DE69721309T2 - Verminderung der bildung von hohlräumen in härtbaren klebstoffzusammensetzungen - Google Patents

Verminderung der bildung von hohlräumen in härtbaren klebstoffzusammensetzungen Download PDF

Info

Publication number
DE69721309T2
DE69721309T2 DE69721309T DE69721309T DE69721309T2 DE 69721309 T2 DE69721309 T2 DE 69721309T2 DE 69721309 T DE69721309 T DE 69721309T DE 69721309 T DE69721309 T DE 69721309T DE 69721309 T2 DE69721309 T2 DE 69721309T2
Authority
DE
Germany
Prior art keywords
reduction
curable adhesive
adhesive compositions
cavity formation
accordance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69721309T
Other languages
English (en)
Other versions
DE69721309D1 (de
DE69721309T9 (de
Inventor
Derfelt Forray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantum Materials Inc
Original Assignee
Quantum Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Materials Inc filed Critical Quantum Materials Inc
Publication of DE69721309D1 publication Critical patent/DE69721309D1/de
Publication of DE69721309T2 publication Critical patent/DE69721309T2/de
Application granted granted Critical
Publication of DE69721309T9 publication Critical patent/DE69721309T9/de
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69721309T 1997-01-06 1997-12-29 Verminderung der bildung von hohlräumen in härtbaren klebstoffzusammensetzungen Expired - Fee Related DE69721309T9 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US78199597A 1997-01-06 1997-01-06
US781995 1997-01-06
PCT/US1997/024188 WO1998030647A1 (en) 1997-01-06 1997-12-29 Reducing void formation in curable adhesive formulations

Publications (3)

Publication Number Publication Date
DE69721309D1 DE69721309D1 (de) 2003-05-28
DE69721309T2 true DE69721309T2 (de) 2004-01-29
DE69721309T9 DE69721309T9 (de) 2005-03-10

Family

ID=25124596

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69721309T Expired - Fee Related DE69721309T9 (de) 1997-01-06 1997-12-29 Verminderung der bildung von hohlräumen in härtbaren klebstoffzusammensetzungen

Country Status (12)

Country Link
US (1) US20020062923A1 (de)
EP (1) EP0950082B1 (de)
JP (1) JP2001508483A (de)
KR (1) KR20000069904A (de)
CN (1) CN1105160C (de)
AT (1) ATE238397T1 (de)
AU (1) AU5623798A (de)
CA (1) CA2276737A1 (de)
DE (1) DE69721309T9 (de)
MY (1) MY132841A (de)
TW (1) TW565601B (de)
WO (1) WO1998030647A1 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784024B2 (en) * 2000-01-18 2004-08-31 Micron Technology, Inc. Die attach curing method for semiconductor device
US20050288457A1 (en) * 2002-10-22 2005-12-29 Puwei Liu Co-curable compositions
US8513375B2 (en) * 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US7884174B2 (en) * 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
US7795362B2 (en) * 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
US8043534B2 (en) * 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) * 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US8287686B2 (en) * 2006-07-24 2012-10-16 Designer Molecules, Inc. Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
US7825188B2 (en) * 2006-12-19 2010-11-02 Designer Molecules, Inc. Thermoplastic elastomer with acyloxyphenyl hard block segment
WO2008077140A2 (en) * 2006-12-19 2008-06-26 Designer Molecules, Inc. Hydrolytically resistant thermoset monomers
WO2008092168A2 (en) * 2007-01-26 2008-07-31 Designer Molecules, Inc. Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
WO2008124797A1 (en) * 2007-04-09 2008-10-16 Designer Molecules, Inc. Curatives for epoxy compositions
US8039663B2 (en) * 2007-04-09 2011-10-18 Designer Molecules, Inc. Monomers derived from pentacyclopentadecane dimethanol
US8431655B2 (en) * 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
WO2008128209A1 (en) * 2007-04-12 2008-10-23 Designer Molecules, Inc. Polyfunctional epoxy oligomers
WO2008130894A1 (en) * 2007-04-16 2008-10-30 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US7928153B2 (en) 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
US8398898B2 (en) * 2008-02-23 2013-03-19 Designer Molecules, Inc. Soluble metal salts for use as conductivity promoters
US8541531B2 (en) * 2008-03-21 2013-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8217120B2 (en) * 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US8013104B2 (en) * 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8008419B2 (en) * 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8158748B2 (en) * 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US8288591B2 (en) * 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
US8415812B2 (en) * 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties
TWI509631B (zh) * 2011-02-25 2015-11-21 Henkel IP & Holding GmbH 用於電子裝置之可燒結銀薄片黏著劑
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
KR102008354B1 (ko) * 2013-02-01 2019-08-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 감압 접착제 조성물 및 이를 포함하는 접착 물품
CN107709418B (zh) 2015-05-08 2021-04-27 汉高知识产权控股有限责任公司 可烧结的膜和膏及其使用方法
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1155973A (en) * 1965-06-26 1969-06-25 Ajinomoto Kk Spiroacetal Diamine Derivatives and their use as Curing Agents for Epoxy Resins
JPS55127098A (en) * 1979-03-09 1980-10-01 Matsushita Electric Ind Co Ltd Method of mounting electronic part
GB2179001A (en) * 1985-08-16 1987-02-25 Burr Brown Corp Method of bonding using paste or non-dry film adhesives
US4714726A (en) * 1986-06-04 1987-12-22 W. R. Grace & Co. Low temperature single step curing polyimide adhesive
DE3806738C1 (de) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
EP0508951B1 (de) * 1991-04-08 1996-08-21 Ciba-Geigy Ag Thermisch härtbare Zusammensetzungen
US5391604A (en) * 1993-07-30 1995-02-21 Diemat, Inc. Adhesive paste containing polymeric resin
GB9318872D0 (en) * 1993-09-11 1993-10-27 Unisersity Fo Leeds The Polymer resin
US5644837A (en) * 1995-06-30 1997-07-08 Lambda Technologies, Inc. Process for assembling electronics using microwave irradiation

Also Published As

Publication number Publication date
KR20000069904A (ko) 2000-11-25
US20020062923A1 (en) 2002-05-30
TW565601B (en) 2003-12-11
CA2276737A1 (en) 1998-07-16
ATE238397T1 (de) 2003-05-15
EP0950082A1 (de) 1999-10-20
AU5623798A (en) 1998-08-03
JP2001508483A (ja) 2001-06-26
CN1245520A (zh) 2000-02-23
CN1105160C (zh) 2003-04-09
MY132841A (en) 2007-10-31
EP0950082A4 (de) 2000-07-12
EP0950082B1 (de) 2003-04-23
WO1998030647A1 (en) 1998-07-16
DE69721309D1 (de) 2003-05-28
DE69721309T9 (de) 2005-03-10

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8339 Ceased/non-payment of the annual fee