DE69737240D1 - Rotiergerät und rotierverfahren - Google Patents

Rotiergerät und rotierverfahren

Info

Publication number
DE69737240D1
DE69737240D1 DE69737240T DE69737240T DE69737240D1 DE 69737240 D1 DE69737240 D1 DE 69737240D1 DE 69737240 T DE69737240 T DE 69737240T DE 69737240 T DE69737240 T DE 69737240T DE 69737240 D1 DE69737240 D1 DE 69737240D1
Authority
DE
Germany
Prior art keywords
rotating unit
rotation process
rotation
rotating
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69737240T
Other languages
English (en)
Other versions
DE69737240T2 (de
Inventor
Tsutomu Doi
Yoshiaki Kurokawa
Naoaki Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Shibaura Mechatronics Corp
Original Assignee
Toshiba Corp
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Shibaura Mechatronics Corp filed Critical Toshiba Corp
Publication of DE69737240D1 publication Critical patent/DE69737240D1/de
Application granted granted Critical
Publication of DE69737240T2 publication Critical patent/DE69737240T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
DE69737240T 1996-11-15 1997-11-12 Rotiergerät und rotierverfahren Expired - Fee Related DE69737240T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP30471296 1996-11-15
JP30471296 1996-11-15
PCT/JP1997/004112 WO1998022230A1 (fr) 1996-11-15 1997-11-12 Dispositif rotatif et procede de mise en rotation

Publications (2)

Publication Number Publication Date
DE69737240D1 true DE69737240D1 (de) 2007-02-22
DE69737240T2 DE69737240T2 (de) 2007-06-21

Family

ID=17936311

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69737240T Expired - Fee Related DE69737240T2 (de) 1996-11-15 1997-11-12 Rotiergerät und rotierverfahren

Country Status (7)

Country Link
US (1) US6192903B1 (de)
EP (1) EP0976460B1 (de)
KR (1) KR100509800B1 (de)
CN (1) CN1097490C (de)
DE (1) DE69737240T2 (de)
TW (1) TW417159B (de)
WO (1) WO1998022230A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6516816B1 (en) 1999-04-08 2003-02-11 Applied Materials, Inc. Spin-rinse-dryer
US6536454B2 (en) * 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
JP2002353181A (ja) * 2001-05-30 2002-12-06 Ses Co Ltd 枚葉式基板洗浄方法および枚葉式基板洗浄装置
WO2003017337A1 (en) * 2001-08-14 2003-02-27 Applied Materials, Inc. Shield for capturing fluids displaced from a substrate
JP3874261B2 (ja) * 2002-04-10 2007-01-31 大日本スクリーン製造株式会社 基板処理装置
JP4255702B2 (ja) * 2003-01-28 2009-04-15 株式会社荏原製作所 基板処理装置及び方法
JP2004356517A (ja) * 2003-05-30 2004-12-16 Ebara Corp 基板洗浄装置及び基板洗浄方法
JP5519908B2 (ja) * 2004-11-08 2014-06-11 ブルーワー サイエンス アイ エヌ シー． 微細電子部品製造時に基板の外側エッジをコーティングする装置
JP5084639B2 (ja) * 2008-06-30 2012-11-28 芝浦メカトロニクス株式会社 スピン処理装置
US20120189421A1 (en) 2011-01-21 2012-07-26 Samsung Austin Semiconductor, L.P. Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber
JP6091060B2 (ja) * 2011-12-02 2017-03-08 芝浦メカトロニクス株式会社 スピン処理装置
CN102734152B (zh) * 2012-06-26 2015-08-12 三一汽车制造有限公司 风冷散热器及其防护装置、拖式混凝土泵
CN103105046A (zh) * 2013-03-20 2013-05-15 张家港市金太阳帽业有限公司 一种自动旋转羊毛绒帽子烘干装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2973408B2 (ja) * 1990-08-13 1999-11-08 東京エレクトロン株式会社 レジスト塗布装置
JPH06291026A (ja) * 1993-03-31 1994-10-18 Fujitsu Ltd スピンコーター
JPH0766107A (ja) * 1993-08-31 1995-03-10 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JP3126878B2 (ja) * 1994-06-30 2001-01-22 大日本スクリーン製造株式会社 基板裏面洗浄装置
US5689749A (en) * 1994-08-31 1997-11-18 Tokyo Electron Limited Apparatus for developing a resist-coated substrate
JP3198377B2 (ja) * 1994-08-31 2001-08-13 東京エレクトロン株式会社 処理方法及び処理装置
JP2726809B2 (ja) * 1995-09-29 1998-03-11 株式会社芝浦製作所 スピン乾燥処理装置

Also Published As

Publication number Publication date
CN1275933A (zh) 2000-12-06
EP0976460B1 (de) 2007-01-10
EP0976460A1 (de) 2000-02-02
CN1097490C (zh) 2003-01-01
WO1998022230A1 (fr) 1998-05-28
DE69737240T2 (de) 2007-06-21
KR100509800B1 (ko) 2005-08-23
EP0976460A4 (de) 2004-06-23
KR20000053305A (ko) 2000-08-25
US6192903B1 (en) 2001-02-27
TW417159B (en) 2001-01-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee