DE69732178D1 - Mikromechanische vorrichtung mit verbesserter abmessungskontrolle - Google Patents
Mikromechanische vorrichtung mit verbesserter abmessungskontrolleInfo
- Publication number
- DE69732178D1 DE69732178D1 DE69732178T DE69732178T DE69732178D1 DE 69732178 D1 DE69732178 D1 DE 69732178D1 DE 69732178 T DE69732178 T DE 69732178T DE 69732178 T DE69732178 T DE 69732178T DE 69732178 D1 DE69732178 D1 DE 69732178D1
- Authority
- DE
- Germany
- Prior art keywords
- dimensional control
- micromechanical device
- improved dimensional
- improved
- micromechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0136—Comb structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US616713 | 1996-03-15 | ||
US08/616,713 US5880369A (en) | 1996-03-15 | 1996-03-15 | Micromachined device with enhanced dimensional control |
PCT/US1997/004231 WO1997034153A1 (en) | 1996-03-15 | 1997-03-14 | Micromachined device with enhanced dimensional control |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69732178D1 true DE69732178D1 (de) | 2005-02-10 |
DE69732178T2 DE69732178T2 (de) | 2005-06-23 |
Family
ID=24470665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69732178T Expired - Lifetime DE69732178T2 (de) | 1996-03-15 | 1997-03-14 | Mikromechanische vorrichtung mit verbesserter abmessungskontrolle |
Country Status (4)
Country | Link |
---|---|
US (2) | US5880369A (de) |
EP (1) | EP0886781B1 (de) |
DE (1) | DE69732178T2 (de) |
WO (1) | WO1997034153A1 (de) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5565625A (en) * | 1994-12-01 | 1996-10-15 | Analog Devices, Inc. | Sensor with separate actuator and sense fingers |
US6223598B1 (en) * | 1997-06-18 | 2001-05-01 | Analog Devices, Inc. | Suspension arrangement for semiconductor accelerometer |
US6070464A (en) * | 1997-09-05 | 2000-06-06 | Motorola, Inc. | Sensing structure comprising a movable mass and a self-test structure |
DE19817357B4 (de) * | 1998-04-18 | 2008-10-30 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
DE19819458A1 (de) * | 1998-04-30 | 1999-11-04 | Bosch Gmbh Robert | Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement |
US6713938B2 (en) * | 1999-01-14 | 2004-03-30 | The Regents Of The University Of Michigan | Method and apparatus for filtering signals utilizing a vibrating micromechanical resonator |
DE19930779B4 (de) * | 1999-07-03 | 2010-05-06 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
US6458615B1 (en) | 1999-09-30 | 2002-10-01 | Carnegie Mellon University | Method of fabricating micromachined structures and devices formed therefrom |
US6629448B1 (en) | 2000-02-25 | 2003-10-07 | Seagate Technology Llc | In-situ testing of a MEMS accelerometer in a disc storage system |
US6430999B2 (en) | 2000-03-30 | 2002-08-13 | Denso Corporation | Semiconductor physical quantity sensor including frame-shaped beam surrounded by groove |
JP2002005955A (ja) | 2000-06-26 | 2002-01-09 | Denso Corp | 容量式力学量センサ |
JP2003166999A (ja) | 2001-12-03 | 2003-06-13 | Denso Corp | 半導体力学量センサ |
EP2327959B1 (de) * | 2002-02-06 | 2012-09-12 | Analog Devices, Inc. | Mikromechanisches Gyroskop |
US7089792B2 (en) * | 2002-02-06 | 2006-08-15 | Analod Devices, Inc. | Micromachined apparatus utilizing box suspensions |
JP2003240798A (ja) * | 2002-02-19 | 2003-08-27 | Denso Corp | 容量式力学量センサ |
EP1596743B1 (de) * | 2003-02-20 | 2008-04-09 | Covidien AG | Bewegungsnachweisgerät zur kontrolle des elektrochirurgischen ausgangs |
US7514283B2 (en) * | 2003-03-20 | 2009-04-07 | Robert Bosch Gmbh | Method of fabricating electromechanical device having a controlled atmosphere |
JP2004286624A (ja) * | 2003-03-24 | 2004-10-14 | Denso Corp | 半導体力学量センサ |
JP2004294332A (ja) * | 2003-03-27 | 2004-10-21 | Denso Corp | 半導体力学量センサ |
US8912174B2 (en) * | 2003-04-16 | 2014-12-16 | Mylan Pharmaceuticals Inc. | Formulations and methods for treating rhinosinusitis |
US7075160B2 (en) | 2003-06-04 | 2006-07-11 | Robert Bosch Gmbh | Microelectromechanical systems and devices having thin film encapsulated mechanical structures |
US6936491B2 (en) | 2003-06-04 | 2005-08-30 | Robert Bosch Gmbh | Method of fabricating microelectromechanical systems and devices having trench isolated contacts |
US6952041B2 (en) * | 2003-07-25 | 2005-10-04 | Robert Bosch Gmbh | Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same |
US7013730B2 (en) * | 2003-12-15 | 2006-03-21 | Honeywell International, Inc. | Internally shock caged serpentine flexure for micro-machined accelerometer |
US7068125B2 (en) * | 2004-03-04 | 2006-06-27 | Robert Bosch Gmbh | Temperature controlled MEMS resonator and method for controlling resonator frequency |
CN1954193B (zh) * | 2004-04-14 | 2010-09-01 | 模拟设备公司 | 用于惯性传感器的耦合设备 |
US7102467B2 (en) * | 2004-04-28 | 2006-09-05 | Robert Bosch Gmbh | Method for adjusting the frequency of a MEMS resonator |
US20060013551A1 (en) * | 2004-06-08 | 2006-01-19 | Foresi James S | Symmetrization structures for process-tolerant integrated optical components |
US7093478B2 (en) * | 2004-07-08 | 2006-08-22 | Analog Devices, Inc. | Method for calibrating accelerometer sensitivity |
US7478557B2 (en) * | 2004-10-01 | 2009-01-20 | Analog Devices, Inc. | Common centroid micromachine driver |
US7421897B2 (en) | 2005-04-14 | 2008-09-09 | Analog Devices, Inc. | Cross-quad and vertically coupled inertial sensors |
US20070170528A1 (en) | 2006-01-20 | 2007-07-26 | Aaron Partridge | Wafer encapsulated microelectromechanical structure and method of manufacturing same |
US7616077B1 (en) * | 2007-03-22 | 2009-11-10 | Sandia Corporation | Microelectromechanical resonator and method for fabrication |
DE102007051871A1 (de) * | 2007-10-30 | 2009-05-07 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zum Betrieb eines mikromechanischen Bauelements |
US20110113880A1 (en) * | 2008-05-15 | 2011-05-19 | Continental Teves Ag & Co. Ohg | Micromechanical acceleration sensor |
US8371167B2 (en) * | 2008-07-29 | 2013-02-12 | Pixart Imaging Inc. | In-plane sensor, out-of-plane sensor, and method for making same |
US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
JP5646492B2 (ja) | 2008-10-07 | 2014-12-24 | エムシー10 インコーポレイテッドMc10,Inc. | 伸縮可能な集積回路およびセンサアレイを有する装置 |
US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
DE102009047018B4 (de) * | 2009-11-23 | 2023-02-09 | Robert Bosch Gmbh | Verfahren zum Abgleich eines Beschleunigungssensors und Beschleunigungssensor |
US8424383B2 (en) * | 2010-01-05 | 2013-04-23 | Pixart Imaging Incorporation | Mass for use in a micro-electro-mechanical-system sensor and 3-dimensional micro-electro-mechanical-system sensor using same |
JP5750867B2 (ja) * | 2010-11-04 | 2015-07-22 | セイコーエプソン株式会社 | 機能素子、機能素子の製造方法、物理量センサーおよび電子機器 |
KR102000302B1 (ko) | 2011-05-27 | 2019-07-15 | 엠씨10, 인크 | 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법 |
TWI467179B (zh) | 2011-12-02 | 2015-01-01 | Pixart Imaging Inc | 三維微機電感測器 |
US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
WO2014007871A1 (en) | 2012-07-05 | 2014-01-09 | Mc10, Inc. | Catheter device including flow sensing |
JP2016500869A (ja) | 2012-10-09 | 2016-01-14 | エムシー10 インコーポレイテッドMc10,Inc. | 衣類と一体化されたコンフォーマル電子回路 |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
DE102012222973B4 (de) * | 2012-12-12 | 2024-02-22 | Robert Bosch Gmbh | Mikromechanisches Elektrofeldmeter als Gewitterwarner |
US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
CA2920485A1 (en) | 2013-08-05 | 2015-02-12 | Mc10, Inc. | Flexible temperature sensor including conformable electronics |
CA2925387A1 (en) | 2013-10-07 | 2015-04-16 | Mc10, Inc. | Conformal sensor systems for sensing and analysis |
KR102365120B1 (ko) | 2013-11-22 | 2022-02-18 | 메디데이타 솔루션즈, 인코포레이티드 | 심장 활동 감지 및 분석용 등각 센서 시스템 |
EP3092661A4 (de) | 2014-01-06 | 2017-09-27 | Mc10, Inc. | Verkapselte elektronische konforme systeme und vorrichtungen sowie verfahren zur herstellung und verwendung davon |
KR20160129007A (ko) | 2014-03-04 | 2016-11-08 | 엠씨10, 인크 | 전자 디바이스를 위한 다부분 유연성 봉지 하우징 |
US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
US10297572B2 (en) | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
EP3258837A4 (de) | 2015-02-20 | 2018-10-10 | Mc10, Inc. | Automatische erkennung und konfiguration von am körper tragbaren vorrichtungen auf basis von status, position und/oder ausrichtung am körper |
WO2016140961A1 (en) | 2015-03-02 | 2016-09-09 | Mc10, Inc. | Perspiration sensor |
WO2017015000A1 (en) | 2015-07-17 | 2017-01-26 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
WO2017031129A1 (en) | 2015-08-19 | 2017-02-23 | Mc10, Inc. | Wearable heat flux devices and methods of use |
WO2017059215A1 (en) | 2015-10-01 | 2017-04-06 | Mc10, Inc. | Method and system for interacting with a virtual environment |
US10532211B2 (en) | 2015-10-05 | 2020-01-14 | Mc10, Inc. | Method and system for neuromodulation and stimulation |
CN108781313B (zh) | 2016-02-22 | 2022-04-08 | 美谛达解决方案公司 | 用以贴身获取传感器信息的耦接的集线器和传感器节点的系统、装置和方法 |
WO2017147052A1 (en) | 2016-02-22 | 2017-08-31 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
US11154235B2 (en) | 2016-04-19 | 2021-10-26 | Medidata Solutions, Inc. | Method and system for measuring perspiration |
US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
US11275099B1 (en) * | 2018-07-20 | 2022-03-15 | Hrl Laboratories, Llc | Navigational grade resonant MicroElectroMechanical Systems (mems) accelerometer and method of operation |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69113632T2 (de) * | 1990-08-17 | 1996-03-21 | Analog Devices Inc | Monolithischer beschleunigungsmesser. |
GB9205711D0 (en) * | 1992-03-16 | 1992-04-29 | Lynxvale Ltd | Micromechanical sensor |
US5286944A (en) * | 1992-03-25 | 1994-02-15 | Panasonic Technologies, Inc. | Method of manufacturing a multiple microelectrode assembly |
FR2700012B1 (fr) * | 1992-12-28 | 1995-03-03 | Commissariat Energie Atomique | Accéléromètre intégré à axe sensible parallèle au substrat. |
EP0618450A1 (de) * | 1993-03-30 | 1994-10-05 | Siemens Aktiengesellschaft | Beschleunigungssensor |
US5563343A (en) * | 1993-05-26 | 1996-10-08 | Cornell Research Foundation, Inc. | Microelectromechanical lateral accelerometer |
US5364497A (en) * | 1993-08-04 | 1994-11-15 | Analog Devices, Inc. | Method for fabricating microstructures using temporary bridges |
US5447068A (en) * | 1994-03-31 | 1995-09-05 | Ford Motor Company | Digital capacitive accelerometer |
DE4431338C2 (de) * | 1994-09-02 | 2003-07-31 | Bosch Gmbh Robert | Beschleunigungssensor |
DE4431478B4 (de) * | 1994-09-03 | 2006-04-13 | Robert Bosch Gmbh | Aufhängung für mikromechanische Struktur und mikromechanischer Beschleunigungssensor |
DE4432837B4 (de) * | 1994-09-15 | 2004-05-13 | Robert Bosch Gmbh | Beschleunigungssensor und Meßverfahren |
US5542295A (en) * | 1994-12-01 | 1996-08-06 | Analog Devices, Inc. | Apparatus to minimize stiction in micromachined structures |
US5565625A (en) * | 1994-12-01 | 1996-10-15 | Analog Devices, Inc. | Sensor with separate actuator and sense fingers |
US5511420A (en) * | 1994-12-01 | 1996-04-30 | Analog Devices, Inc. | Electric field attraction minimization circuit |
US5635638A (en) * | 1995-06-06 | 1997-06-03 | Analog Devices, Inc. | Coupling for multiple masses in a micromachined device |
-
1996
- 1996-03-15 US US08/616,713 patent/US5880369A/en not_active Expired - Lifetime
-
1997
- 1997-03-14 DE DE69732178T patent/DE69732178T2/de not_active Expired - Lifetime
- 1997-03-14 EP EP97909047A patent/EP0886781B1/de not_active Expired - Lifetime
- 1997-03-14 WO PCT/US1997/004231 patent/WO1997034153A1/en active IP Right Grant
-
1998
- 1998-06-16 US US09/097,839 patent/US6282960B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5880369A (en) | 1999-03-09 |
EP0886781B1 (de) | 2005-01-05 |
EP0886781A1 (de) | 1998-12-30 |
WO1997034153A1 (en) | 1997-09-18 |
DE69732178T2 (de) | 2005-06-23 |
US6282960B1 (en) | 2001-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |