DE69611775D1 - Klebstoffzusammensetzung und Klebeschicht - Google Patents

Klebstoffzusammensetzung und Klebeschicht

Info

Publication number
DE69611775D1
DE69611775D1 DE69611775T DE69611775T DE69611775D1 DE 69611775 D1 DE69611775 D1 DE 69611775D1 DE 69611775 T DE69611775 T DE 69611775T DE 69611775 T DE69611775 T DE 69611775T DE 69611775 D1 DE69611775 D1 DE 69611775D1
Authority
DE
Germany
Prior art keywords
adhesive
composition
adhesive layer
layer
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69611775T
Other languages
English (en)
Other versions
DE69611775T2 (de
Inventor
Hideo Senoo
Takashi Sugino
Shinji Murai
Yoshihiko Nakano
Shuji Hayase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of DE69611775D1 publication Critical patent/DE69611775D1/de
Publication of DE69611775T2 publication Critical patent/DE69611775T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
DE69611775T 1995-11-22 1996-11-21 Klebstoffzusammensetzung und Klebeschicht Expired - Fee Related DE69611775T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30459795 1995-11-22

Publications (2)

Publication Number Publication Date
DE69611775D1 true DE69611775D1 (de) 2001-03-22
DE69611775T2 DE69611775T2 (de) 2001-09-13

Family

ID=17934926

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69611775T Expired - Fee Related DE69611775T2 (de) 1995-11-22 1996-11-21 Klebstoffzusammensetzung und Klebeschicht

Country Status (4)

Country Link
EP (1) EP0775715B1 (de)
KR (1) KR970027254A (de)
CN (1) CN1157310A (de)
DE (1) DE69611775T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6437090B1 (en) 1998-06-17 2002-08-20 Kabushiki Kaisha Toshiba Curing catalyst, resin composition, resin-sealed semiconductor device and coating material
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
JP4409014B2 (ja) 1999-11-30 2010-02-03 リンテック株式会社 半導体装置の製造方法
US6358354B1 (en) 2000-07-05 2002-03-19 Lexmark International, Inc. UV and thermally curable adhesive formulation
DE10050315C2 (de) 2000-10-10 2003-08-21 Uhde Gmbh Verfahren zur Auflösung von Salzen in 1,2-Dichlorethan mittels Ultraschall und Vorrichtung zur Durchführung des Verfahrens
US6425655B1 (en) 2001-06-05 2002-07-30 Lexmark International, Inc. Dual curable encapsulating material
JP6384234B2 (ja) * 2014-09-25 2018-09-05 デクセリアルズ株式会社 ラジカル重合型接着剤組成物、及び電気接続体の製造方法
CN110358463A (zh) * 2019-06-18 2019-10-22 宁波激智科技股份有限公司 一种高断裂韧性的漆面保护膜及其应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5464533A (en) * 1977-11-02 1979-05-24 Kansai Paint Co Ltd Aqueous corrosion-resistant coating composition
US4238587A (en) * 1979-11-28 1980-12-09 General Electric Company Heat curable compositions
DE3135636A1 (de) * 1981-09-09 1983-03-17 Basf Ag, 6700 Ludwigshafen Haertbare epoxidharze
JPH0616524B2 (ja) * 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板
JPS60223139A (ja) 1984-04-18 1985-11-07 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板

Also Published As

Publication number Publication date
EP0775715A3 (de) 1998-05-20
DE69611775T2 (de) 2001-09-13
CN1157310A (zh) 1997-08-20
EP0775715B1 (de) 2001-02-14
EP0775715A2 (de) 1997-05-28
KR970027254A (ko) 1997-06-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee