DE69726532D1 - Klebstoffharzzusammensetzung und Klebstofffolie - Google Patents

Klebstoffharzzusammensetzung und Klebstofffolie

Info

Publication number
DE69726532D1
DE69726532D1 DE69726532T DE69726532T DE69726532D1 DE 69726532 D1 DE69726532 D1 DE 69726532D1 DE 69726532 T DE69726532 T DE 69726532T DE 69726532 T DE69726532 T DE 69726532T DE 69726532 D1 DE69726532 D1 DE 69726532D1
Authority
DE
Germany
Prior art keywords
adhesive
resin composition
film
adhesive film
adhesive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69726532T
Other languages
English (en)
Other versions
DE69726532T2 (de
Inventor
Amane Mochizuki
Michie Sakamoto
Masahiro Yoshioka
Yuji Hotta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE69726532D1 publication Critical patent/DE69726532D1/de
Application granted granted Critical
Publication of DE69726532T2 publication Critical patent/DE69726532T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/773—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur halogens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/02—Polymeric products of isocyanates or isothiocyanates of isocyanates or isothiocyanates only
    • C08G18/025—Polymeric products of isocyanates or isothiocyanates of isocyanates or isothiocyanates only the polymeric products containing carbodiimide groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69726532T 1996-09-26 1997-09-23 Klebstoffharzzusammensetzung und Klebstofffolie Expired - Fee Related DE69726532T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27721296 1996-09-26
JP27721296 1996-09-26

Publications (2)

Publication Number Publication Date
DE69726532D1 true DE69726532D1 (de) 2004-01-15
DE69726532T2 DE69726532T2 (de) 2004-06-03

Family

ID=17580380

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69726532T Expired - Fee Related DE69726532T2 (de) 1996-09-26 1997-09-23 Klebstoffharzzusammensetzung und Klebstofffolie

Country Status (5)

Country Link
US (1) US5830949A (de)
EP (1) EP0832907B1 (de)
KR (1) KR100306519B1 (de)
CN (1) CN1091776C (de)
DE (1) DE69726532T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10214925A (ja) * 1996-11-28 1998-08-11 Nitto Denko Corp 半導体素子封止用封止ラベル
JPH10279799A (ja) * 1997-04-04 1998-10-20 Nitto Denko Corp 熱硬化性樹脂組成物
US6180261B1 (en) * 1997-10-21 2001-01-30 Nitto Denko Corporation Low thermal expansion circuit board and multilayer wiring circuit board
CN1117133C (zh) * 1999-09-21 2003-08-06 中国科学院化学研究所 一种可溶性聚酰亚胺涂层胶及其制备方法和用途
US20040131844A1 (en) * 2001-05-08 2004-07-08 Kotaro Shinozaki Sealant composition, sealant and laminated structure containing same
EP2484739A1 (de) * 2009-09-30 2012-08-08 Sumitomo Bakelite Company Limited Leitfähiges verbindungsmaterial, verfahren zur verbindung zwischen endgeräten und verfahren zur herstellung eines verbindungsendgerätes
KR101578968B1 (ko) * 2009-10-28 2015-12-18 스미또모 베이크라이트 가부시키가이샤 도전 접속 재료 및 그것을 사용한 단자 사이의 접속 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2624198C2 (de) * 1976-05-29 1984-10-04 Bayer Ag, 5090 Leverkusen Polymerisationsprodukte
DE2847481A1 (de) * 1978-11-02 1980-05-14 Bayer Ag Verfahren zur herstellung von zu elastomeren haertbaren organosiloxanmassen mit vermindertem druckverformungsrest
US4412884A (en) * 1981-06-12 1983-11-01 United Technologies Corporation Adhesive bonding method employing diene bis-imide polymers
DE69110088T2 (de) * 1990-06-01 1995-10-19 Nisshin Spinning Hitzebeständiger Klebstoff und diesen anwendendes Klebeverfahren.
JPH04342713A (ja) * 1991-05-20 1992-11-30 Nippon Paint Co Ltd 硬化性組成物
JPH07286140A (ja) * 1994-04-18 1995-10-31 Maruzen Petrochem Co Ltd 長期耐熱性接着剤および耐沸騰水性コーティング剤
US5502207A (en) * 1993-08-13 1996-03-26 Maruzen Petrochemical Co., Ltd. Alkenyl-substituted bisnadimides, process for manufacturing the same, process for curing the same, and adhesives and coating materials utilizing the same

Also Published As

Publication number Publication date
KR100306519B1 (ko) 2001-11-30
EP0832907B1 (de) 2003-12-03
EP0832907A1 (de) 1998-04-01
DE69726532T2 (de) 2004-06-03
CN1179445A (zh) 1998-04-22
KR19980024931A (ko) 1998-07-06
CN1091776C (zh) 2002-10-02
US5830949A (en) 1998-11-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee