DE69731713D1 - Prüfadaptermodul, das den Zugang zu einer Vorrichtung mit gitterförmig angeordneten Kügelchen (BGA) ermöglicht, ein derartiges Prüfadaptermodul enthaltendes System und Verwendung des Prüfadaptermoduls - Google Patents

Prüfadaptermodul, das den Zugang zu einer Vorrichtung mit gitterförmig angeordneten Kügelchen (BGA) ermöglicht, ein derartiges Prüfadaptermodul enthaltendes System und Verwendung des Prüfadaptermoduls

Info

Publication number
DE69731713D1
DE69731713D1 DE69731713T DE69731713T DE69731713D1 DE 69731713 D1 DE69731713 D1 DE 69731713D1 DE 69731713 T DE69731713 T DE 69731713T DE 69731713 T DE69731713 T DE 69731713T DE 69731713 D1 DE69731713 D1 DE 69731713D1
Authority
DE
Germany
Prior art keywords
adapter module
test adapter
bga
grid
system containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69731713T
Other languages
English (en)
Other versions
DE69731713T2 (de
Inventor
Terrel L Morris
Douglas S Ondricek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69731713D1 publication Critical patent/DE69731713D1/de
Application granted granted Critical
Publication of DE69731713T2 publication Critical patent/DE69731713T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69731713T 1996-11-12 1997-09-10 Prüfadaptermodul, das den Zugang zu einer Vorrichtung mit gitterförmig angeordneten Kügelchen (BGA) ermöglicht, ein derartiges Prüfadaptermodul enthaltendes System und Verwendung des Prüfadaptermoduls Expired - Fee Related DE69731713T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/745,531 US6020749A (en) 1996-11-12 1996-11-12 Method and apparatus for performing testing of double-sided ball grid array devices
US745531 1996-11-12

Publications (2)

Publication Number Publication Date
DE69731713D1 true DE69731713D1 (de) 2004-12-30
DE69731713T2 DE69731713T2 (de) 2005-10-06

Family

ID=24997079

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69731713T Expired - Fee Related DE69731713T2 (de) 1996-11-12 1997-09-10 Prüfadaptermodul, das den Zugang zu einer Vorrichtung mit gitterförmig angeordneten Kügelchen (BGA) ermöglicht, ein derartiges Prüfadaptermodul enthaltendes System und Verwendung des Prüfadaptermoduls

Country Status (4)

Country Link
US (1) US6020749A (de)
EP (1) EP0841573B1 (de)
JP (1) JPH10153644A (de)
DE (1) DE69731713T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535005B1 (en) * 2000-04-26 2003-03-18 Emc Corporation Systems and methods for obtaining an electrical characteristics of a circuit board assembly process
NO315017B1 (no) * 2000-06-09 2003-06-23 Idex Asa Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
NO315016B1 (no) * 2000-06-09 2003-06-23 Idex Asa Miniatyrisert sensor
US6884653B2 (en) * 2001-03-21 2005-04-26 Micron Technology, Inc. Folded interposer
US6812485B2 (en) * 2001-12-28 2004-11-02 Hewlett-Packard Development Company, L.P. Dual interposer packaging for high density interconnect
US6888360B1 (en) * 2004-02-20 2005-05-03 Research In Motion Limited Surface mount technology evaluation board having varied board pad characteristics
NO20093601A1 (no) 2009-12-29 2011-06-30 Idex Asa Overflatesensor
US20140055159A1 (en) * 2012-02-21 2014-02-27 Nexus Technology Interposer with Edge Probe Points
US9460993B2 (en) * 2012-02-21 2016-10-04 Robert C. Shelsky Interposer with signal-conditioned edge probe points
NO20131423A1 (no) 2013-02-22 2014-08-25 Idex Asa Integrert fingeravtrykksensor
KR102255740B1 (ko) 2014-02-21 2021-05-26 이덱스 바이오메트릭스 아사 중첩된 그리드 라인을 이용하는 센서 및 그리드 라인으로부터 감지면을 확장하기 위한 전도성 프로브

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930001365A (ko) * 1991-03-27 1993-01-16 빈센트 죠셉 로너 복합 플립 칩 반도체 소자와 그 제조 및 번-인(burning-in) 방법
US5315241A (en) * 1991-09-18 1994-05-24 Sgs-Thomson Microelectronics, Inc. Method for testing integrated circuits
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
JPH07333300A (ja) * 1994-06-14 1995-12-22 Mitsubishi Electric Corp 電気特性評価用基板
JP3260253B2 (ja) * 1995-01-06 2002-02-25 松下電器産業株式会社 半導体装置の検査方法と検査用導電性接着剤
US5716222A (en) * 1995-11-03 1998-02-10 Advanced Interconnections Corporation Ball grid array including modified hard ball contacts and apparatus for attaching hard ball contacts to a ball grid array
US5731709A (en) * 1996-01-26 1998-03-24 Motorola, Inc. Method for testing a ball grid array semiconductor device and a device for such testing

Also Published As

Publication number Publication date
JPH10153644A (ja) 1998-06-09
EP0841573B1 (de) 2004-11-24
EP0841573A2 (de) 1998-05-13
US6020749A (en) 2000-02-01
DE69731713T2 (de) 2005-10-06
EP0841573A3 (de) 1998-07-01

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee