | 2013-07-16 | 2016-08-09 | Dow Global Technologies Llc | Aromatic polyacetals and articles comprising them |
CN109749056A (zh) * | 2019-01-08 | 2019-05-14 | 大连理工大学 | 一种酸可控降解缩酮型脂环族环氧树脂、制备方法及应用 |
CN112920379B (zh) * | 2021-03-26 | 2021-10-26 | 蓝赛夫(上海)电子材料有限公司 | 环氧树脂单体及其中间体、制备方法、环氧树脂和回收方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2895962A (en) * | 1956-07-30 | 1959-07-21 | Shell Dev | Epoxidized acetals and polymers thereof |
US4256828A (en) * | 1975-09-02 | 1981-03-17 | Minnesota Mining And Manufacturing Company | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4216288A (en) * | 1978-09-08 | 1980-08-05 | General Electric Company | Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents |
US4245029A (en) * | 1979-08-20 | 1981-01-13 | General Electric Company | Photocurable compositions using triarylsulfonium salts |
US4289595A (en) * | 1979-11-26 | 1981-09-15 | American Can Company | Ambient temperature curing photopolymerizable epoxide compositions utilizing epoxide ethers and methods |
US4442197A (en) * | 1982-01-11 | 1984-04-10 | General Electric Company | Photocurable compositions |
CA1312040C (en) * | 1985-12-19 | 1992-12-29 | Joseph Victor Koleske | Conformal coatings cured with actinic radiation |
US5439766A (en) * | 1988-12-30 | 1995-08-08 | International Business Machines Corporation | Composition for photo imaging |
CA2004517A1 (en) * | 1989-12-04 | 1991-06-04 | Susan S. Johnson | Method of making a sulfonate ester and cross-linked alcohol coated support matrix |
US4987158A (en) * | 1990-03-23 | 1991-01-22 | General Electric Company | UV-curable pre-crosslinked epoxy functional silicones |
US5229251A (en) * | 1991-04-29 | 1993-07-20 | International Business Machines Corp. | Dry developable photoresist containing an epoxide, organosilicon and onium salt |
US5102772A (en) * | 1991-07-10 | 1992-04-07 | Ibm | Photocurable epoxy composition with sulfonium salt photoinitiator |
JP2728106B2 (ja) * | 1991-09-05 | 1998-03-18 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド |
US5262280A (en) * | 1992-04-02 | 1993-11-16 | Shipley Company Inc. | Radiation sensitive compositions |
TW259797B (de) * | 1992-12-23 | 1995-10-11 | Ciba Geigy | |
US5439779A (en) * | 1993-02-22 | 1995-08-08 | International Business Machines Corporation | Aqueous soldermask |
US5373032A (en) * | 1993-08-18 | 1994-12-13 | Isp Investments Inc. | Radiation curable alk-1-enyl urethanyl prepolymers |
-
1996
- 1996-08-14 US US08/696,398 patent/US6008266A/en not_active Expired - Lifetime
-
1997
- 1997-07-09 JP JP18344897A patent/JP3449595B2/ja not_active Expired - Fee Related
- 1997-07-30 EP EP97305748A patent/EP0829502B1/de not_active Expired - Lifetime
- 1997-07-30 DE DE69738559T patent/DE69738559T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0829502A2 (de) | 1998-03-18 |
EP0829502A3 (de) | 1998-11-18 |
JP3449595B2 (ja) | 2003-09-22 |
EP0829502B1 (de) | 2008-03-12 |
JPH1095833A (ja) | 1998-04-14 |
DE69738559T2 (de) | 2009-04-02 |
US6008266A (en) | 1999-12-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |