DE69721881D1 - Wire saw and method for cutting a cylindrical workpiece such as an ingot - Google Patents
Wire saw and method for cutting a cylindrical workpiece such as an ingotInfo
- Publication number
- DE69721881D1 DE69721881D1 DE69721881T DE69721881T DE69721881D1 DE 69721881 D1 DE69721881 D1 DE 69721881D1 DE 69721881 T DE69721881 T DE 69721881T DE 69721881 T DE69721881 T DE 69721881T DE 69721881 D1 DE69721881 D1 DE 69721881D1
- Authority
- DE
- Germany
- Prior art keywords
- ingot
- cutting
- wire saw
- cylindrical workpiece
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9616496 | 1996-03-26 | ||
JP9616496A JP3810125B2 (en) | 1996-03-26 | 1996-03-26 | Method for cutting wire saw and cylindrical workpiece |
JP9616596A JP3202591B2 (en) | 1996-03-26 | 1996-03-26 | How to cut wire saws and cylindrical workpieces |
JP9616596 | 1996-03-26 | ||
JP9616396A JP3202590B2 (en) | 1996-03-26 | 1996-03-26 | How to cut wire saws and cylindrical workpieces |
JP9616396 | 1996-03-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69721881D1 true DE69721881D1 (en) | 2003-06-18 |
DE69721881T2 DE69721881T2 (en) | 2004-05-19 |
Family
ID=27308018
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69734790T Expired - Lifetime DE69734790T2 (en) | 1996-03-26 | 1997-03-26 | Wire saw and method for cutting a cylindrical workpiece |
DE69721881T Expired - Lifetime DE69721881T2 (en) | 1996-03-26 | 1997-03-26 | Wire saw and method for cutting a cylindrical workpiece, such as an ingot |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69734790T Expired - Lifetime DE69734790T2 (en) | 1996-03-26 | 1997-03-26 | Wire saw and method for cutting a cylindrical workpiece |
Country Status (5)
Country | Link |
---|---|
US (1) | US5937844A (en) |
EP (2) | EP0798091B1 (en) |
DE (2) | DE69734790T2 (en) |
MY (1) | MY120514A (en) |
TW (1) | TW330884B (en) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW383249B (en) * | 1998-09-01 | 2000-03-01 | Sumitomo Spec Metals | Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board |
DE19859291A1 (en) * | 1998-12-22 | 2000-06-29 | Bayer Solar Gmbh | Process for controlling a sawing process |
JP4066112B2 (en) * | 1999-01-28 | 2008-03-26 | 株式会社スーパーシリコン研究所 | Wire saw control method and wire saw |
US6112738A (en) * | 1999-04-02 | 2000-09-05 | Memc Electronics Materials, Inc. | Method of slicing silicon wafers for laser marking |
JP3389141B2 (en) * | 1999-04-26 | 2003-03-24 | 株式会社スーパーシリコン研究所 | Evaluation method of slurry for slicing and slurry |
CN1175961C (en) * | 1999-09-17 | 2004-11-17 | 株式会社新王磁材 | Method and device for cutting rare-earth alloy |
MY126994A (en) | 1999-12-14 | 2006-11-30 | Hitachi Metals Ltd | Method and apparatus for cutting a rare earth alloy |
AU2000251024A1 (en) | 2000-05-31 | 2001-12-11 | Memc Electronic Materials S.P.A. | Wire saw and process for slicing multiple semiconductor ingots |
US6889684B2 (en) * | 2002-11-06 | 2005-05-10 | Seh America, Inc. | Apparatus, system and method for cutting a crystal ingot |
CH696431A5 (en) * | 2003-04-01 | 2007-06-15 | Hct Shaping Systems Sa | Process and wire sawing device. |
DE102005007312B4 (en) * | 2004-04-29 | 2006-07-27 | Siltronic Ag | Process to cut slices of semiconductor wafer material from a cylindrical block with regulated spray application of slurry |
KR100667690B1 (en) * | 2004-11-23 | 2007-01-12 | 주식회사 실트론 | Method and machine for slicing wafers |
JP4951914B2 (en) * | 2005-09-28 | 2012-06-13 | 信越半導体株式会社 | (110) Silicon wafer manufacturing method |
DE102006032432B3 (en) | 2006-07-13 | 2007-09-27 | Siltronic Ag | Saw member for use in combustion engines provides improved power control |
DE102006050330B4 (en) * | 2006-10-25 | 2009-10-22 | Siltronic Ag | A method for simultaneously separating at least two cylindrical workpieces into a plurality of slices |
FR2927272B1 (en) * | 2008-02-07 | 2010-05-21 | Saint Gobain Ct Recherches | ABRASIVE GRAIN POWDER. |
SG172286A1 (en) * | 2008-12-20 | 2011-07-28 | Cabot Microelectronics Corp | Wiresaw cutting method |
FR2947831B1 (en) | 2009-07-09 | 2012-02-03 | Saint Gobain Ct Recherches | SUSPENSION OF ABRASIVE GRAINS |
JP5515593B2 (en) * | 2009-10-07 | 2014-06-11 | 株式会社Sumco | Method for cutting silicon ingot with wire saw and wire saw |
GB2476658A (en) * | 2009-12-30 | 2011-07-06 | Rec Wafer Norway As | Process for cutting a block using a planar array of wires |
CN102892539B (en) * | 2010-05-18 | 2014-11-12 | 三菱电机株式会社 | Wire electric discharge machining device and thin-plate manufacturing method |
CN101973081B (en) * | 2010-07-28 | 2012-07-18 | 常州天合光能有限公司 | Method for cutting head other than tail of 8-inch polycrystalline block by MB wire saw |
DE102012201938B4 (en) | 2012-02-09 | 2015-03-05 | Siltronic Ag | A method of simultaneously separating a plurality of slices from a workpiece |
DE102012203275A1 (en) | 2012-03-01 | 2013-09-05 | Siltronic Ag | Apparatus and method for simultaneously separating a plurality of slices from a workpiece |
DE102012209974B4 (en) * | 2012-06-14 | 2018-02-15 | Siltronic Ag | A method of simultaneously separating a plurality of slices from a cylindrical workpiece |
JP6015598B2 (en) * | 2013-08-28 | 2016-10-26 | 信越半導体株式会社 | Ingot cutting method and wire saw |
DE102013219468B4 (en) * | 2013-09-26 | 2015-04-23 | Siltronic Ag | A method of simultaneously separating a plurality of slices from a workpiece |
DE102014208187B4 (en) * | 2014-04-30 | 2023-07-06 | Siltronic Ag | Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece |
CN108162213A (en) * | 2017-12-07 | 2018-06-15 | 上海申和热磁电子有限公司 | A kind of method for reducing silicon warp when Multi-wire wafer is cut |
CN109571218A (en) * | 2018-12-21 | 2019-04-05 | 西安奕斯伟硅片技术有限公司 | Grinding agent sprays control structure, work piece cut system and spraying method |
US20220134600A1 (en) * | 2019-07-24 | 2022-05-05 | Xuzhou Xinjing Semiconductor Technology Co., Ltd. | Method for cutting silicon rod and apparatus for dimaond multi-wire cutting |
CN110466085B (en) * | 2019-07-24 | 2021-02-05 | 徐州鑫晶半导体科技有限公司 | Method for cutting silicon rod |
CN114571617B (en) * | 2022-03-24 | 2022-09-16 | 广东高景太阳能科技有限公司 | Mortar injection control method and control system in silicon wafer cutting |
CN114633387A (en) * | 2022-04-06 | 2022-06-17 | 广东高景太阳能科技有限公司 | Device and method for preventing wire hanging in large-size silicon wafer material lifting process |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3599623A (en) * | 1969-09-02 | 1971-08-17 | Fairchild Camera Instr Co | Cutting apparatus for making finely controlled cuts utilizing a tiltable wheel for regulating the cutting blade movement |
US3831576A (en) * | 1971-11-22 | 1974-08-27 | Motorola Inc | Machine and method for cutting brittle materials using a reciprocating cutting wire |
US3841297A (en) * | 1971-12-01 | 1974-10-15 | Motorola Inc | Machine for cutting brittle materials |
US4038962A (en) * | 1976-08-25 | 1977-08-02 | Coggins Industries, Inc. | Automatic power controller for a wire saw |
JPS5741118A (en) * | 1980-08-22 | 1982-03-08 | Sumitomo Electric Ind Ltd | Cutting of work |
JPH0777696B2 (en) * | 1985-11-22 | 1995-08-23 | 株式会社井上ジャパックス研究所 | Wire cut electrical discharge machine |
JPS6478802A (en) * | 1987-09-19 | 1989-03-24 | Daiwa Kikai Seisakusho | Cutting of high-hardness brittle material cutting machine utilizing diamond wire saw |
JP2673544B2 (en) * | 1988-06-14 | 1997-11-05 | 株式会社日平トヤマ | Cutting method for brittle materials |
IT1236877B (en) * | 1989-11-22 | 1993-04-26 | PERFECTED FRAME FOR THE SEGMENT OF SLABS OF STONE MATERIAL IN SHEETS. | |
JP2516717B2 (en) * | 1991-11-29 | 1996-07-24 | 信越半導体株式会社 | Wire saw and its cutting method |
JP2967896B2 (en) * | 1993-06-18 | 1999-10-25 | 信越化学工業株式会社 | Wafer manufacturing method |
JP3283113B2 (en) * | 1993-08-19 | 2002-05-20 | 信越化学工業株式会社 | Wafer manufacturing method |
DE19510625A1 (en) * | 1995-03-23 | 1996-09-26 | Wacker Siltronic Halbleitermat | Wire saw and method for cutting slices from a workpiece |
US5564409A (en) * | 1995-06-06 | 1996-10-15 | Corning Incorporated | Apparatus and method for wire cutting glass-ceramic wafers |
JPH0985736A (en) * | 1995-09-22 | 1997-03-31 | Toray Eng Co Ltd | Wire type cutting device |
-
1997
- 1997-03-24 MY MYPI97001229A patent/MY120514A/en unknown
- 1997-03-24 US US08/823,208 patent/US5937844A/en not_active Expired - Lifetime
- 1997-03-24 TW TW086103678A patent/TW330884B/en not_active IP Right Cessation
- 1997-03-26 DE DE69734790T patent/DE69734790T2/en not_active Expired - Lifetime
- 1997-03-26 DE DE69721881T patent/DE69721881T2/en not_active Expired - Lifetime
- 1997-03-26 EP EP97302064A patent/EP0798091B1/en not_active Expired - Lifetime
- 1997-03-26 EP EP03019947A patent/EP1371467B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0798091A2 (en) | 1997-10-01 |
DE69721881T2 (en) | 2004-05-19 |
TW330884B (en) | 1998-05-01 |
MY120514A (en) | 2005-11-30 |
DE69734790D1 (en) | 2006-01-05 |
EP1371467A1 (en) | 2003-12-17 |
EP0798091A3 (en) | 1998-08-19 |
DE69734790T2 (en) | 2006-08-17 |
EP1371467B1 (en) | 2005-11-30 |
US5937844A (en) | 1999-08-17 |
EP0798091B1 (en) | 2003-05-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |